Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.11a
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- Pages.3-4
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- 2004
Flexible wireless pressure sensor module
- Shin Kyu-Ho (MEMS Lab, Samsung Advanced Institute of Technology) ;
- Moon Chang-Ryoul (MEMS Lab, Samsung Advanced Institute of Technology) ;
- Lee Tae-Hee (School of Mechanical Engineering, Yonsei University) ;
- Lim Chang-Hyun (School of Mechanical Engineering, Yonsei University) ;
- Kim Young-Jun (School of Mechanical Engineering, Yonsei University)
- Published : 2004.11.01
Abstract
A flexible Packaging scheme, which embedded chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (