• 한국결정성장학회지
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• 제30권3호
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• pp.110-116
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• 2020

MLCC(Multi-Layer Ceramic Capacitor)의 유전체 층에 사용되는 BaTiO₃ 입자는 안정한 TCC(Temperature Characteristics of Capacitance) 거동을 갖기 위해 core/shell 구조를 갖는다. 지금까지 shell의 특성은 core/shell 구조의 전체 특성에서 유추해 왔다. 이는 core/shell 구조가 겨우 수 ㎛의 작은 크기로 shell 특성만 구별해서 측정하기가 어렵기 때문이다. 본 실험에서는 micro-contact법을 이용하여 확산쌍 시편의 계면에 형성된 확대된 core/shell 구조에 Pt 전극을 증착하여 35~135℃ 에서 shell 영역의 독립적인 TCC 거동을 측정하였다. 그 결과, 65℃에서 최대 유전율 값을 갖는 완만한 피크의 확산 상전이(Diffusion Phase Transition) 거동인 core의 특성과 구별되는 거동을 관찰하였으며, 이는 core/shell 구조의 온도-유전거동을 묘사하는 모델링에서 실험 자료로 활용될 것으로 본다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.200-200
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• 2010

이 논문에서는 field-effect mobility를 향상시키기 위해 triple-layer (SiNx/SiO2/SiOxNy stack 구조)를 gate dielectric material 로 LTPS TFTs에 적용하였다. 이는 플라즈마 처리 기법과 적층구조의 효과적인 in-situ 공정을 이용하여 interface trap과 mobile charge를 낮추어 높은 이동도의 결과를 생각하고 실험하였다. 실험은 SiO2 gatedielectric과 triple-gate dielectric의 C-V curve를 1 MHz의 주파수에서 측정하였다. 또한 Transfer characteristics를 single SiO2 gatedielectric과 triple-gate dielectric of SiNx/SiO2/SiOxNy를 STA 장비를 이용해 측정하였다. 위의 측정을 통해 threshold voltage, mobility, subtheshold swing, driving current, ON/OFF current ratio를 비교 분석하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 제4회 영호남학술대회 논문집
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• pp.64-68
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• 2002

According to the increasing power demand for the future construction of many underground cables will be required. However, construction of new ducts for power cables will be more difficult. Therefore, research work for realizing the high temperature superconducting(HTS) cable has advanced, where the development of electrical insulating system at cryogenic temperature is one of the major researches. For an electrical insulation design of HTS cable, it is important to understand not only breakdown but also partial discharge and dielectric loss($tan{\delta}$) in liquid nitrogen/paper composite insulation system. In this paper, we investigated breakdown characteristics in liquid nitrogen/paper composite insulation system for the application to HTS cable. And, we studied the breakdown characteristics of the multi-layer and butt gap of the insulation papers in liquid nitrogen. Also, we measured dielectric loss($tan{\delta}$) of the mini-model Cable made of TERLAM IPP.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.207-208
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• 2007

Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 추계학술대회 논문집 전기물성,응용부문
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• pp.96-99
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• 2001

In this paper, we present the simulation results of the multi-layer VCO(Voltage Controlled Oscillator), which is composed of the resonator, the oscillator and the buffer circuit. using EM simulator and nonlinear RF circuit simulator. EM simulator is used for obtaining the EM(Electromagnetic) characteristics of the conductor pattern as well as designing the multi-layer VCO. Obtained EM characteristics were used as real components in nonlinear RF circuit simulation. Finally the overall VCO was simulated using the nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was DuPont 951AT, which will be applied for LTCC process. The structure is constructed with 4 conducting layer. Simulated results showed that the output level was about 4.5[dBm], the phase noise was -104[dBc/Hz] at 30[kHz] offset frequency, the harmonics -8dBc, and the control voltage sensitivity of 30[MHz/V] with a DC current consumption of 9.5[mA]. The size of VCO is $6{\times}9{\times}2mm$(0.11[cc]).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.189-190
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• 2008

