Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment

  • Song, T.H. (Division of Material Engineering, Soonchunhyang University) ;
  • Lee, J.K. (Division of Material Engineering, Soonchunhyang University) ;
  • Park, S.Y. (Division of Material Engineering, Soonchunhyang University)
  • Published : 2005.12.01

Abstract

The adhesion strength of metal plating on PC was studied. In this study, surface was treated by chemical agents or DBD(dielectric barrier discharge) plasma to imporve the adhesion. The surface roughness, contact angle, gloss of plating and adhesive strength were measured. Adhesion strengths of Ni plating on prepared PC by NaOH and KOH solution were $12.3kgf/cm^2$ and $7.5kgf/cm^2$, respectively. The highest adhesion strength was obtained in the plasma treated one, $27.8kgf/cm^2$.

Keywords

Acknowledgement

Supported by : Soonchunhyang University

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