• Title/Summary/Keyword: high thermal conductivity

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High Thermal Conductivity h-BN/PVA Composite Films for High Power Electronic Packaging Substrate (고출력 전자 패키지 기판용 고열전도 h-BN/PVA 복합필름)

  • Lee, Seong Tae;Kim, Chi Heon;Kim, Hyo Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.95-99
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    • 2018
  • High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and graphene, recently. Among them, hexagonal-boron nitride (h-BN) nano-sheet is a promising candidate for high thermal conductivity with electrically insulating filler material. This work presents an enhanced heat transfer properties of ceramic/polymer composite films using h-BN nano-sheets and PVA polymer resins. The h-BN nano-sheets were prepared by a mechanical exfoliation of h-BN flakes using organic media and subsequent ultrasonic treatment. High thermal conductivities over $2.8W/m{\cdot}K$ for transverse and $10W/m{\cdot}K$ for in-plane direction of the cast films were achieved for casted h-BN/PVA composite films. Further improvement of thermal conductivity up to $13.5W/m{\cdot}K$ at in-plane mode was achieved by applying uniaxial compression at the temperature above glass transition of PVA to enhance the alignment of the h-BN nano-sheets.

Effect of High Energy Ball Milling on Sintering Behavior and Thermal Conductivity of Direct Nitrided AlN Powder (직접질화법 AlN 분말의 소결거동 및 열전도도에 미치는 고에너지 볼밀링 효과)

  • Park, Hae-Ryong;Kim, Hyung-Tae;Lee, Sung-Min;Kim, Young-Do;Ryu, Sung-Soo
    • Journal of the Korean Ceramic Society
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    • v.48 no.5
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    • pp.418-425
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    • 2011
  • In this study, a high energy ball milling process was introduced in order to improve the densification of direct nitrided AlN powder. The sintering behavior and thermal conductivity of the AlN milled powder was investigated. The mixture of AlN powder and 5 wt% $Y_2O_3$ as a sintering additive was pulverized and dispersed by a bead mill with very small $ZrO_2$ bead media. The milled powders were sintered at $1700^{\circ}C-1800^{\circ}C$ for 4 h under $N_2$ atmosphere. The results showed that the sintered density was enhanced with increasing milling time due to the particle refinement as well as the increase in oxygen contents. Appropriate milling time was effective for the improvement of thermal conductivity, but the extensive millied powder formed more fractions of secondary phase during sintering, resulted in the decrease in thermal conductivity. The AlN powder milled for 10min after sintering at $1800^{\circ}C$ revealed the highest thermal conductivity, of 164W/$m{\cdot}K$ in tne densified AlN sintered at $1800^{\circ}C$.

Sputtering of Multifunctional AlN Passivation Layer for Thermal Inkjet Printhead

  • Park, Min-Ho;Kim, Sang-Ho
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.50-50
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    • 2011
  • The aluminum nitride films were prepared by RF magnetron sputtering using an AlN ceramic target. The crystallinity, grain size, Al-N bonding and thermal conductivity were investigated in dependence on the plasma power densities (4.93, 7.40, 9.87 W/$cm^2$) during sputtering. High thermal conductivity is important properties of A1N passivation layer for functioning properly in thermal inkjet printhead. The crytallinity, grain size, Al-N bonding formation and chemical composition were observed using X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS), respectively. The AlN thin film was changed from amorphous to crystalline as the power density was increased, and the largest grain size appeared at medium power density. The near stoichiometry Al-N bonding ratio was acquired at medium power density. So, we know that the AlN thin film had better thermal conductivity with crystalline phase and near stoichometry Al-N bonding ratio at 7.40 W/$cm^2$ power density.

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Thermal Stress Analysis of STS VOD Ladle according to the reinforcement of back filler (Back Filler의 보강에 따른 STS VOD 래들의 열응력 해석)

  • Lee, S.W.;Ham, K.C.;Bae, S.I.;Song, J.I.
    • Proceedings of the KSME Conference
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    • 2000.11a
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    • pp.310-315
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    • 2000
  • We analyzed thermal stress of the STS VOD ladle by the variation of material property of refractory, and determined the location of back filler using FE analysis. Thermal distribution of refractory of ladle between hot face and back face were decreased by the increasing the thermal conductivity, and thermal stress of refractory were decreased about 2 to 4 times with the decreasing the young's modulus coefficients. Back filler, which is constructed to absorb the thermal expansion of dolomite refractory, has relatively low thermal conductivity. Inner side of refractory of ladle maintained high temperature, but temperature of outer side of ladle decreased low. Consequently, inner expansion and outer contraction were appeared. and thermal stress were increased, so thermal stress by the construction of back filler were increased.

