The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.

In this paper, we have designed and fabricated a receiver module for 5.8GHz Microwave Wireless Power Transmission. The receiver module was composed of an antenna, BPF (Band Pass Filter) and RF-DC converter. The antenna was designed to RHCP (Right Hand Circular Polarization). And we used ${\lambda}g/2$ open-circuited stubs for the BPF. In addition, the RF-DC converter used the tripler voltage circuit for voltage multipliers. The integrated receiver RF module for 5.8GHz Microwave Wireless Power Transmission has been designed and fabricated. The voltage was measured to the distance of 50cm.

In this paper, we measured the efficiency of the receiver for 5.8GHz Microwave Smartphone Charging. We have designed and fabricated 1W and 2W power amplifier, respectively. A 1W power amplifier used a TC3531 power device of TRANSCOM Inc. In addition, a 2W power amplifier using the two TC3531 devices was constructed with divider and combiner. We used the Wilkinson divider theory for divider and combiner. The voltage was measured using the 1W and 2W power amplifier and integrated receivers to the distance of 50cm.

In recent years, various researches have been conducted to improve process yields in accordance with miniaturization of semiconductor. APC(Advanced Process Control) is considered one of the methods to increase in process yields. APC is a process control technology that maintains optimal process conditions and improves the reliability of results by controlling and formulating the relationship among the various process parameters and results. We built up an optical diagnostic system with a three-channel spectrometer. The system detects signals those represent the changes of specific emission peaks intensity versus each reference and converts it into MFC control signals to get back the changes to the reference state. Controlling the MFC continues until the specific peak intensity changes into the normal state. Through this device, we tested a APC automatically responding to process changes during the plasma process. We could control gas flow while sputtering process on going and improve uniformity of plasma intensity with this system. Finally, we have got results those enhance the plasma intensity non-uniformity to 7.7% from 15.5%. Also, found unexpected oxygen flow what is estimated to be come out from IGZO target.

In this study, a new plasma source was used in the ALD process. Line type plasma sources were analyzed by electric and magnetic field simulation. And the results were compared with plasma density and electron temperature measurement results. As a result, the results of the computer simulation and the diagnosis results of plasma density and electron temperature showed similar tendency. At this time, the plasma uniformity is 95.6 %. $Al_2O_3$ thin film was coated on 6 inch Si-wafer, using this plasma source. The uniformity of the thin film was more than 98% and the thin film growth rate was 0.13 nm/cycle.

The 2 wt.% Al-doped ZnO(AZO) thin films were fabricated on PET substrates with various RF power 20, 35, 50, 65, and 80W by using RF magnetron sputtering in order to investigate the structure, electrical and optical properties of AZO thin films in this study. The XRD measurements showed that AZO films exhibit c-axis orientation. At a RF power of 80W, the AZO films showed the highest (002) diffraction peak with a FWHM of 0.42. At a RF power of 65W, the lowest electrical resistivity was about $1.64{\times}[10]$ ^(-4) ${\Omega}-cm$ and the average transmittance of all films including substrates was over 80% in visible range. Good transparence and conducting properties were obtained due to RF power control. The obtained results indicate that it is acceptable for applications as transparent conductive electrodes.

ITO/GZO double layered thin films were prepared on transparent glass substrates. Ga-doped ZnO(GZO) films were deposited by RF magnetron sputtering using an ZnO:Ga (98: 2 wt%) target. The post deposition annealing process was conducted for 30 minutes at different temperature of 100, 200, 300 and $400^{\circ}C$, respectively. As increase annealing temperature, ITO/GZO double layered thin films show the increment of the prefer orientation of ZnO diffraction peak (002) in the XRD patterns. We obtained Ga-doped ZnO thin films with a lowest resistivity of $1.84{\times}10^{-4}{\Omega}-cm$ at $400^{\circ}C$ and transparency above 80% in visible ranges. The figure of merit obtained in this study means that ITO/GZO double layered thin films which annealed at $400^{\circ}C$ have the highest optoelectrical performance in this study.

In this study, we have investigated the effect of the substrate temperature and hydrogen flow rate on the characteristics of IGZO thin films for the TCO(transparent conducting oxide). For this purpose, IGZO thin films were deposited by RF magnetron sputtering at room temperature and $300^{\circ}C$ with various $H_2$ flow rate. In order to investigate the influences of the hydrogen, the flow rate of hydrogen in argon mixing gas has been changed from 0.1sccm to 1.0sccm. IGZO thin films deposited at room temperature show amorphous structure, whereas IGZO thin films deposited at $300^{\circ}C$ show crystalline structure having an (222) preferential orientation. The electrical resistivity of the amorphous-IGZO films deposited at R.T. was lower than that of the crystalline-IGZO thin films deposited at $300^{\circ}C$. The increase of electrical resistivity with increasing substrate temperature was interpreted in terms of the decrease of the charge carrier mobility. The transmittance of the IGZO films deposited at $300^{\circ}C$ was decreased deposited with hydrogen gas.

Consumers who use mobile applications for their skin care are increasing due to increasing interest in skin care and smart phone use. A survey was conducted to select popular skin care mobile applications to be installed in the smart phone targeting 1,000 men and women in South Korea who are interested in their skin care. Questioned items included skin care awareness and recognition, skin care type, and the intention of using skin health care mobile services. The respondents thought the best skin as 'Flawless skin (52.3%)'. Also, 'Skin trouble' and 'Skin aging' were their major concerns. 47.1% of the respondents used mobile skin care applications, and 56.6% intended to try new mobile skin care services. The results on interesting field of skin care showed significant difference depending on gender, marital status, and annual average household income. Moreover, the results on effort made for skin care showed significant difference depending on age, gender, and marital status. They wanted the functions such as 'Review on cosmetic products by brand (23.8%)', 'Self skincare method (16.8%)', 'Continuous monitoring service (16.2%)', 'Information on cosmetic products (13.4%)'. The result of this study would be reliable as basic material for skincare mobile service area. Further studies could be focused on developing application in accordance with needs and how it should be applied.

This paper presents the implementation for a network structure of railway cars using a point to point communication. Most of network's representative specifications for a train are the FIP (Field Bus), MVB (Multifunction Vehicle Bus), CAN and WTB (Wire Train Bus) which is used by ALSOM, SIEMENS and BOMBADIER as major in this field. These networks in a physical layer use a multi-drop method, connected from $1^{st}$ car to $n^{th}$ car of a train through a cable without any extra services such as an electric part, amplifier. However waveforms which is passed through a long cable in the multi-drop are distorted by a capacitance or resistance of the cable or environments. Also since using a cable connected directly from $1^{st}$ car to $n^{th}$ car, if over two trains make double head, it isn't easy to distinguish ID for each railway cars. So by using the point to point network per each car, it is able to reduce a distortion. Also since reducing distortion, this communication speed can be been higher and transmit and receive any packets more stably. Using proposed token in a packet, this can make ID per each railway car automatically. Finally experimental results show the good performance and effectiveness of the proposed method.

In this study, the texturing and the emitter formation processes were carried out with the wafer adhesion method to increase the productivity and reduce the production cost of the multi-crystalline silicon solar cell. After fabricating $156{\times}156mm$ solar cell according to the wafer adhesion method, the operation characteristics were analyzed and compared with those of the solar cell fabricated by the standard process method. In the case of a solar cell formed by the wafer adhesion method, it showed Jsc of $32.87mA/cm^2$, Voc of 0.612V, FF of 78.04% and efficiency of 15.71% respectively. The efficiency of the solar cell formed by the wafer adhesion method was 0.1% higher than that of the solar cell formed by the standard method. In addition, the productivity of the texturing and the emitter formation processes is expected to be approximately doubled. Therefore, it is expected that the manufacturing cost of the multi-crystalline solar cell can be reduced due to the improved productivity compared with the standard process.

Contact pressure distribution between PVA brush and semiconductor wafer was measured by developing a test setup which could simulates the post CMP cleaning process. The test set-up used thin film type pressure sensor which could measure the pressure distribution of contact area with the resolution of $15.5ea/cm^2$. As the experimental results, it was verified that there had been severe contact pressure non-uniformity along the axis of the brush and between the adjacent projections on the brush's surface. These results should be considered when developing post CMP cleaning stage or designing the PVA brush.

For long life time and high efficiency, not necessary in improvement of LED chip structure, but also improve heat radiation for decrease heat in LED chip. In this study, efficiency decline factor has been investigated in LED lamp as study heat characteristic, luminance flux and heat resistance. When LED lamp temperature was increased, about 7% loss of luminance flux. In consequence of temperature analysis, width of fin was the most important factor of heat radiation. As a result, secure the enough heat path is very important factor of LED lamp design.

End milling is an important and common machining operation because of its versatility and capability to produce various profiles and curved surfaces. This paper presents an experimental study of the cutting force variations in the end milling of SM25C with HSS(high speed steel) and carbide tool. This paper involves a study of the Taguchi design application to optimize cutting force in a end milling operation. The Taguchi design is an efficient and effective experimental method in which a response variable can be optimized, given various control and noise factors, using fewer resources than a factorial design. This study included feed rate, spindle speed and depth of cut as control factors, and the noise factors were different cutting tool in the same specification. An orthogonal array of $L_9(3^3)$ of ANOVA analyses were carried out to identify the significant factors affecting cutting force, and the optimal cutting combination was determined by seeking the best cutting force and signal-to-noise ratio. Finally, confirmation tests verified that the Taguchi design was successful in optimizing end milling parameters for cutting force.

Although deregistration attack is caused by simple spoofing the REGISTER message of a legitimate SIP UA, its impact is serious. The root cause of this attack is based on the fact that RFC 3261 allows the UA to remove the binding from the Location Server. In this paper, we propose a simple protection method to allow Registrar or Location Server just to ignore deregistration messages. We also show that this method works well by analyzing the process of registration and deregistration. Without any additional overhead such as an encryption or authentication, this method is able to establish a secure SIP environment efficiently protecting against the deregistration attack.

Image stitching is a process of combining two or more images with overlapping area to create a panorama of input images, which is considered as an active research area in computer vision, especially in the field of augmented reality with 360 degree images. Image stitching techniques can be categorized into two general approaches: direct and feature based techniques. Direct techniques compare all the pixel intensities of the images with each other, while feature based approaches aim to determine a relationship between the images through distinct features extracted from the images. This paper proposes a novel image stitching method based on feature pixels with approximated clustering filter. When the features are extracted from input images, we calculate a meaning of the minutiae, and apply an effective feature extraction algorithm to improve the processing time. With the evaluation of the results, the proposed method is corresponding accurate and effective, compared to the previous approaches.

3D technology is main factor in Augmented Reality. Depth map is essential to make cubic effect using 2d image. There are a lot of ways to construct Depth map. Among them, stereo matching is mainly used. This paper presents how to generate depth map using stereo matching. For stereo matching, existing Dynamic programming method is used. To make accurate stereo matching, High-Boost Filter is applied to preprocessing method. As a result, when depth map is generated, accuracy based on Ground Truth soared.