• Journal of the Korean Crystal Growth and Crystal Technology
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• v.22 no.4
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• pp.200-206
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• 2012

The artificial aggregate composing of coal bottom ash and waste catalyst slag (7 : 3, wt%) were fabricated using direct sintering method and, the bloating properties of aggregates were investigated as a function of raw material particle size and sintering temperature. Most of the artificial aggregates sintered at over $1150^{\circ}C$ showed the bloating phenomenon regardless of particle size of the raw materials. Consequently, the specific gravity of the aggregates was drastically decreased to below 1.4. The aggregates containing waste catalyst slag of $90{\mu}m$ under among the W-series specimens, however, did not show the noticeable bloating phenomenon. For the aggregates sintered at lower temperature as $1050{\sim}1150^{\circ}C$, the specific gravity increased with particle size of raw materials. Also, the water absorption of all aggregates decreased with the sintering temperature. The aggregates fabricated in this study met the lightweight aggregate standard showing the specific gravity 1.7~1.4 and water absorption 8~19 % and, therefore, can be applicable for the various fields.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.225-226
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• 2007

• Journal of the Korean Ceramic Society
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• v.32 no.11
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• pp.1233-1240
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• 1995

LAS system, which is difficult to be sintered, was densified by using the powder synthesized from metal alkoxides. Sinterability, thermal and mechanical properties were improved through synthesizing the complex oxide powder from the addition of Ge as an alkoxide. As a result, the synthesizing and sintering temperature of the LAS system lowered by about 10$0^{\circ}C$ and its modulus of rupture (MOR) increased twice higher compared to the sample from the oxide by the direct method.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.83-89
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• 2015

In this paper, we propose a fabrication technique for enhanced electrical properties of piezoelectric thick films with excellent patterning property using sol-infiltration and a direct-patterning process. To achieve the needs of high-density and direct-patterning at a low sintering temperature (< $850^{\circ}C$), a photosensitive lead zirconate titanate (PZT) solution was infiltrated into a screen-printed thick film. The direct-patterned PZT films were clearly formed on a locally screen-printed thick film, using a photomask and UV light. Because UV light is scattered in the screen-printed thick film of a porous powder-based structure, there are needs to optimize the photosensitive PZT sol infiltration process for obtaining the enhanced properties of PZT thick film. By optimizing the concentration of the photosensitive PZT sol, UV irradiation time, and solvent developing time, the hybrid films prepared with 0.35 M of PZT sol, 4 min of UV irradiation and 15 sec solvent developing time, showed a very dense with a large grain size at a low sintering temperature of $800^{\circ}C$. It also illustrated enhanced electrical properties (remnant polarization, $P_r$, and coercive field, $E_c$). The $P_r$ value was over four times higher than those of the screen-printed films. These films integrated on silicon wafer substrate could give a potential of applications in micro-sensors and -actuators.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.889-890
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• 2006

In recent years, PCB drills with smaller diameters less than 0.1 mm are used and thus there are growing needs for ultra-fine grained cemented carbides. However, ultra-fine WC powder usually causes extraordinary grain growth during sintering which weakens mechanical strength of ultra-fine grained cemented carbides. So we examined several kinds of WC powders to make new ultra-fine grained cemented carbides having superior performance. We found that direct carburized WC powder is very good as a WC raw material. The PCB drills made of the developed ultra-fine grained cemented carbides have higher hardness, toughness and stiffness than conventional ones.

• Journal of the Korean Ceramic Society
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• v.28 no.3
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• pp.225-233
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• 1991

In this study, we tried to find out the appropriate synthetic condition and magnetic properties of Ni-Zn ferrite {(NixZn1-x)Fe2O4} powders (where X=0, 0.1, 0.2, 0.3, ……0.9, 1). Ferrite powders were prepared by wet-direct method at 86℃ for 6hrs from FeCl36H2O, NiCl26H2O, and ZnCl2. The powders of (NixZn1-x)Fe2O4 (where X=0.4, 0.5, 0.6) have a good crystallinity, but the other ferrite powders consist of crystal and precursor ferrite. The ferrite powder's lattice constant is increased when ratio of ZnO contant is increased in the ferrite composition. And initial permeability was measured after sintering, result indicated regular pattern except (Ni0.4Zn0.6)Fe2O4 when the frequency were changed 10KHz to 10MHz.

• Nuclear Engineering and Technology
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• v.54 no.1
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• pp.244-254
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• 2022

For tensile tests, Vickers hardness tests and microstructure tests, plate-type and box-type specimens of austenitic 316L stainless steels were produced by a conventional machining (CM) process as well as two additive manufacturing processes such as direct metal laser sintering (DMLS) and direct metal tooling (DMT). The specimens were irradiated up to a fast neutron fluence of 3.3 × 10⁹ n/cm² at a neutron irradiation facility. Mechanical performance of the unirradiated and irradiated specimens were investigated at room temperature and 300 ℃, respectively. The tensile strengths of the DMLS, DMT and CM 316L specimens are in descending order but the elongations are in reverse order, regardless of irradiation and temperature. The ratio of Vickers hardness to ultimate tensile strength was derived to be between 3.21 and 4.01. The additive manufacturing processes exhibit suitable mechanical performance, comparing the tensile strengths and elongations of the conventional machining process.

• Journal of Powder Materials
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• v.22 no.2
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• pp.111-115
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• 2015

This study investigates the microstructure and thermal shock properties of polycrystalline diamond compact (PDC) produced by the high-temperature, high-pressure (HPHT) process. The diamond used for the investigation features a $12{\sim}22{\mu}m$- and $8{\sim}16{\mu}m$-sized main particles, and $1{\sim}2{\mu}m$-sized filler particles. The filler particle ratio is adjusted up to 5~31% to produce a mixed particle, and then the tap density is measured. The measurement finds that as the filler particle ratio increases, the tap density value continuously increases, but at 23% or greater, it reduces by a small margin. The mixed particle described above undergoes an HPHT sintering process. Observation of PDC microstructures reveals that the filler particle ratio with high tap density value increases direct bonding among diamond particles, Co distribution becomes even, and the Co and W fraction also decreases. The produced PDC undergoes thermal shock tests with two temperature conditions of 820 and 830, and the results reveals that PDC with smaller filler particle ratio and low tap density value easily produces cracks, while PDC with high tap density value that contributes in increased direct bonding along with the higher diamond content results in improved thermal shock properties.

• Journal of the Korean institute of surface engineering
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• v.54 no.5
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• Korean Journal of Materials Research
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• v.14 no.10
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• pp.743-748
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• 2004

Modified Ni/YSZ cermets for high temperature electrolysis were synthesized by the direct ball milling of Ni and YSZ powder. The ball milling was carried out in dry process and in ethanol with varying milling time. While the dry-milling decreased the average size from 65 to $80{\mu}m$, the wet-milling decreased the average size down to $10{\mu}m$. In addition, very fine particles less than $0.1{\mu}m$ were observed in the wet-milling condition. The subsequent process of cold-pressing and sintering at $900^{\circ}C$ for 2 h did not affect the particle size of dry-milled powder. The electrical conductivity of the dry-milled Ni/YSZ cermet showed the value of $5{\times}10^{2}\;S/cm$ and this value was increased to $1.4{\times}10^{4}\;S/cm$ after the sintering at $900^{\circ}C$ for 2 h.