High temperature flow behaviors of AISI 4340 steel were investigated using isothermal compression tests under the temperature range from 850 to $1100^{\circ}C$ and a strain rate from 0.01 to $10s^{-1}$. The flow stress decreased with increasing compression temperature and decreasing strain rate. The dynamic softening related to the dynamic recrystallization was observed during hot deformation. The constitutive model based on Arrheniustyped equation with the Zener-Hollomon parameter was used to simulate the hot deformation behavior of AISI 4340 steel. The modification of the Zener-Hollomon parameter and lnA parameter resulted in the improvement of the calculation accuracy of the proposed constitutive model compared with the experimental flow curves. In addition, the process map of AISI 4340 steel was proposed. The instable process condition for hot deformation was predicted and its reliability was verified with the experimental observation.

The microstructure of a high-carbon and high-chromium cast steel (HK700) for cold-work die inserts was analyzed by advanced scanning electron microscopy. A continuous network of primary $M_7C_3$ carbide was developed among austenitic matrix after casting. A small amount of $M_2C$ was added to the carbide network owing to the enrichment of Mo and W during the solidification. After quenching in which the austenitization was performed at $1030^{\circ}C$ and double tempering at $520^{\circ}C$, the network structure of $M_7C_3$ was preserved while most of the matrix was transformed to martensite because of additional carbide precipitation. The $M_2C$ in the as-cast microstructure was also transformed to $M_6C$ due to its instability. The continuous network of coarse carbides owing to the absence of hot-working had little influence on the hardness after quenching and tempering, whereas it resulted in severe brittleness upon flexural loading.

In this study, failure behavior of piercing plug for seamless tube manufacturing process was studied. Three different kinds of passed piercing plugs (10, 90, 215 times) were prepared. The shape deformation of the passed piercing plugs was observed by 3D coordinate measuring machine, and the oxidized layer on the surface of piercing plug was observed by optical microscopy. The length reduction of piercing plug presented at 215 times passed plug. It was found that the oxidized layer consisted of outer scale, inner scale and internal oxidation layers, and the inner scale layer had vertical cracks, and interfaces had horizontal cracks. We proposed the failure mechanism of piercing plug during seamless tube manufacturing process based on the formation of vertical and horizontal crack.

The effect of austenitizing temperature on the degree of carbides re-solutionizing, mean graine size, hardness and the volume fraction of retaind austenite ($V_{\gamma}$) etc., has been studied by means of metallography, X-ray diffractometry and hardness measurement in STD 11 tool steel. As austenitizing temperature increases, the amount of alloying elements which is re-dissolved into matrix increases, resulting in increase of $V_{\gamma}$, due to the chemical stabilization of austenite. The Vickers hardness value decreases with increasing austenitizing temperature, which is attributed to grain size as well the volume fractions of $V_{\gamma}$ and carbides. Theoretical diffraction intensity of (200) ${\alpha}^{\prime}$, (211) ${\alpha}^{\prime}$ (200) ${\gamma}$ and (220) ${\gamma}$ peaks obtained by $CuK_{\alpha}$ chracteristics X-ray (${\lambda}=0.15429nm$) was calculated, and quantitative analysis of $V_{\gamma}$ could be carried out by X-ray diffraction method. The resultant value is well coincided with the value obtained by image analysis method. When the quenched specimen is tempered above $200{\sim}400^{\circ}C$ for 30 min, the transition carbides i.e., MC and $M_2C$ in the size of about 20 nm begin to precipitate at $300^{\circ}C$.

Recently sapphire wafer has expected as smart phone cover material, however, brittle nature of sapphire needed edge grinding processes to prevent early initiation of cracks. Electro-deposited multi-layered groove tools with $35{\mu}m$ diamond particles were studied for sapphire wafer grinding. Solid particle flow behaviors in agitated electrolyte was studied using PIV(Particle Image Velocimetry), and uniform particle distribution in Ni bond were obtained when agitating impeller was located lower part of electrolyte. Hardness values of $400{\pm}50Hv$ were maintained for retention of diamond particles in electro-deposited bond layer. Sapphire wafer edge grinding test was carried out and multi-layered $160{\mu}m$ thick diamond tool showed much greater grinding capabilities up to 2000 sapphire wafers than single-layered $50{\mu}m$ thick diamond electro-deposited tools of 420 wafers. The reason why 3 times thicker multi-layered tools than single-layered tools showed 5 times longer tool lives in grinding processes was attributed to self-dressed new diamond particles in multi-layered tools, and multi-layered diamond tools could be promising for sapphire grinding.