This study is about laser welded joints in order to replace the traditional screw connection of a differential gear and its case in the differential gear assembly. Screws are usually used to join these parts. But the screws take up weight and space. So we needed to improve the joining method. In the welding of a differential gear and its case, the quality is much harder to control, because the high carbon contents of the two components results in cold cracks. But a new method that adds wire allows these materials to be joined. Additionally, more distortions generally occurs in the welded joints than in screws. We tried to prove that laser welding is an available method for joining these parts through the measurement and various tests.

The solar panel that consists of copper plate and copper tube was successfully welded by ultrasonic seam welding. However it was not only expensive the copper material but also ultrasonic welding has many problem such as high error rate, difficulty of dissimilar material welding, noise, etc. At this study, the laser welding of solar panel with aluminum plate instead of copper. The welding were carried out with the pulsed Nd:YAG laser and the weld bead geometry was measured with the variation of pulse energy. Consequently, there was no difference between the ultrasonic and the laser welding on the performance of heat transfer capacities. Also the formation of intermetalic compound such as CuAl2 was increased with the pulse energy.

The advantage of using lasers for through silicon via (TSV) drilling is that they allow higher flexibility during manufacturing because vacuums, lithography, and masks are not required; furthermore, the lasers can be applied to metal and dielectric layers other than silicon. However, conventional nanosecond lasers have disadvantages including that they can cause heat affection around the target area. In contrast, the use of a picosecond laser enables the precise generation of TSVs with a smaller heat affected zone. In this study, a comparison of the thermal and crystallographic defect around laser-drilled holes when using a picosecond laser beam with varing a fluence and repetition rate was conducted. Notably, the higher fluence and repetition rate picosecond laser process increased the experimentally recast layer, surface debris, and dislocation around the hole better than the high fluence and repetition rate. These findings suggest that even the picosecond laser has a heat accumulation effect under high fluence and short pulse interval conditions. To eliminate these defects under the high speed process, the CDE (chemical downstream etching) process was employed and it can prove the possibility to applicate to the TSV industry.

In this work, we have studied on time-resolved transient reflective image of single crystalline Si surface after single-shot fs-laser irradiation with varying the laser fluence under two different laser spot sizes. The temporal profiles of transient reflectivity changes as well as its maximum values at the early delay time were found to be strongly dependent on both the laser beam spot size and laser fluence. We have interpreted the dependence of transient reflectivity changes on the laser spot size in terms of a relaxation of the generated free carriers to the bulk silicon, which should be interacted with the plasma.