참고문헌
- W. Werdecker and F. Aldinger, "Aluminum Nitride-An Alternative Ceramic Substrate for High Power Applications in Microcircuits," IEEE Trans. Comp., Hybrids, Manuf. Technol., CHMT-7 [4] 399-404 (1984). https://doi.org/10.1109/TCHMT.1984.1136380
- Y. Kurokawa, Z. Utsumi, H. Takamizawa, T. Kamata, and S. Noguchi, "AlN Substrates with High Thermal Conductivity," IEEE Trans. Comp., Hybrids, Manuf. Technol., CHMT-8 [2] 247-52 (1985).
- F. Miyashiro, N. Iwase, A. Tsuge, F. Ueno, M Nakahashi, and T. Takahashi, "High Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages," IEEE Trans. Comp., Hybrids, Manuf. Technol., 13 [2] 313-19 (1990). https://doi.org/10.1109/33.56163
- T. B. Jackson, A. V. Virkar K. L. More, R. B. Dinwiddie, Jr, and R. A. Cultler, "High-Thermal-Conductivity Aluminum Nitride Ceramics: The Effect of Thermodynamic, Kinetic, and Microstructural Factors," J. Am. Ceram. Soc., 80 [6] 1421-35 (1997).
- A. F. Belyanin, L. L. Bouilov, V. V. Zhirnov, A. I. Kamenev, K. A. Kovalskij, and B. V. Spitsyn, "Application of Aluminum Nitride Films for Electronic Devices," Diam. Relat. Mater., 8 [2-5] 369-72 (1999). https://doi.org/10.1016/S0925-9635(98)00412-9
- S. Kume, M. Yasuoka, N. Omura, and K. Watari, "Annealing Effect on Dielectric Property of AlN Ceramics," J. Eur. Ceram. Soc., 26 [10-11] 1831-34 (2006). https://doi.org/10.1016/j.jeurceramsoc.2005.09.009
- W. J. Kim, "Effect of Dopant Distribution on the Densification and Thermal Conductivity of Aluminum Nitride(in Korean)," pp.1-63, Ph. D. Dissertation, Korea Advanced Institute of Science and Technology, Daejon, 1994.
- C. Zweben, "Advances in Composite Materials for Thermal Management in Electronic Packaging," JOM, 50 [6] 47-51 (1998). https://doi.org/10.1007/s11837-998-0128-6
- H. Y. Zhang, D. Pinjala, and P. S. Teo, "Thermal Management of High Power Dissipation Electronic Packages: from Air Cooling to Liquid Cooling," Proc. Electron. Packag. Technol. Conf., 620-25 (2003).
-
W. J. Lee, H. T. Kim, K. B. Shim, and S. M. Lee, "Effect of Sintering Conditions on the Electrical Conductivity of 1 wt%
$Y_2O_3-Doped$ AlN Ceramics(in Korean)," J. Kor. Ceram. Soc., 44 [2] 116-23 (2007). https://doi.org/10.4191/KCERS.2007.44.2.116 -
J. H. Chae, J. S. Park, J. P. Ahn, K. H. Kim, and B. H. Lee, "Effects of
$Y_2O_3$ Addition on Densification and Thermal Conductivity of AlN Ceramics During Spark Plasma Sintering (in Korean),' J. Kor. Ceram. Soc., 45 [12] 827-31 (2008). https://doi.org/10.4191/KCERS.2008.45.1.827 -
L. Qiao, H. Zhou, H. Xue, and S. Wang, "Effect of
$Y_2O_3$ on Low Temperature Sintering and Thermal Conductivity of AlN Ceramics," J. Eur. Ceram. Soc., 23 [1] 61-7 (2003). https://doi.org/10.1016/S0955-2219(02)00079-1 - J. Y. Qiu, Y. Hotta, and K. Watari, "Enhancement of Densification and Thermal Conductivity in AlN Ceramics by Addition of Nano-Sized Particles," J. Am. Ceram. Soc., 89 [1] 377-80 (2006). https://doi.org/10.1111/j.1551-2916.2005.00692.x
- Y. Kameshima, M. Irie, A. Yasumori, and K. Okada, "Mechanochemical Effect on Low Temperature Synthesis of AlN by Direct Nitridation Method," Solid State Ionics, 172 [1-4] 185-90 (2004). https://doi.org/10.1016/j.ssi.2004.05.015
- M. Radwan, M. Bahgat, and A. A. El-Geassy, "Formation of Aluminum Nitride Whiskers by Direct Nitridation," J. Eur. Ceram. Soc., 26 [13] 2485-88 (2006). https://doi.org/10.1016/j.jeurceramsoc.2005.06.033
- R. Fu, H. Zhou, L. Chen, and Y. Wu, "Morphologies and Growth Mechanisms of Aluminum Nitride Whiskers Synthesized by Carbothermal Reduction," Mater. Sci. Eng., A266 [1-2] 44-51 (1999).
