The effect of varying amounts of graphite and $TiB_2$ on the electrical conductivity of composite bipolar plates was systematically studied. In this study, Titanium diboride ($TiB_2$) which has a high electrical conductivity, was selected as a filler and a additive material instead of conventional graphite. For proper distribution of the filler and matrix materials, ball milling using alumina balls was conducted for 1h, and then the hot press method was applied for the preparation of composite samples. The results showed a rapid increase in the electrical conductivity of composite bipolar plates at the critical filler content. However, $TiB_2$ and graphite composite bipolar plates showed similar increases in the electrical conductivity even though $TiB_2$ has a higher electrical conductivity than graphite. In addition, it was also found that a small addition of $TiB_2$ to graphite filler could be very effective for increasing the electrical conductivity and flexural strength of the composite bipolar plate.

IGZO thin films were prepared by radio frequency (RF) magnetron sputtering on glass substrates and then annealed in vacuum for 30 minutes at 100, 200 and $300^{\circ}C$, respectively. The thickness of films kept at 100 nm by controlling the deposition rate. While the optical transmittance and sheet resistance of as deposited films were 91.9% and $901{\Omega}/{\Box}$, respectively, the films annealed at $300^{\circ}C$ show the optical transmittance of 95.4% and the sheet resistance of $383{\Omega}/{\Box}$. The experimental results indicate that vacuum-annealed IGZO film at $300^{\circ}C$ is an attractive candidate for the transparent thin film transistor (TTFT) in large area electronic applications.

In order to make clear relationship between high temperature tensile properties and fine microstructure of rapidly solidified cast-type Ni-base superalloys without heat treatment required for consolidation process, tensile test was carried out by changing strain rate from $5{\times}10^{-5}s^{-1}$ to $2{\times}10^{-2}s^{-1}$ and test temperature from $900^{\circ}C$ to $1050^{\circ}C$ using IN738LC and Rene'80 melt-spinning ribbons by twin roll process which were superior to ribbons by single roll process from the viewpoint of structure homogeneity. The dependence of tensile strength on strain rate and test temperature was studied and strain rate sensitivity, m, were estimated from tensile test results. From this study, it was found that tensile strength was influenced by ${\gamma}^{\prime}$ particle diameter, test temperature and strain rate, and m of ribbons exhibited above 0.3 over $950^{\circ}C$.

The influences of small amount of Sn addition on microstructure and creep resistance of AZ91-0.4%Ca alloy have been investigated. The microstructure of the AZ91-0.4%Ca alloy was characterized by ${\alpha}$-(Mg) dendrite cells surrounded by eutectic ${\beta}(Mg_{17}Al_{12})$ and $Al_2Ca$ phases. The 0.5%Sn addition resulted in the formation of rod-shaped CaMgSn particles with the extinction of $Al_2Ca$. The Sn-containing alloy exhibited better creep resistance below $175^{\circ}C$, but the tendency was reversed above $200^{\circ}C$. The reason was discussed in relation to the change in thermal stability of ${\beta}$ phase in response to the Sn addition.

The gear was made of SNC815 case-carburized, quench hardened and tempered steel. The gears were failed far earlier than the expected service life used in the industrial site. Causes of the failed gear were analyzed by microstructure observation. By the SEM and micro structure examinations, the damaged surfaces had been weared and failed by fatigue. Through microscope observation on the damaged surface, it was found that the cause of failure was determined by external overloading and the initial stage of the damage was closely related to complex contact fatigue failure. The overload and contact fatigue contributed to the early failure cause.