Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.51-51
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- 2004
(Morphological evolution of interfacial intermetallic compound with a variation of solder composition and soldering temperature)
솔더 조성 및 솔더링 온도에 따른 계면 화합물의 형상 변화
Abstract
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