• Composites Research
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• 제24권2호
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• pp.1-8
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• 2011

복합재료/금속 접착 조인트의 파손기준을 제시하기 위하여 다양한 혼합모드 하중상태에서 계면파괴인성을 측정하였다. 계면파괴인성은 SLB 시편을 이용하여 측정하였으며 시편의 두께를 변화시킴으로 모드 혼합비율을 다양하게 설정하였다. 실험결과 계면의 파괴인성은 균열 열림에 비해 균열 미끄러짐 모드의 비율이 높은 하중상태에서 더 큰 값을 나타내었다. 균열 열림 및 미끄러짐 하중모드에 따른 계면파괴 거동의 차이를 균열진전 과정을 관찰한 현미경 영상을 기초로 고찰하였다. 표면 거칠기가 접착 강도에 미치는 영향 또한 고찰되었다.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2004년도 학술대회지
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• pp.289-295
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• 2004

The relationship between friction characteristics and iron oxides at the sliding interface was investigated. Three friction materials containing iron, magnetite $(Fe_3O_4)$ or hematite $(Fe_2O_3)$ were manufactured and friction tests were performed on gray cast iron disks to evaluate the friction coefficient as a function of sliding speed $\mu-\nu$. In-situ noise spectrum analyzer was employed to compare noise propensity during friction tests. Results show that the specimens with magnetite are more sensitive to velocity than those with iron or hematite. The specimens containing magnetite and hematite generated noise with different peaks in the spectrum. The difference in the peak frequency seems attributed to the different surface aggressiveness of iron oxides and intermittent changes of real contact area at the sliding interface during sliding. Surface morphology and roughness of the counter disc after the tests are also consistent with the aggressiveness of iron oxides.

• 접착 및 계면
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• 제10권1호
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• pp.17-22
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• 2009

Polymer thin films were prepared by radio frequency (RF) plasma polymerization of phthalic anhydride (PA). First, monomer vaporization temperature ($100{\sim}160^{\circ}C$) was optimized by evaluating the thermal properties of thin films using differential scanning calorimeter (DSC) and measuring the root-mean-square (RMS) roughness with atomic force microscope (AFM) at the fixed plasma power of 10 W and time of 5 min in a continuous-wave (CW) mode. Plasma power (5~20 W) was then optimized by measuring the film solubility in solvents such as toluene, acetone, dimethylsulfoxide (DMSO) and 1 methylpyrrolidine (NMP). Next, pulsed mode plasma polymerization was also studied by varying the duty cycle of on-time (5, 20%) under optimized conditions of continuous-wave (CW) mode ($120^{\circ}C$, 10 W) in order to increase the anhydride functional groups. Finally, polymer thin films were characterized by Fourier transform infrared spectroscopy (FT-IR), thermogravimetric analyzer (TGA) and ${\alpha}$-step.

• 한국재료학회지
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• 제13권5호
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• pp.338-342
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• 2003

Adhesion between Cu and low-k films has been investigated. Low-k films deposited using a mixture of hexamethyldisilane(HMDS) and Para-xylene had a dielectric constant as low as 2.7, showing the thermally stable properties up to $400^{\circ}C$. In this study, Ti glue layer, boron dopant, and $N_2$plasma treatment were used to improve adhesion property of between Cu and low-k films. Ti glue layer slightly improved adhesion property. After $N_2$plasma treatment, the adhesion property was significantly improved due to the increased roughness and the formation of new binding states between Ti and plasma-treated PPpX : HMDS. However, $300^{\circ}C$ annealing of $N_2$plasma treated sample caused the diffusion of Cu into the PPpX : HMDS, degrading the low-k properties. In the case of Cu(B)/Ti/PPpX : HMDS, the adhesion was remarkably increased. This enhanced adhesion was attributed to formation of Ti-boride at the Cu-Ti interface. It is because the formed Ti-boride prevented the diffusion of Cu into the PPpX : HMDS and the Cu-Ti reaction at the Ti interface.

