• Design & Manufacturing
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• v.9 no.2
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• pp.16-19
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• 2015

In this paper, The experimental study on the crack during press forming of the door latch assembly for a vehicle door is performed. Length to be inserted into the conventional mold upper die punch is 20 mm, wherein the cracks are generated on the product surface and causes a secondary quality problem. In this study, the length to be inserted in the mold upper die punch 0 mm, 10 mm, 20 mm, which was changed to perform the experiment. Through the experiment, the length inserted into the mold can be seen that the upper die punch of the press forming conditions optimized when the 0 mm.

• Journal of IKEEE
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• v.26 no.2
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• pp.196-204
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• 2022

Electrostatic discharge (ESD) protection devices of P-type embedded silicon-controlled rectifier (PESCR) structure were analyzed for high-voltage operating input/output (I/O) applications. Conventional PESCR standard device exhibits typical SCR characteristics with very low-snapback holding voltages, resulting in latch-up problems during normal operation. However, the modified device with the counter pocket source (CPS) surrounding N⁺ source region and partially formed P-well (PPW) structures proposed in this study could improve latch-up immunity by indicating high on-resistance and snapback holding voltage.

• Journal of the Korean Society of Industry Convergence
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• v.5 no.1
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• pp.39-43
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• 2002

In present much CMOS devices used in VLSI circuit and Logic circuit. With increasing a number of device in VLSI, the confidence becomes more serious. This paper describe the mechanism of breakdown on CMOS, especially n-MOS, based on Hydro Dynamic model with device self-heating. Additionally, illustrate the CMOS latch-up characteristics on simplified device structure on this paper.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.5
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• pp.212-221
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• 1996

A CMOS comparator is designed for low voltage and low power operations. The proposed comparator consists of a preadmplifier followed by a regenerative latch. The preasmplifier reduces the power consumption to a half with the power-down mode and the dynamic offsets of the latch, which is affected by each device mismatch, is statistically analyzed. The circuit is designed and simulated using a 0.8.mu.m n-well CMOS process and the dissipated power is 0.16mW at a 20MHz clock speed based on a 3V supply.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.385-388
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• 2003

In this paper, a D-Latch is replaced by a memory cell on the proposed PFD to improve response tine by reducing reset me. The PFD has been simulated using HSPICE with a Hynix 0.35um CMOS process to prove the performance improvement.

• Journal of IKEEE
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• v.11 no.1 s.20
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• pp.54-60
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• 2007

In this study novel ESD protection device, namely, N/P-type Low Voltage Triggered SCR, has been proposed, for high speed I/O interface. Proposed device could lower high trigger voltage($\sim$20V) of conventional SCR and reduce latch-up phenomenon of protection device during the normal condition. In this Study, the proposed NPLVTSCR has been simulated using TMA MEDICI device simulator for electrical characteristic. Also the proposed device's test pattern was fabricated using 90nm TSMC's CMOS process and was measured electrical characteristic and robustness. In the result, NPLVTSCR has 3.2V $\sim$ 7.5V trigger voltage and 2.3V $\sim$ 3.2V holding voltage by changing PMOS gate length and it has about 2kV, 7.5A HBM ESD robustness(IEC61000-4-2).

• The Journal of Korean Institute of Communications and Information Sciences
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• v.33 no.11C
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• pp.963-969
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• 2008

This paper presents 6bit 100MHz Interpolation Flash Analog-to-Digital Converter, which can be applied to the Receiver of Wireless Tele-communication System. The 6bit 100MHz Flash Analog-to-Digital Converter simplifies and integrates S-R latch which multiplies as the resolution increases. Whereas the conventional NAND based S-R latch needed eight MOS transistors, this Converter was designed with only six, which makes the Dynamic Power Dissipation of the A/D Converter reduced up to 12.5%. The designed A/D Converter went through $0.18{\mu}m$ CMOS n-well 1-poly 6-metal process to be a final product, and the final product has shown 282mW of power dissipation with 1.8V of Supply Voltage, 100MHz of conversion rate. And 35.027dBc, 31.253dB SFDR and 4.8bits, 4.2bits ENOB with 12.5MHz, 50MHz of each input frequency.

• The Journal of the Convergence on Culture Technology
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• v.6 no.2
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• pp.515-520
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• 2020

CMOS used in digital circuit design technology has reached the limit of integration due to quantum tunneling. Quantum-dot cellular automata (QCA), which can replace this, has many advantages such as low power consumption and fast switching speed, so many digital circuits of CMOS have been proposed based on QCA. Among them, the multiplexer is a basic circuit used in various circuits such as D-flip-flops and resistors, and has been studied a lot. However, the existing multiplexer has a disadvantage that space efficiency is not good. Therefore, in this paper, we propose a new multilayered multiplexer using cell interaction and D-latch using it. The multiplexer and D-latch proposed in this paper have improved area, cell count, and delay time, and have excellent connectivity and scalability when designing large circuits. All proposed structures are simulated using QCADesigner to verify operation.

• Journal of IKEEE
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• v.25 no.2
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• pp.376-380
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• 2021

In this paper, we propose a novel ESD protection device with Latch-up immunity properties due to high holding voltages by improving the structure of a typical SCR. To verify the characteristics of the proposed ESD circuit, simulations were conducted using Synopsys TCAD and presented compared to existing ESD protection circuits. Furthermore, the variation of electrical properties was verified using the design variable D1. Simulation results confirm that the proposed ESD protective circuit has higher holding voltage properties and bidirectional discharge properties compared to conventional ESD protective circuits. We validate the electrical properties with post-design TLP measurements using Samsung's 0.13um BCD process. And we verify that the proposed ESD protection circuit in this paper is well suited for high voltage applications in that it has a latch-up immunity due to improved holding voltage through optimization of design variables.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.4
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• pp.490-494
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• 2014

In this paper, a design of high-speed power-off circuit and analysis. The incidence of high-dose transient radiation into the silicon-based semiconductor element induces the photocurrent due to the creation of electron-hole pairs, which causes the upset phenomenon of active elements or triggers the parasitic thyristor in the element, resulting in latch-up. High speed power-off circuit was designed to prevent burn-out of electronic device caused by Latch-up. The proposed high speed power-off circuit was configured with the darlington transistor and photocoupler so that the power was interrupted and recovered without the need for an additional circuit, in order to improve the existing problem of SCR off when using the thyristor. The discharge speed of the high speed power interruption circuit was measured to be 19 ${\mu}s$ with 10 ${\mu}F$ and 500 ${\Omega}$ load, which was 98% shorter than before (12.8 ms).