DOI QR코드

DOI QR Code

Fabrication and Characterizations of Nickel Metal Mask with fine Pitch by Additive Process

Additive 공정을 이용한 미세 피치용 니켈 메탈마스크의 제조 및 특성평가

  • 박의철 (성균관대학교 신소재공학부) ;
  • 임준형 (성균관대학교 신소재공학부) ;
  • 김규태 (성균관대학교 신소재공학부) ;
  • 박시홍 (성균관대학교 신소재공학부) ;
  • 황수민 (성균관대학교 신소재공학부) ;
  • 심종현 (성균관대학교 신소재공학부) ;
  • 정승부 (성균관대학교 신소재공학부) ;
  • 김봉수 (에프앤비테크) ;
  • 주진호 (성균관대학교 신소재공학부)
  • Published : 2007.11.01

Abstract

We successively fabricated the Ni metal mask by additive method and evaluated the effects of wetting agents addition on the microstructure, hardness, and friction coefficient. In the process, the additive patterns with fine hole and pitch were made by photolithography technique and subsequently Ni plate was electroformed on the patterns. We found that the microstructure and mechanical properties were significantly varied when the different combinations of the wetting agents were used. When the wetting agents of both SF-1 and SF-2 were added, the microstructure consisted of crystal and amorphous phases, the grain size reduced to 5-40 nm, the RMS value decreased to 11.4 nm and the wear resistance improved. In addition, the hardness was as high as 638 Hv which is higher than that of commercial stainless steel mask and this improvement is probably due to the presence of amorphous Phase and fine grain size. The improvement of the wear resistance can provide a higher reliability and a longer service life.

Keywords

References

  1. J. Kloeser, K. Heinricht, E. Jung, L. Lauter, A. Ostmann, R. Aschenbrenner, and H. Reichl, 'Low cost bumping by stencil printing: process qualification for 200 ${\mu}m$ pitch', Microelectronics Reliability, Vol. 40, p. 497, 2000 https://doi.org/10.1016/S0026-2714(99)00237-1
  2. C.-W. Ju, S.-J. Kim, K.-H. Pack, H.-T. Lee, B.-S. Han, S.-S. Park, and Y.-I. Kang, 'