Fig. 1. Schematic illustration of high power LED package.
Fig. 2. Schematic illustration of transverse mode (Kz) and inplane mode (Kxy) thermal conductivities (a) for single h- BN particle, (b) and (c) for h-BN/PVA composite film.
Fig. 4. TG/DSC data of PVA for the compression of h-BN/PVA composite film.
Fig. 5. Effect of compression on the thermal conductivity of h-BN/PVA composites: (a) transverse mode and (b) in-plane mode.
Fig. 7. FE-SEM micro-images of (a) un-compressed and (b)compressed 40 vol% h-BN/PVA composite films (cross-sectional view).
Fig. 3. (a) Transverse mode (Kz) and (b) in-plane mode (Kxy) thermal conductivities of h-BN/PVA composite films with h-BN filler contents.
Fig. 6. (a) Schematic illustration of few layered h-BN nanosheet powder and (b) XRD patterns of h-BN/PVA composite films with and without compression.
References
- A. Miric, and P. Dietric, "Inorganic substrates for power electronics applications" Heraeus Deutschland GmbH and Co., KG 63450 Hanau Germany, (March 2015) from https://www.heraeus.com
- H. E. Dehaghani, and M. Nazempour, "Smart Nanoparticles Technology", Abbass Hashim, Eds., pp.520-540, IntechOpen, London (2012).
- H. T. Kim, "High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging", in Heat Transfer-Models, Methods and Applications, Konstantin Volkov, Eds., pp.333-359, IntechOpen, London (2018).
- H. W. Shin, H. S. Lee, J. H. Bang, S. H. Yoo, S. B. Jung, and K. D. Kim, "Variation of Thermal Resistance of LED Module Embedded by Thermal Via", J. Microelectr. Packag. Soc., 17(4), 95 (2010).
- J. G. Kim, J. Y. Jeong, J. H. Ju, S. H. Park, and Y. R. Cho, "Thermal Properties of Two-Layered Materials Composed of Dielectric Layer on Metallic Substrate along the Thickness Direction", J. Microelectron. Packag. Soc., 23(4), 87 (2016). https://doi.org/10.6117/kmeps.2016.23.4.087
- S. Kemaloglu, G. Ozkoc, and A. Aytac, "Thermally Conductive Boron Nitride/SEBS/EVA Ternary Composites: Processing and Characterization", Polymer Composites, 31(8), 1398 (2010). https://doi.org/10.1002/pc.20925
- J. P. Hong, S. W. Yoon, T. S. Hwang, Y. K. Lee. S. H. Won, and J. D. Nam, "Interphase control of boron nitride/epoxy composites for high thermal conductivity", Korea-Australia Rheology Journal, 22(4), 259 (2010).
- Y. Xu, and D. D. L. Chung, "Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxymatrix composites by particle surface treatments", Composites Interfaces, 7(4), 243 (2000). https://doi.org/10.1163/156855400750244969
- X. Wang, A. Pakdel, J. Zhang, Q. Weng, T. Zhai, C. Zhi, D. Golberg, and Y. Bando, "Large-surface-area BN nanosheets and their utilization in polymeric composites with improved thermal and dielectric properties", Nanoscale Research Letters, 7(1), 662 (2012). https://doi.org/10.1186/1556-276X-7-662
- W. L. Song. P. Wang, L. Cao, A. Anderson, M. J. Mezani, A. J. Farr, and Y. P. Sun, "Polymer/boron nitride nanocomposite materials for superior thermal transport performance", Angew. Chem. Int. ed., 51(26), 6498 (2012). https://doi.org/10.1002/anie.201201689
- Z. Lin, A. Mcnamara, Y. Liu, K. S. Moon, and C. P. Wong, "Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation", Composites Science and Technology, 90, 123 (2014). https://doi.org/10.1016/j.compscitech.2013.10.018
- H. L. Hong, J. U. Kim, and T. I. Kim, "Effective Assembly of Nano-Ceramic Materials for High and Anisotropic Thermal Conductivity in a Polymer Composite", Polymers, 9(9), 413 (2017). https://doi.org/10.3390/polym9090413
- C. Pan, J. Zhang, K. Kou, Y. Zhang, and G. Wu, "Investigation of the through-plane thermal conductivity of polymer composites with in-plane oriented hexagonal boron nitride", Int. J. Heat and mass Transfer, 120, 1 (2018). https://doi.org/10.1016/j.ijheatmasstransfer.2017.12.015
- Z. Lin, Y. Liu, S. Raghavan, K. S. Moon, S. K. Sitaraman, and C. P. Wong, "Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation", ACS Appl. Mater. Interfaces., 5(15), 7633 (2013). https://doi.org/10.1021/am401939z
Cited by
- 이온교환법에 의한 환원 그래핀-금속 하이브리드 소재의 합성 및 특성 vol.27, pp.4, 2018, https://doi.org/10.6117/kmeps.2020.27.4.025