• Proceedings of the KIPE Conference
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• 2015.07a
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• pp.159-160
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• 2015

Recently, it is increased to use the portable device with small size. It is also increasing for demand of a small size adapter. To reduce the size of components, switching frequency has to be increased. But it causes higher switching loss and temperature of components. Especially, the temperature of adapter must be limited because adapter can be easily touched when portable device is being charged. To reduce temperature of adapter, high efficiency is essential. To solve this problem, this paper proposes design of resonance frequency optimization for LLC converter with high efficiency and low temperature of passive components.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.154-159
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• 2003

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.165-169
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• 2012

Power semiconductor devices are widely used as high voltage applications to inverters and motor drivers, etc. The blocking voltage is one of the most important parameters for power semiconductor devices. And cause of junction curvature effects, the breakdown voltage of the device edge and device unit cells was found to be lower than the 'ideal' breakdown voltage limited by the semi-infinite junction profile. In this paper, Propose the methods for field ring design by DOE (Design of Experimentation). So The field ring can be improve for breakdown voltage and optimization.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.59-63
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• 2005

A simulation method combined with the simulation program with integrated circuit emphasis (SPICE) and the technology computer-aided design (TCAD) has been proposed to estimate the electrical characteristics of the metal-ferroelectric-semiconductor field effect transistor (MFS/MFISFET). The complex behavior of the ferroelectric property was analyzed and surface potential of the channel region in the MFS gate structure was calculated with the numerical TCAD method. Since the calculated surface potential is equivalent with the surface potential obtained with the SPICE model of the conventional MOSFET, we can obtain the current-voltage characteristics of MFS/MFISFET corresponding to the applied gate bias. Therefore, the proposed method will be very useful for the design of the integrated circuits with MFS/MFISFET memory cell devices.

• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.82-87
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• 2019

One of the most critical aspects of the semiconductor industry is the quality of the wafer surface. And the vibrations of wafer grinder are supposed to be the most dominant factors to damage the wafer surface quality. In this study, structure of a wafer grinder has been analyzed through experiments and computer simulations to figure out the main reasons of the vibrations. And the design alterations based on the analysis were applied to identify the effects of those alterations on the vibration suppression. The result shows that the design alterations can effectively suppress about 90% of the vibrations.

• Journal of the Semiconductor & Display Technology
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• v.7 no.4
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• pp.23-28
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• 2008

A high speed automated pitch variation unit (HAPU) related to semiconductor category sorting movement of the test handler system was developed. In the design process, 'DMADOV' step of 6-Sigma method has been applied. The design result for the desirable pitch variation was a 3:1 reduction rack-pinion and a linkage which are operated by servomotors. The realization and reliability of the mechanism was obtained at the design stage by FEM analysis, and by robust design using Taguchi orthogonal array against weight and deformation. Finally, the validity of the high speed variation mechanism was confirmed via inspection using a high speed camera while performing pitch variation.

• Journal of the Semiconductor & Display Technology
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• v.6 no.3
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• pp.7-11
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• 2007

The design and manufacture of injection-molded parts with desired properties is a costly process dominated by empiricism, Including the repeated modification of actual tooling. The objective of this study is to obtain the good design of injection-molded polymeric parts using axiomatic design approach.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.11
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• pp.17-28
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• 1995

In this paper, we developed a two-dimensional numerical simulator which could analyze the stripe geometry semiconductor laser diodes by modifying the commercial semiconductor device simulator, MEDICI. In order to study the characteristics of semiconductor laser diodes, it is necessary to solve the Helmholtz wave equation and photon rate equation in addition to the basic semiconductor equations. Also the recombination rates due to the spontaneous and the stimulated emissions should be included, which are very important recombination mechanisms in semiconductor laser diodes. Therefore, we included the solution routines which analyzed the Helmholtz wave equation and the photon rate equation and two important recombination rates to simulate the semiconductor laser diodes. Then we simulated the gain-guiding and index-guiding DH(Double Heterostructure) semiconductor laser diodes to verify the validity of the implemented functions. The results obtained from simulation are well consistent with the previously published ones. This allows us to know the operating characteristics of DH laser diodes and is expected to use as a tool for optimum design.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.91-96
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• 2017

One of the most critical aspects of the modern semiconductor industry is the quality of wafer surface, the roughness of which is mostly caused by the ingot slicing. And the grinding is supposed to be the main process to reduce the surface roughness. The vibrations of the disc surface grinder are the major problem to effectively achieve the required surface quality. In this study, the structure of a disc surface grinder was analyzed through the experiment and the computer simulation to investigate the dynamic characteristics of the machine, and further to alter the design for the improved stability. The result of the study shows that simple design alterations without alternating main body can effectively suppress the vibrations of the machine.

• Korean Journal of Optics and Photonics
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• v.32 no.3
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• pp.101-107
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• 2021

In this paper, a study of the design of automotive communication lamps using microlens arrays (MLAs) was conducted. With the development of autonomous driving technology, automobiles need communication lamps to communicate with pedestrians. To reduce the size of the optical system and secure high light intensity, the communication lamp's optical system was designed using an MLA. In addition, to secure a clear image on inclined ground, the design was carried out considering the overlap method. After that, the improved performance was confirmed by comparing it to the MLA optical system before overlapping.