• Corrosion Science and Technology
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• 제10권1호
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• pp.1-5
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• 2011

The major purpose of the present study is to evaluate the performance of various galvanized (GI) or galvannealed (GA) mild steels and AHSS in stamping applications. Finite Element Analysis (FEA) of selected stamping operations was conducted to estimate the critical pressure boundary conditions that exist in practice. Using this information, laboratory tribotests, e.g. Twist Compression (TCT), Deep Drawing (DDT) and Strip Drawing (SDT) Tests, were developed to evaluate the performance of selected lubricants and die materials/coatings in forming galvanized steels of interest. The sheet materials investigated included mild steels and AHSS (e.g. DP600 GI/GA, DP780 GI/GA, TRIP780 GA and DP980 GI/GA). Experimental results showed that galvanized material resulted in more galling, while galvannealed material showed more powdering and flaking. The surface roughness and chemical composition of galvanized sheet materials affected the severity of galling under the same testing conditions, i.e. lubricants and die materials/coatings. The results of this study helped to determine the critical interface pressure that initiates lubricant failure and galling in stamping selected galvanized sheet materials. Thus, to prevent or postpone the critical interface conditions, the results of this study can be used to select the optimum combination of galvanized sheet, die material, die coating and lubricant for forming structural automotive components.

• 설비공학논문집
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• 제26권1호
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• pp.32-37
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• 2014

The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.151-155
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• 2003

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between $Sn-37wt\%Pb$ solder and Ag-Pd thick film conductor after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, Ag-Pd conductor pad roughness were increased from 304nm to 330nm. $Cu_6Sn_5$ formed during initial ref]ow process at the interface between TiWN/Cu UBM and solder grew by the succeeding reflow process so the grains had a large diameter and dense interval. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about $0.1\~0.6{\mu}m$. And a needle-shaped $Ag_3Sn$ was also observed at the inside of the solder.

• Geomechanics and Engineering
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• 제10권3호
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• pp.315-324
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• 2016

Frictional forces between soil and structural elements are of vital importance for the foundation engineering. Although numerous studies were performed about the soil-structure interaction in recent years, the approximate relations proposed in the first half of the 20th century are still used to determine the frictional forces. Throughout history, wood was often used as friction piles. Steel has started to be used in the last century. Today, alternatively these materials, FRP (fiber-reinforced polymer) piles are used extensively due to they can serve for long years under harsh environmental conditions. In this study, various ratios of low plasticity clays (CL) were added to the sand soil and compacted to standard Proctor density. Thus, soils with various internal friction angles (${\phi}$) were obtained. The skin friction angles (${\delta}$) of these soils with FRP, which is a composite material, steel (st37) and wood (pine) were determined by performing interface shear tests (IST). Based on the data obtained from the test results, a chart was proposed, which engineers can use in pile design. By means of this chart, the skin friction angles of the soils, of which only the internal friction angles are known, with FRP, steel and wood materials can be determined easily.

• 한국재료학회지
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• 제17권2호
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• pp.61-67
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• 2007

The magnetron reactive sputtering was adopted to deposit CuO buffer layers on the polyimide surfaces for increasing the adhesion strength between Cu thin films and polyimide, varying $O_2$ gas flow rate from 1 to 5 sccm. The CuO oxide was formed through all the $O_2$ gas flow rates of 1 to 5 sccm, showing the highest value at the 3 sccm $O_2$ gas flow rate. The XPS analysis revealed that the $Cu_2O$ oxide was also formed with a significant ratio during the reactive sputtering. The adhesion strength is mainly dependent on the amount of CuO in the buffer layers, which can react with C-O-C or C-N bonds on the polyimide surfaces. The adhesion strength of the multi-layered Cu/buffer layer/polyimide specimen decreased linearly as the heating temperature increased to $300^{\circ}C$, even though there showd no significant change in the chemical state at the polyimide interface. This result is attributed to the decrease in surface roughness of deposited copper oxide on the polyimide, when it is heated.

• 대한기계학회논문집
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• 제12권1호
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• pp.116-122
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• 1988

본 연구에서는 공기와 물을 매질로 사용하여 3차원 계면파가 존재하는 근사수평 반류성층유동에서의 계면전단응력과 마찰계수를 결정하였다. 기상과 액상의 유량조건에 따라 3차원 계면파의 특성을 needle contact법에 의하여 측정 하였으며, 기상의 압력강하와 속도분포를 구하여 계면전단응력을 구하였다. 또 공학적인 응용을 위하여 3차원과 영역에서의 계면마찰계수에 관한 실험식을 개발하였다. 그리고 거칠은 고체표면에서의 마찰계수를 표현한 Nikuradse식을 이용하여 계면의 등가조도(equivalent roughness)를 계산하였으며 이것을 계면의 파고교란강도와 비교분석하여 계면전단응력에 영향을 미치는 인자들을 규명하였다.