Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2007.06a
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- Pages.207-208
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- 2007
Toughnening of Dielectric Material by Thermoplastic Polymer
- Lee, Jung-Woo (Electric Material & Device Lab, Central R&D Institute, Samsung Electro-Mechanics Co., LTD.) ;
- Cho, Jae-Choon (Electric Material & Device Lab, Central R&D Institute, Samsung Electro-Mechanics Co., LTD.) ;
- Ra, Seung-Hyun (Electric Material & Device Lab, Central R&D Institute, Samsung Electro-Mechanics Co., LTD.)
- Published : 2007.06.21
Abstract
Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).