• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.2
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• pp.68-73
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• 2006

We propose a damascene gate FinFET with Si nanocrystals implemented on bulk silicon wafer for low voltage flash memory device. The use of optimized SRON (Silicon-Rich Oxynitride) process allows a high degree of control of the Si excess in the oxide. The FinFET with Si nanocrystals shows high program/erase (P/E) speed, large $V_{TH}$ shifts over 2.5V at 12V/$10{\mu}s$ for program and -12V/1ms for erase, good retention time, and acceptable endurance characteristics. Si nanocrystal memory with damascene gate FinFET is a solution of gate stack and voltage scaling for future generations of flash memory device. Index Terms-FinFET, Si-nanocrystal, SRON(Si-Rich Oxynitride), flash memory device.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.1
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• pp.12-17
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• 2004

The body-tied FinFETs (bulk FinFETs) implemented on bulk Si substrate were characterized through 3-dimensional device simulation. By controlling the doping profile along the vertical fin body, the bulk FinFETs can be scaled down to sub-30 nm. Device characteristics with the body shape were also shown. At a contact resistivity of $1{\times}10^{-7}\;{\Omega}\;cm^2$, the device with side metal contact of fin source/drain showed higher drain current by about two. The C-V results were also shown for the first time.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.4
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• pp.266-272
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• 2009

In the present work three dimensional process and device simulations were employed to study the performance variations with RTA. It is observed that with the increase in RTA temperature, the arsenic dopants from the source /drain region diffuse laterally under the spacer region and simultaneously acceptors (Boron) are redistributed from the central axis region of the fin towards the Si/SiO2 interface. As a consequence both drive current and peak cut-off frequency of an n-FinFET are observed to improve with RTA temperatures. Volume inversion and hence the flow of carries through the central axis region of the fin due to reduced scattering was found behind the performance improvements with increasing RTA temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.372-372
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• 2013

기존의 MOSFET 구조의 소자는 비례 축소에 의한 단 채널효과, 누설전류, 신뢰성 문제 같은 어려움에 직면해 있다. 이로 인해 20 nm 이하 소자 크기에서 기존의 MOSFET을 대체할 여러가지 차세대 소자에 대한 연구가 활발히 진행 되고 있다. 그 중에서 FinFET 소자는 비례 축소에 용이하고 누설전류 문제에 대한 장점으로 인해 활발한 연구가 진행되고 있다. 기존의 FinFET 소자에 대한 연구는 FinFET 구조를 이용한 메모리 소자의 전기적 특성의 향상, fin의 크기에 따른 소자의 특성 변화와 FinFET 구조의 물질 변화에 따른 전기적 특성 변화에 대한 연구가 많이 이루어져 왔다. 실제 공정에서의 fin의 형태 변화에 따른 전기적 특성변화에 대한 연구가 필요하다. 본 연구에서는 fin의 모서리의 모양의 변화에 따른 FinFET 소자의 전기적 특성 변화를 관찰하였고 전하 수송 메커니즘을 규명하였다. 실제 FinFET 소자의 공정에서 fin의 형태는 이상적인 직육면체 모양이 아니라 옆면이 기울고 모서리가 곡선이 되게 된다. 이로 인한 전자의 이동도 변화로 인해 소자의 성능이 변화하게 된다. FinFET의 경우 채널을 구성하는 fin의 각 면의 Si의 orientation이 다르다. 또한 fin의 모서리의 모양이 변화 함에 따라 채널영역의 orientation이 변화 하게 된다. 이에 따라 fin의 모서리 모양의 변화에 따른 소자의 전기적 특성 변화를 multi-orientation mobility model을 포함한 three-dimensional TCAD 시뮬레이션을 통해 계산하였다. 옆면과 윗면이 만나는 모서리의 모양의 곡률의 크기를 증가하여 다양한 fin의 형태에서 전기적 특성을 관찰하였다. Fin의 옆면과 윗면이 만나는 모서리의 곡률이 증가함에 따라 depletion 영역의 크기 변화와 채널에서의 전자의 밀도와 이동도의 변화를 관찰하였고 이를 토대로 fin의 형태 변화가 FinFET 소자의 전기적 특성에 미치는 영향을 조사하였다.

• Vacuum Magazine
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• v.3 no.1
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• pp.16-21
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• 2016

FinFETs are able to be scaled down to 22 nm and beyond while suppressing effectively short channel effect, and have superior performance compared to 2-dimensional (2-D) MOSFETs. Bulk FinFETs are built on bulk Si wafers which have less defect density and lower cost than SOI(Silicon-On-Insulator) wafers. In contrast to SOI FinFETs, bulk FinFETs have no floating body effect and better heat transfer rate to the substrate while keeping nearly the same scalability. The bulk FinFET has been developed at 14 nm technology node, and applied in mass production of AP and CPU since 2015. In the development of the bulk FinFETs at 10 nm and beyond, self-heating effects (SHE) is becoming important. Accurate control of device geometry and threshold voltage between devices is also important. The random telegraph noise (RTN) would be problematic in scaled FinFET which has narrow fin width and small fin height.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.4
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• pp.56-61
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• 2015

Ideal and stretch-out C-V curve were shown at high frequency using SiGe p-FinFET simulation. Average interface trap density can be extracted by the difference of voltage axis on ideal and stretch-out C-V curve. Also, interface trap density(Dit) was extracted by Terman's method that uses the same stretch-out of C-V curve with interface trap characteristic, and average interface trap density was calculated at same energy level. Comparing the average interface trap density, which was found by method using difference of voltage, with Terman's method, it was verified that the two methods almost had the same average interface trap density.

