We proposed new light guide panel (LGP) fabrication method exploiting laser-processed inner scatterers and surface pattern. The proposed method has achieved LGP performance improvement in both brightness and uniformity. The inner scatterers and surface pattern of grid type were fabricated with a 2nd harmonic Nd:YAG pulse laser engraving system and a $CO_2$ laser scanning system, respectively. In the implementation of LGP, inner scatterers was arranged in accordance with linear or curved pattern with changing density and surface pattern was engraved on the surface of an inner-scatterers embedded LGP. The increase of scatterers' density and the use of surface patterns in both linear and curved pattern provided high luminance and uniformity enhancement. While thecurved pattern incorporated with increased scatterers' density and surface patterns yielded brightness improvement with preserving good uniformity, the linear pattern showed highly localized brightness near the light entrance of the LGP. We can also observe that the uniformity was mainly determined by pattern of inner scatterers, and the brightness was improved by the higher density and the utilization of surface patterns. From the results, the use of laser-processed inner and surface patterns can be a potential alternative for efficient and simple LGP fabrication method.

Decapsulation technology is useful to inspect EMC of package device and the etching technology enable to check inside of device by removing plastic molding. Chemical etching method is used widely to fabricate a lot of semiconductor. But the method has some disadvantage due to wet process. Proposed method in this paper shows the application possibility such as fast processing time, processing accuracy and dry process. These result was obtained by directly removing of packed EMC using UV laser.

Laser micromachining is a promising technique to fabricate the micro-scale devices. However, there remains important challenges to reducethe redeposition of ablated materials around the laser irradiated zone and to get a smooth surface, especially for metal and semiconductor materials. To achieve the high-quality micromachined devices, various methods have been developed. Liquid-assisted micromachining can be a good solution to overcome the previously mentioned problems. During the laser ablation process, the liquid around the solid sample dramatically changes the ablation characteristics, such as ablation rate, surface profile, formation of debris, and so on. In this investigation, we conducted the laser micromachining of Si in various liquid environmental conditions, such as liquid types, liquid thickness. In addition, using nanoscale time-resolved shadowgraphy technique, we observed the ablation process in liquid environments to understand the mechanism of liquid-assisted laser micromachining.

It has been recognized that laser dicing of wafers results in low mechanical strength compared to the conventional sawing techniques. Thermal shock generated by rapid thermal loading is responsible for this problem. This work presents a two-dimensional ultra-short thermo elastic model for numerical simulation of femtosecond laser ablation of metals in the high-fluence regime where the phase explosion is dominant. Laser-induced thermoelastic stress is analyzed for Ni. The results show that the laser-induced thermal shock is large enough to induce mechanical damages.

The characteristics of femtosecond laser ablation of $Al_2O_3$ for prescision microfabrication are studied experimentally. Specifically, the process time during femtosecond laser drilling of microholes with $sub-100{\mu}m$ diameter are investigated for varying laser fluence, scan speed and beam path designs like trepanning with continuously changed start points. The accumulation of sub-micrometer size particles within the hole and the deterioration of edge clarity and roundness for decreasing hole diameter are examined and through process optimization the microdrilling with good hole quality is achieved using a femtosecond laser system (repetitionrate 1 kHz, wavelength 785 nm, pulse duration 185 fs)

In the remote welding system using $CO_2$ laser, laser beam can be rapidly transferred to a workpiece by moving mirrors of scanner system. So, it makes reducing the cycle time of welding process. We can also use and apply various patterns of weld beads by linear controlled mirrors. But most of the domestic car makers have usually applied use stitch-shaped weld bead. In that case, we don't have the merit of remote welding system efficiently. Therefore, in this paper, we investigated the characteristic of weld strength according to patterns of weld bead on $CO_2$ laser welding. And we also studied the relationship between shape of weld bead and value of tensile load.