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High Thermal Conductive Natural Rubber Composites Using Aluminum Nitride and Boron Nitride Hybrid Fillers

  • Chung, June-Young;Lee, Bumhee;Park, In-Kyung;Park, Hyun Ho;Jung, Heon Seob;Park, Joon Chul;Cho, Hyun Chul;Nam, Jae-Do
    • Elastomers and Composites
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    • v.55 no.1
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    • pp.59-66
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    • 2020
  • Herein, we investigated the thermal conductivity and thermal stability of natural rubber composite systems containing hybrid fillers of boron nitride (BN) and aluminum nitride (AlN). In the hybrid system, the bimodal distribution of polygonal AlN and planar BN particles provided excellent filler-packing efficiency and desired energy path for phonon transfer, resulting in high thermal conductivity of 1.29 W/mK, which could not be achieved by single filler composites. Further, polyethylene glycol (PEG) was compounded with a commonly used naphthenic oil, which substantially increased thermal conductivity to 3.51 W/mK with an excellent thermal stability due to facilitated energy transfer across the filler-filler interface. The resulting PEG-incorporated hybrid composite showed a high thermal degradation temperature (T2) of 290℃, a low coefficient of thermal expansion of 26.4 ppm/℃, and a low thermal distortion parameter of 7.53 m/K, which is well over the naphthenic oil compound. Finally, using the Fourier's law of conduction, we suggested a modeling methodology to evaluate the cooling performance in thermal management system.

A Comparison of Laser Flash and the Divided-bar Methods of Measuring Thermal Conductivity of Rocks (암석 열전도도 측정을 위한 Laser Flash Method와 Divided-bar Method 비교)

  • Oh, Jae-Ho;Kim, Hyoung-Chan;Park, Jeong-Min
    • Economic and Environmental Geology
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    • v.44 no.5
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    • pp.387-397
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    • 2011
  • In this study, we conducted the study of the merits and demerits of the laser flash and the divided-bar methods for measuring the thermal conductivity of rocks and investigated applicability of the divided-bar apparatus which was developed by KIGAM. The laser flash method can measure thermal diffusivity, specific heat capacity, and thermal conductivity of rocks with even small thickness (< ~3 mm) in the high temperature range($25-200^{\circ}C$) in non-contact mode. For the laser flash method, samples must be uniform and homogeneous. In the case of the divided-bar method, the apparatus measures only thermal conductivity of rock samples at the room temperature. We measured thermal conductivities of 12 rock samples with low density and high porosity using two methods. In the laser flash method, there exist potential errors caused by the effect of pulse dispersion and reflection by various minerals and porosity in rock samples; the difference in thermal conductivity values measured on the front surface and the opposite surface ranges from 0.001 to 0.140 W/mK with the standard deviation of 0.003~0.089 W/mK, which seems to be caused by heterogeneity of rock samples. On the contrary, the divided-bar apparatus shows stable thermal conductivity measurements and relatively small measurement errors; the difference in thermal conductivity values, just as we applied to the laser frash method, is 0.001~0.016 W/mK with the standard deviation 0.001~0.034 W/mK. In turn, the divided-bar method can be applied to more thick samples that are more representative of bulk thermal conductivity.

Study on physical characteristic of Graphite-added grout for backfilling cloed-loop groud heat exchanger (흑연(Graphite) 첨가를 통한 수직 밀폐형 지중열교환기 뒤채움재의 열전도 특성 향상 연구)

  • Lee, Kang-Ja;Gil, Hu-Jeong;Lee, Chul-Ho;Choi, Hang-Seok;Choi, Hyo-Pum
    • 한국신재생에너지학회:학술대회논문집
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    • 2009.06a
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    • pp.579-582
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    • 2009
  • The thermal conductivity and viscosity(or workability) of graphite-added bentonite grouts and cementitious grouts have been evaluated and compared to determine the suitability of these materials for backfilling vertical boreholes of ground heat exchangers. Seven bentonite grouts from different product sources and a portland cement grout with various mixture ratios were considered in this paper. As a new additive for grout, we choose graphite which has high thermal conductivity. The bentonite grouts indicate that the thermal conductivity and viscosity increase with the content of bentonite or with an addition of Graphite compared with that of silica sand. In case of cementitious grout also increase the thermal conductivity and decrease the workability dramatically though an addition of Graphite. Therefore, we cautiously select the amount of graphite and mixture ratio of bentonite and cement considering not only thermal conductivity but also viscosity for the optimum condition of backfilling material.

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A Study on Thermal Conductivity Characteristics of Nanofluids (나노유체 열전도도 특성 연구)

  • Hwang, Yu-Jin;Park, Jae-Hong;Kim, Hong-Suk;Lee, Jae-Keun
    • Proceedings of the SAREK Conference
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    • 2006.06a
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    • pp.162-167
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    • 2006
  • Nanofluid is a kind of new engineering material consisting of nanoparticles dispersed in base fluid. Nanofluids could have various applications such as magnetic fluids, heat exchanger working fluids, lubricants, drug delivery and so on in present study, various nanoparticles, such as MWCNT (Multi-walled Carbon Nanotube), fullerene, copper oxide, and silicon dioxide are used to produce nanofluids. As base fluids, DI-water, ethylene glycol, oil, and silicon oil are used. To investigate the thermo-physical properties of nanofluids, thermal conductivity and kinematic viscosity are measured. Stability estimation of nanofluid is conducted with UV-vis spectrophoto-meter. In this study, the high pressure homogenizer is the most effective method to produce nanofluid with the prepared nanoparticle and base fluid. Excellently stable nanofluids are produced with the magnetron sputtering system. Thermal conductivity of nanofluid increases with increasing particle volume fraction except water-based fullerene nanofluid which has lower thermal conductivity than base fluid due to its lower thermal conductivity, 0.4 W/mK. The experimental results can't be predicted by Jang and Choi model.

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Enhanced thermal conductivity of spark plasma-sintered thorium dioxide-silicon carbide composite fuel pellets

  • Linu Malakkal;Anil Prasad;Jayangani Ranasinghe;Ericmoore Jossou;Lukas Bichler;Jerzy Szpunar
    • Nuclear Engineering and Technology
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    • v.55 no.10
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    • pp.3725-3731
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    • 2023
  • Thorium dioxide (ThO2)-silicon carbide (SiC) composite fuel pellets were fabricated via the spark plasma-sintering (SPS) method to investigate the role of the addition of SiC in enhancing the thermal conductivity of ThO2 fuel. SiC particles with an average size of 1㎛ in 10 and 15 vol% were used to manufacture the composite pellets. The changes in the composites' densification, microstructure and thermal conductivity were explored by comparing them with pure ThO2 pellets. The structural and microstructural characterization of the composite pellets has revealed that SPS could manufacture high-quality composite pellets without having any reaction products or intermetallic. The density measurement by the Archimedes principles and the grain size from the electron back-scattered diffraction (EBSD) analysis has indicated that the composites have higher densities and smaller grain sizes than the pellets without SiC addition. Finally, thermal conductivity as a function of temperature has revealed that sintered ThO2-SiC composites showed an increase of up to 56% in thermal conductivity compared to pristine ThO2 pellets.

Thermal and mechanical properties of C/SiC composites fabricated by liquid silicon infiltration with nitric acid surface-treated carbon fibers

  • Choi, Jae Hyung;Kim, Seyoung;Kim, Soo-hyun;Han, In-sub;Seong, Young-hoon;Bang, Hyung Joon
    • Journal of Ceramic Processing Research
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    • v.20 no.1
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    • pp.48-53
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    • 2019
  • Carbon fiber reinforced SiC composites (C/SiC) have high-temperature stability and excellent thermal shock resistance, and are currently being applied in extreme environments, for example, as aerospace propulsion parts or in high-performance brake systems. However, their low thermal conductivity, compared to metallic materials, are an obstacle to energy efficiency improvements via utilization of regenerative cooling systems. In order to solve this problem, the present study investigated the bonding strength between carbon fiber and matrix material within ceramic matrix composite (CMC) materials, demonstrating the relation between the microstructure and bonding, and showing that the mechanical properties and thermal conductivity may be improved by treatment of the carbon fibers. When fiber surface was treated with a nitric acid solution, the observed segment crack areas within the subsequently generated CMC increased from 6 to 10%; moreover, it was possible to enhance the thermal conductivity from 10.5 to 14 W/m·K, via the same approach. However, fiber surface treatment tends to cause mechanical damage of the final composite material by fiber etching.