Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Electroless Silver Plating of PC/ABS and PC by Plasma Treatment and MmSH Injection Process

Plasma 처리 및 MmSH 사출방법으로 인한 PC/ABS와 PC상의 은도금 밀착성에 관한 연구

  • Park, Ki-Y. (Department of Materials Eng., Soonchunhyang University) ;
  • Lee, Hye-W. (Department of Materials Eng., Soonchunhyang University) ;
  • Lee, Jong-K. (Department of Materials Eng., Soonchunhyang University)
  • 박기용 (순천향대학교 신소재공학과) ;
  • 이혜원 (순천향대학교 신소재공학과) ;
  • 이종권 (순천향대학교 신소재공학과)
  • Published : 2008.02.29
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Abstract

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

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References

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