• Journal of the Korean Society of Safety
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• v.22 no.3 s.81
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• pp.22-27
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• 2007

The knowledge of the flash point of the various liquid substances is required because of process safety and control in industrial fire protection. The epoxy resin is one of versatile resins that has wide selection of using curing agents and additives to achieve various applications such as coatings, adhesives, interior materials, reinforced plastics and electrical insulation. In this study, the lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems were measured by using Pensky-Martens closed cup tester. The lower flash points for p-xylene+epoxy resin, o-xylene+epoxy resin and n-butanol+epoxy resin systems rapidly increased 80wt%, 90wt% and 95wt% of epoxy resin concentration, respectively. This results serve as a guide to estimate flash point of any epoxy resin solution.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.19-26
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• 2017

The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• Advances in materials Research
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• v.1 no.1
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• pp.93-107
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• 2012

Epoxy resin is widely used in high voltage apparatus as insulation. Fillers are often added to epoxy resin to enhance its mechanical, thermal and chemical properties. The addition of fillers can deteriorate electrical performance. With the new development in nanotechnology, it has been widely anticipated that the combination of nanoparticles with traditional resin systems may create nanocomposite materials with enhanced electrical, thermal and mechanical properties. In the present paper we have carried out a comparative study on dielectric properties, space charge and dielectric breakdown behavior of epoxy resin/nanocomposites with nano-fillers of $SiO_2$ and $Al_2O_3$. The epoxy resin (LY556), commonly used in power apparatus was used to investigate the dielectric behavior of epoxy resin/nanocomposites with different filler concentrations. The epoxy resin/nanocomposite thin film samples were prepared and tests were carried out to measure their dielectric permittivity and tan delta value in a frequency range of 1 Hz - 1 MHz. The space charge behaviors were also observed by using the pulse electroacoustic (PEA) technique. In addition, traditional epoxy resin/microcomposites were also prepared and tested and the test results were compared with those obtained from epoxy resin/nanocomposites.

• Journal of the Korean Ceramic Society
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• v.35 no.4
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• pp.371-377
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• 1998

The effect of epoxy resin on the water stability of HAC/PVA based MDF cement composite were stu-died through the three different forming methods calendering extruding and warm pressing. In prexing step the epoxy resin was added in 5-15wt% of cement weight. The 3-point flexural strength of each dry and wet specimen which were immersed in water during 3. 7, 14 days was estmated and the mi-crostructural change of epoxy resin-added MDF cement composite due to water immersion was charac-terized by scanning electron microscopy. As the addition amount of epoxy resin the im-provement of water stability of MDF cement composite was achieved in most case. Especially through the warm press forming method the effectiveness of epoxy resin addition to the water stability was enhanced. When the epoxy resin was added by 5wt% to 7wt% the optimum flexural strength and water stability

• Journal of the Korean Applied Science and Technology
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• v.24 no.4
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• pp.393-398
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• 2007

We investigated heat stability of epoxy resin products and epoxy resin according to the influence hardener. The heat flow which shows the degree of thermal decomposition of the epoxy resin product and epoxy resin measured by using the differential scanning calorimeter (DSC). As a result, we found that in the case of heat stability for epoxy resin as hardener was added, the ratio of one to one (epoxy resin : hardener) was the most suitable in air condition and nitrogen atmosphere.

• Journal of the Korean Applied Science and Technology
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• v.27 no.3
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• pp.325-336
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• 2010

In this study, we experimented that how to synthesis waterborne urethane-epoxy hybrid resin for leather garment coatings. First of all, We had analyzed datas by FT-IR, SEM and TGA for the machanical properties. By instruments analysis measurement we confirmed that synthesis of urethane and epoxy. In this experiment we knew that polyurethane and urethane-epoxy hybrid resin have 4~5 grades of solvent resistance. Tensile strength measured in the urethane-epoxy resin(epoxy 12%, 2.033$kg_f/mm^2$) had the most strong strength than polyurethane(1.833 $kg_f/mm^2$) emulsion samples. Also urethane-epoxy hybrid resin had better result than polyurethane in acid resistance and abrasion test. As hight proportion of epoxy in hybid resin, we obtained low elongation and low flexibility. In this result, the mechanical properties of waterborne polyurethane-epoxy hybrid resin showed that how effect in leather coating by ratio of epoxy emulsion.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.237-240
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• 2002

Amino terminated polyetherimide(ATPEI) has been synthesized by bisphthalic anhydride arid m-phenylenediamine, after that characterized by differential scanning calorimetry(DSC), thermogravimetric analyzer(TGA). Fourier transform (FT-IR) spectroscopy and gel permeation chromatography(GPC). ATPEI was blend to improve the toughness of bisphenol-A type epoxy resin which was cured by nadic methyl anhydride(NMA). The fracture toughness and the molphology of the toughened epoxy resin was evaluated. The toughness of ATPEI modified epoxy resin was higher than that of the PEI modified epoxy resin. In addtion, carbon fiber/ATPEI modified epoxy resin composites were fabricated and the mechanical properties of the resulted composites were investigated.

• Journal of the Korean Applied Science and Technology
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• v.28 no.1
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• pp.109-117
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• 2011

In this study, we experimented that how influence chain extension to waterborne urethane-epoxy hybrid resin for leather garment coatings. First of all, We had analyzed datas by FT-IR, SEM and machanical properties. By instruments analysis measurement we confirmed that synthesis of epoxy and hybrid resin. In this experiment we knew that polyurethane-epoxy hybrid resin have 5 grades of solvent resistance. Tensile strength measured in the polyurethane-epoxy resin(EDA 5.37g, 2.386 $kg_f/mm^2$) had the most strong strength.. Also polyurethane-epoxy hybrid resin had better result(EDA 5.37g. 37.4 mg. loss) than other hybrid resins. As hight proportion of EDA in hybid resin, we obtained low elongation and low flexibility. In this result, chain extension of waterborne polyurethane-epoxy hybrid resin showed that how effect in leather coating by ratio of EDA.