- I. Kimura, N. Hotta, H. Nukui, N Saito, and S. Yasukawa, "Synthesis of Fine AlN Powder by Vapour-phase Reaction," J. Mater. Sci. Letts., 7 [1] 66-8 (1988). https://doi.org/10.1007/BF01729918
- M. Tajika, W. Rafaniello, and K. Niihara, "Sintering Behavior of Direct Nitrided AlN Powder," Mater. Lett., 46 [2-3] 98-104 (2000). https://doi.org/10.1016/S0167-577X(00)00149-X
-
J. Y. Qiu, Y. Hotta, K. Sato, and K. Watari, "Fabrication of Fine AlN Particles by Pulverizing with Very Small
$ZrO_2$ Beads," J. Am. Ceram. Soc., 88 [6] 1676-79 (2005). https://doi.org/10.1111/j.1551-2916.2005.00327.x - N. Hashimoto, H. Yoden, and S. Deki, "Sintering Behavior of Fine Aluminum Nitride Powder Synthesized from Aluminum Polynuclear Complex," J. Am. Ceram. Soc., 75 [8] 2098-106 (1992). https://doi.org/10.1111/j.1151-2916.1992.tb04471.x
- M. L. Panchula and J. Y. Ying, "Nanocrystalline Aluminum Nitride: II, Sintering and Properties," J. Am. Ceram. Soc., 86 [7] 1121-27 (2003). https://doi.org/10.1111/j.1151-2916.2003.tb03434.x
- C. Papelis, W. Um, C. E. Russell, and J. B. Chapman, "Measuring the Specific Surface Area of Natural and Manmade Glasses: Effects of Formation Process, Morphology, and Particle Size," Colloids Surf. A, 215 [1-3] 221-39 (2003). https://doi.org/10.1016/S0927-7757(02)00448-X
- T. Sakai and M. Iwata, "Effect of Oxygen on Sintering of AlN," J. Mater. Sci., 12 [8] 1659-65 (1977). https://doi.org/10.1007/BF00542817
- X. J. Luo, X. R. Xu, B. L. Zhang, W. L. Li, and H. R. Zhuang, "Characteristic and Dispersion of a treated AlN Powder in Aqueous Solvent," Mater. Sci. Eng., A368 [1-2] 126-30 (2004).
- R. M. German, "Powder Metallurgy and Particlate Materials Procseeing," pp. 72-75, Metal Powder Industries Federation, New Jersey, 2005.
- M. Medraj, Y. Baik, W. T. Thompson, and R. A. L. Drew, "Understanding AlN Sintering through Computational Thermodynamics Combined with Experimental Investigation," J. Mater. Process. Tech., 161 [3] 415-22 (2005). https://doi.org/10.1016/j.jmatprotec.2004.05.031
-
J. Y. Qiu, Y. Hotta, K. Watari, K. Mitsuishi, and M. Yamazaki, "Low-Temperature Sintering Behavior of the Nano-sized AlN Powder Achieved by Super-fine Grinding Mill with
$Y_2O_3$ and CaO Additives," J. Eur. Ceram. Soc., 26 [4-5] 385-90 (2006). https://doi.org/10.1016/j.jeurceramsoc.2005.06.016 - W. J. Kim, "Effect of Dopant Distribution on the Densification and Thermal Conductivity of Aluminum Nitride(in Korean)," pp.101, Ph. D. Dissertation, Korea Advanced Institute of Science and Technology, Taejon, 1994.
- K. Ishizaki and K. Watari, "Oxygen Behavior of Normal and HIP Sintered AlN," J. Phys. Chem. Solids, 50 [10] 1009-12 (1989). https://doi.org/10.1016/0022-3697(89)90501-5
- K. A. Khor, K. H. Cheng, L. G. Yu, and F. Boey, "Thermal Conductivity and Dielectric Constant of Spark Plasma Sintered Aluminum Nitride," Mater. Sci. Eng., A347 [1-2] 300-5 (2003).
- G. A. Slack, R. A. Tanzilli, R. O. Pohl, and J. W. Vanderande, "The Intrinsic Thermal Conductivity of AlN," J. Phys. Chem. Solids, 48 [7] 641-47 (1987). https://doi.org/10.1016/0022-3697(87)90153-3
- F. Boey, A. I. Y. Tok, Y. C. Lam, and S. Y. Chew, "On the Effects of Secondary Phase on Thermal Conductivity of AlN Ceramic Substrates Using a Microstructural Modeling Approach," Mater. Sci. Eng., A335 [1-2] 281-89 (2002).
- J. Adachi, K. Kurosaki, M. Uno, and S. Yamanaka, "Thermal and Electrical Properties of Zirconium Nitride," J. Alloys Compd., 399 [1-2] 242-44 (2005). https://doi.org/10.1016/j.jallcom.2005.03.005
피인용 문헌
- Densification and Microstructure of Ultrafine-sized AlN Powder Prepared by a High Energy Ball Milling Process vol.19, pp.1, 2012, https://doi.org/10.4150/KPMI.2012.19.1.025