Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
The Korean Microelectronics and Packaging Society
- Semi Annual
Domain
- Electricity/Electronics > Electric and Electronic Components
2004.11a
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A flexible Packaging scheme, which embedded chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (
$t<50{\mu}m$ ) are fabricated by chemical etching process to avoid possible surface damages on them. These technologies can be use for a real-time monitoring of blood pressure. Our research targets are implantable blood pressure sensor and its telemetric measurement. By winding round the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessel. -
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