Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2003.11a
- /
- Pages.151-155
- /
- 2003
Reliability of Joint Between Solder Bump and Ag-Pd Thick Film Conductor and Interfacial Reaction
솔더범프와 Ag-Pd 후막도체의 접합 신뢰성 및 계면반응
- Published : 2003.11.01
Abstract
The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the alumina substrate and the IMC layer between
Keywords