Cure Characteristics of Ethoxysilyl Bisphenol A Type Epoxy Resin Systems for Next Generation Semiconductor Packaging Materials (새로운 반도체 Packaging용 Ethoxysilyl Bisphenol A Type Epoxy Resin System의 경화특성 연구)
-
- Journal of the Semiconductor & Display Technology
- /
- v.16 no.2
- /
- pp.19-26
- /
- 2017