• Korean Journal of Materials Research
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• v.17 no.5
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• pp.273-277
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• 2007

Vertically aligned Zinc Oxide rod arrays were grown by the self-assembly hydrothermal process on the GaN epitaxial layer which has a same lattice structure with ZnO. Zinc nitrate and DETA solutions are used in the hydrothermal process. The $(HfO_2)$ thin film was deposited on GaN and the patterning was made by the photolithography technique. The selective growth of ZnO rod was achieved with the patterned GaN substrate. The fabricated ZnO rods are single crystal, and have grown along hexagonal c-axis direction of (002) which is the same growth orientation of GaN epitaxial layer. The density and the size of ZnO rod can be controlled by the pattern. The optical property of ordered array of vertical ZnO rods will be discussed in the present work.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.11
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• pp.925-931
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• 2007

We successively fabricated the Ni metal mask by additive method and evaluated the effects of wetting agents addition on the microstructure, hardness, and friction coefficient. In the process, the additive patterns with fine hole and pitch were made by photolithography technique and subsequently Ni plate was electroformed on the patterns. We found that the microstructure and mechanical properties were significantly varied when the different combinations of the wetting agents were used. When the wetting agents of both SF-1 and SF-2 were added, the microstructure consisted of crystal and amorphous phases, the grain size reduced to 5-40 nm, the RMS value decreased to 11.4 nm and the wear resistance improved. In addition, the hardness was as high as 638 Hv which is higher than that of commercial stainless steel mask and this improvement is probably due to the presence of amorphous Phase and fine grain size. The improvement of the wear resistance can provide a higher reliability and a longer service life.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.12
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• pp.871-876
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• 2014

Efficiency of crystalline Si solar cell can be maximized as minimizing optical loss through antireflection texturing with inverted pyramids. Even if cost-competitive, soft lithography can be employed instead of photolithography for the purpose, some limitations still remain to apply the soft lithography directly to as-received solar grade wafer with a bunch of micro trenches on surface. Therefore, it is needed to develop a low-cost, effective planarization process and evaluate its output to be applicable to patterning process with PDMS stamp. In this study new surface planarization process is proposed and the change of micro scale trenches on the surface as a function of etching time is observed. Also, the effect of trenches on pattern quality by soft lithography is investigated using FEM structural analysis. In conclusion it is clear that the geometry and shape of trenches would be basic considerations for soft lithography application to low quality wafer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.416-417
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• 2007

MmSH injection molding method to fabricate light guiding plate with nano-sized pattern was developed. A stamper was fabricated through photolithography, dry etching, and electroplating processes. While the stamper with nano-sized pattern in mold was kept at $180^{\circ}C$ during injection process, that was cooled down to $90^{\circ}C$ quickly after the injection process. The nano-sized pattern on light guiding plate processed by MmSH injection molding method was well transferred from stamper compared to that processed by conventional injection molding process.

• Journal of the Korean Society for Heat Treatment
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• v.31 no.2
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• pp.63-67
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• 2018

Recent mold industry uses many roll-to-roll processes that can produce high production speed and precision machining and automation process. In the circular cylinder mold, however, patterns of less than $10{\mu}m$ are difficult to manufacture and maintain. In this study, we fabricated a circular cylindrical mold with a DLC thin film which have high hardness, low coefficient of friction and high releasability by using lithography and lift-off process. The height, line width, and pitch of the fabricated DLC macro pattern are $3.1{\mu}m$, $9.1{\mu}m$ and $20.2{\mu}m$, respectively. The pattern size is finer than the current applied to the aluminum cylinder type, and this shows the possibility of practical use of DLC micro pattern roll mold.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.4
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• pp.106-112
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• 2021

Thermoplastic microfluidic devices are used in BioMEMS for medical and biotechnology applications, such as gene extraction, DNA analysis, and virus detection. In this research, a simple fabrication protocol with a commercially available pneumatic hot press is proposed and demonstrated for polycarbonate microfluidic devices. Microfluidic channels with a width of 200 ㎛ and a height of 10 ㎛ were designed and machined onto a brass plate as a mold insert using a CNC milling machine. The resulting microfluidic channels on the mold insert were assessed and found to have an actual width of 198 ㎛ and a height of 10 ± 0.25 ㎛. The microfluidic channels were replicated on a polycarbonate sheet using the proposed replication technique at 146℃ for 20 minutes under a constant load of 2400 kgf. The devices were then naturally cooled to 100℃ while maintaining the same pressure. It was found that the microchannels were successfully replicated in the polycarbonate, with a width of 198 ㎛ and a height of 10.07 ㎛. The proposed replication technique thus offers the rapid mass production of high-quality microfluidic devices at a low cost with a process that, unlike conventional photolithography systems, does not require expensive equipment.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.48 no.2
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• pp.28-34
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• 2011

In previous reports, we investigated a selective assembly method of fabricating single-walled carbon nanotubes (SWCNTs) on a silicon-dioxide ($SiO_2$) surface by using only a photolithographic process. In this paper, we have fabricated field effect transistors (FETs) with SWCNT channels by using the technique mentioned above. Also, we have electrically measured gating effects of these FETs under different source-drain voltages ($V_{SD}$). These FETs have been fabricated for sensor applications. Photoresist (PR) patterns have been made on a $SiO_2$-grown silicon (Si) substrate by using a photolithographic process. This PR-patterned substrate have been dipped into a SWCNT solution dispersed in dichlorobenzene (DCB). These PR patterns have been removed by using aceton. As a result, a selectively-assembled SWCNT channels in FET arrays have been obtained between source and drain electrodes. Finally, we have successfully fabricated 4 FET arrays based on SWCNT-channels by using our simple self-assembly technique.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1518-1521
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• 2005

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its usage in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries This paper focus to apply the sputtering technology accumulated by experiments to 3d structure fabrication with high resolution. Therefore some verifications and discussions of the characteristics of FIB sputtering results according to focal length were described in this paper. And we suggested the definition of rectangular pattern profile and made the verifications of sputtering results based on definition of it.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.3 s.180
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• pp.56-60
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• 2006

A high-resolution shadow mask, or called a nanostencil was fabricated for high resolution lithography. This high-resolution shadowmask was fabricated by a combination or MEMS processes and focused ion beam (FIB) milling. 500 nm thick and $2{\times}2mm$ large membranes wore made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 70 nm could be made into the membrane. By local deposition through the apertures of nanostencil, nanoscale patterns down to 70 nm could be achieved.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.1 s.190
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• pp.79-84
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• 2007

Some surface pattern of tribological application is an attractive technology of engineered surface. Therefore, friction reduction is considered to be necessary for improved efficiency of machine. This study investigated the effect of friction property for angles of micro-crosshatch groove surface pattern on bearing steel using pin-on-disk test. We obtain sample which can be fabricated by photolithography process. We discuss the friction property depend on an angle of crosshatch groove surface pattern. We can verify the lubrication mechanism as Stribeck curve, which has a relationship between the friction coefficient and a dimensionless parameter under the lubrication condition. It was found that the friction coefficient was related to angle of crosshatch groove pattern on contact surface.