• Transactions on Electrical and Electronic Materials
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• v.14 no.3
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• pp.133-138
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• 2013

Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

• Korean Chemical Engineering Research
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• v.53 no.6
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• pp.814-817
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• 2015

A new ionic mass transfer correlation is derived for the fluid-saturated, horizontal porous layer. Darcy-Forchheimer model is used to explain characteristics of fluid motion. Based on the microscales of turbulence a backbone mass transfer relation is derived as a function of the Darcy-Rayleigh number, $Ra_D$ and the porous medium Schmidt number, $Sc_p$. For the Darcy's limit of $Sc_p{\gg}Ra_D$, the Sherwood number, Sh is a function of $Ra_D$ only. However, for the region of high $Ra_D$, Sh can be related with $Ra_DSc_p$. Based on the present backbone equation and the electrochemical mass transfer experiments which are electro plating or electroless plating, the new ionic mass transfer correlation is suggested in the porous media.

• Korean Chemical Engineering Research
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• v.55 no.2
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• pp.264-269
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• 2017

To improve heating characteristics of graphite fibers, graphite fibers were copper-plated by electroless plating. The Cu-plated graphite fibers were investigated by thermos-gravimetric analysis in air to calculate quantities of copper on surface of graphite fiber according to plating time. Also, the surface temperature with applied voltage was observed by thermos-graphic camera using a strand of graphite fiber. According to the increment of plating time, the higher quantities of plated copper on graphite fiber were obtained. The electric conductivity of plated graphite fiber for 20 minutes was resulted in 1594.3 S/cm, and surface temperature of this sample showed the maximum temperature $57.2^{\circ}C$. These result could be attributed that copper having great electric conductivity are growing on graphite fiber and followed improving heating characteristics.

• Korean Chemical Engineering Research
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• v.46 no.5
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• pp.863-867
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• 2008

Pitch based activated carbon fiber(ACF) was prepared from reformed naphtha cracking bottom oil(NCB oil) by melt spinning. The fibers obtained were stabilized, carbonized, and then steam activated. The ACF was sensitized with Pd-Sn catalytic nuclei via a single-step activation approach. This sensitized ACF was used as precursors for obtaining copper plated ACFs via electroless plating. ACFs uniformly decorated with metal particles were obtained with reduced copper plating in the reaction solution. Effects of the amount of copper on characteristics of ACF/Cu catalysts were investigated through BET surface area, X-ray diffraction, scanning emission microscopy, and ICP. The amount of copper increased with plating time, but the surface area as well as the pore volume decreased. NO conversion increased with reaction temperature. NO conversion decreased with increasing the amount of copper, which is seemed to be due to the reduction of surface area as well as the dispersion of copper.

• Corrosion Science and Technology
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• v.4 no.6
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• pp.222-225
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• 2005

The adhesion strength of metal plating on PC was studied. In this study, surface was treated by chemical agents or DBD(dielectric barrier discharge) plasma to imporve the adhesion. The surface roughness, contact angle, gloss of plating and adhesive strength were measured. Adhesion strengths of Ni plating on prepared PC by NaOH and KOH solution were $12.3kgf/cm^2$ and $7.5kgf/cm^2$, respectively. The highest adhesion strength was obtained in the plasma treated one, $27.8kgf/cm^2$.

• Journal of the Korean institute of surface engineering
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• v.41 no.1
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• pp.33-37
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• 2008

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

• Membrane Journal
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• v.32 no.6
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• pp.456-464
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• 2022

Hydrogen permeation performance was analyzed by manufacturing Pd and Pd-Cu membranes through electroless plating. As a support for the Pd and Pd-Cu membranes, α-Al₂O₃ ceramic hollow fiber were used. Pd-Cu membrane was manufactured through sequential electroless plating, and then annealing was performed at 500°C, for 18 h in a hydrogen atmosphere to make Pd and Cu alloy. After annealing, the Pd-Cu membrane confirmed that the alloy was formed through EDS (Energy Dispersive X-ray Spectroscopy) and XRD (X-ray Diffraction) analysis. In addition, the thickness of the Pd and Pd-Cu plating layers were measured to be about 3.21 and 3.72 µm, respectively, through SEM (Scanning Electron Microscope) analysis. Hydrogen permeation performance was tested for hydrogen permeation in the range of 350~450°C and 1~4 bar in hydrogen single gas and mixed gas (H₂, N₂). In a single hydrogen gas, Pd and Pd-Cu membranes have flux of up to 54.42 and 67.17 ml/cm²⋅ min at 450 °C and 4 bar. In the mixed gas, it was confirmed that the separation factors of 1308 and 453 were obtained under the conditions of 450 °C and 4 bar.

• Journal of the Optical Society of Korea
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• v.19 no.3
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 1999.05a
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• pp.165-170
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• 1999

Palladium membranes have high selectivity of separation and removal of hydrogen to chemical process at high temperature. For the development of hydrogen permeable membrane, palladium was deposited on porous stainless steel support by electroless plating method. In this work, the activation effect on the surface of stainless steel support has been investigated for the effective palladium plating. The morphology and microstructure were characterized by SEM and the composition was analyzed by EDX. It is found that the composition of deposited nuclei on the stainless steel support was changed in accordance with activation cycles. It is also observed that Sn-enriched nuclei has been changed to Pd-enriched nuclei over the fifteenth activation. The uniform deposition of the dense palladium layer on porous stainless steel support has been performing with Sn-enriched nuclei and comparing with Pd-enriched nuclei.

• The korean journal of orthodontics
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• v.36 no.2 s.115
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• pp.145-152
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• 2006

The purpose of this study was to evaluate electroless plating as a method of increasing the diameter of an orthodontic wire in comparison with eletroplating. After pretreatment plating of the 0.016 inch stainless steel orthodontic wire, electroless plating was performed at $90^{\circ}C$ until the diameter of the wire was increased to 0.018 inch. During the process of electroless plating, the diameter of the wire was measured every 5 minutes to examine the increasing ratio of the wire's diameter per time unit. And to examine the uniformity, the diameter at 3 points on the electroless-plated orthodontic wire was measured. An X-ray diffraction test for analyzing the nature of the plated metal and a 3-point bending test for analyzing the physical property were performed. The electroless-plated wire group showed a increased tendency for stiffness, yield strength, and ultimate strength than the electroplated wire group. And there was a statistically significant difference between the two groups for stiffness and ultimate strength. In the electroless-plated wire group, the increasing ratio of the diameter was $0.00461{\pm}0.00003mm/5min$ (0.00092 mm/min). In the electroplated wire group, it was $0.00821{\pm}0.00015mm/min$. The results of the uniformity test showed a tendency for uniformity in both the plating methods. The results of this study suggest that electroless plating of the wire is closer to the ready-made wire than electroplating wire in terms of the physical property. However, the length of plating time needs further consideration for the clinical application of electroless plating.