The electrical characteristics of band-gap engineered tunneling barriers consisting of thin $SiO_2$ and $Si_3N_4$ dielectric layers were investigated. The band structure of stacked tunneling barriers was studied and the effectiveness of these tunneling barriers was compared with that of the conventional tunneling barrier. The band-gap engineered tunneling barriers show the lower operation voltage, faster speed and longer retention time than the conventional $SiO_2$ tunnel barrier. The thickness of each $SiO_2$ and $Si_3N_4$ layer was optimized to improve the performance of non-volatile memory.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.366-369
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• 2002

At present, the study of direct digital X-ray detector and indirect digital X-ray detector proceed actively. But it needs high thickness and high voltage in selenium for high ionization rate. Therefore, we carried out the study of electric characteristics of a-Se with additive ratio of Iodine in drafting study for developing Hybrid X -ray Sensor for complementing direct digital X -ray detector and indirect digital X-ray detector in this paper. On this, there are formed Amorphous selenium multi-layers by sticking phosphor layer$(Gd_{2}O_{2}S(Eu^{2+}))$ using optical adhesives of EFIRON Co. Amorphous selenium multi-layers having dielectric layer(parylene) has characteristics of low dark-current, high X-ray sensitivity. So we can acquired a enhanced signal to noise ratio. We make Amorphous selenium multi-layers with $30{\mu}m$ thickness on glass.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권7호
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• pp.311-315
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• 2002

Chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD), inter-level dielectric (ILD) layers of multi-layer interconnections. In this paper, we studied the characteristics of polishing pad, which can apply shallow trench isolation (STI)-CMP process for global planarization of multi-level interconnection structure. Also, we investigated the effects of different sets of polishing pad, such as soft and hard pad. As an experimental result, hard pad showed center-fast type, and soft pad showed edge-fast type. Totally, the defect level has shown little difference, however, the counts of scratch was detected less than 2 on JR111 pad. Through the above results, we can select optimum polishing pad, so we can expect the improvements of throughput and device yield.

• 전기전자학회논문지
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• 제24권1호
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• pp.238-242
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• 2020

본 논문에서는 구축함에 탑재되는 통합 마스트의 RCS(Radar Cross Section) 값을 저감시키기 위해 다층 구조로 되어있는 유전체 코팅을 이용한 기법을 제시한다. 제시된 다층 구조는 특별히 고유전율을 요구하거나 전자기파 흡수 차단에 많이 사용되는 자성체성분을 포함하지 않은 일반적인 유전체를 사용할 수 있도록 유전율의 범위를 정했기 때문에 제작에 용이하다는 장점이 있다. 제시된 다층 유전체 구조를 통합 바스트 형상에 적용시킨 후 시뮬레이션을 진행한 결과 다층 구조가 없는 구조물과 비교하여 6GHz에서 10.9dB, 12GHz에서 11.95dB, 18GHz에서 11.63dB의 RCS 저감 성능이 있는 것을 확인하였다.

• 한국전기전자재료학회논문지
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• 제35권2호
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• pp.103-118
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• 2022

With the recent increase in demand for electronic devices, multi-layer ceramic capacitors (MLCCs) have become the most important core component. In particular, the next-generation MLCC with extremely high reliability is required for the 4^th industrial revolution and electric vehicle applications. Therefore, it is necessary to develop dielectric ceramic materials with high dielectric properties and reliability. During the decades, electrical properties of BaTiO₃ based dielectric ceramics, which have been widely used in MLCC industrial field, have been improved by microstructure and defect chemistry control. However, electrical properties of BaTiO₃ have reached their limits, and new types of dielectric materials have been widely studied. Based on these backgrounds, this report presents the recent development trends of BaTiO₃-based dielectric materials for the next-generation MLCCs, and suggests promising candidates to replace BaTiO₃ ceramics.