• Journal of Korean society of Dental Hygiene
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• v.12 no.3
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• pp.513-520
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• 2012

Objectives : In this study, contact angle and shore D hardness were measured, and a shark fin test was conducted after selecting five addition silicon(Blu-Mousse, BM; EXABITE II, EX; PERFECT, PF; Regisil$^{(R)}$ Rigid, RE; Silagum$^{(R)}$, SI) in order to figure out the properties of elastomeric interocclusal recording materials and reduce errors at interocclusal recording. 8) Methods : A contact angle was measured using a contact angle analyzer. After placing a drop of liquid on the surface of the specimens of interocclusal recording materials, a contact angle was photographed with a CCD camera on the equipment. In terms of a shark fin test, interocclusal recording materials were mixed for the time proposed by the manufacturer and inserted into the split ring of the Shark fin device. Twenty (20) seconds exactly, a metal rod was removed to make the materials slowly absorbed. Once they hardened, fin height was measured with a caliper after separating molds and trimming the specimens. The shore D hardness was measured with a shore D hardness tester(Model HPDSD, Hans Schmidt & Co. Gmbh, Germany) in sixty (60) minutes after fabricating specimens. In each experiment, five specimens, mean and standard deviation were calculated. A one-way ANOVA test was performed at the p>0.05 level of significance. In terms of correlation among the tests, Pearson correlation coefficient was estimated. For multiple comparison, Scheffe's test was carried out. Results : A contact angle was the highest in EX with $99.23^{\circ}$ (p<0.05) while the result of the shark fin test was the longest in RE with 5.45mm. SI was the lowest (0.27mm) with statistical significance. Among the interocclusal recording materials, significant difference was observed in terms of means (p<0.05). The shore D hardness was the highest in SI with 31.0 while RE was significantly low with 16.4 (p<0.05). Among the materials, statistically significant difference was observed in terms of means when compared to the rest materials (RE), BM, RE and SI (PF and EX) and the remaining materials (BM and SI) (p<0.05). In terms of correlations among the tests, a negative correlation occurred between shore D hardness and shark fin test(r=-0.823, p=0.000). Conclusions : According to the study above, it is necessary to understand the properties of interocclusal recording materials and consider contact angle, shark fin test and properties of shore D hardness to select appropriate materials.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.271-276
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• 2017

The triple-gate tunnel FETs encapsulated with an epitaxial layer (EL TFETs) is proposed to lower the subthreshold swing of the TFETs. Furthermore, the band-to-band tunneling based on the maximum electric-field can occur thanks to the epitaxial layer wrapping the Si fin. The performance and mechanism of the EL TFETs are compared with the previously proposed TFET based on simulation.

• Journal of architectural history
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• v.26 no.1
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• pp.45-59
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• 2017

The purpose of the present study is to figure out what the issues faced by architecture were at the time immediately before the transition to modern era centering of the works of Otto Wagner who acted in Vienna, Austria at the Fin de $si{\grave{e}}cle$. Therefore, the following points were examined in the present study; first, how were new spaces necessary to accommodate modern lives organized and how were the plans changed; second, how did the external expressions of architecture pursued by Otto Wagner appeared between arts and technologies, between historicism and modernity, and between decorations and functions. Through the study, it could be seen that Wagner began from historicism and traditionalism and tried to compromise them with modernity. Many modern characteristics appeared a priori in Wagner's works from the construction of 'Linke Wien Zeile housing block' in 1898, his works completely broke from the typical historicism styles to open the period of inventive 'Secession styles.' At that time, Wagner concentrated on so called 'flat decorations.' Thereafter, his residential architecture completed to modern styles with 'Neustiftgasse housing block' as the peak. The characteristics of modern housing as above became a cornerstone of the modern functionalism later.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.2
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• pp.156-163
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• 2008

We proposed a new $p^+/n^+$ gate locally-separated-channel (LSC) bulk FinFET which has vertically formed oxide region in the center of fin body, and device characteristics were optimized and compared with that of normal channel (NC) FinFET. Key device characteristics were investigated by changing length of $n^+$ poly-Si gate ($L_s$), the material filling the trench, and the width and length of the trench at a given gate length ($L_g$). Using 3-dimensional simulations, we confirmed that short-channel effects were properly suppressed although the fin width was the same as that of NC device. The LSC device having the trench non-overlapped with the source/drain diffusion region showed excellent $I_{off}$ suitable for sub-50 nm DRAM cell transistors. Design of the LSC devices were performed to get reasonable $L_s/L_g$ and channel fin width ($W_{cfin}$) at given $L_gs$ of 30 nm, 40 nm, and 50 nm.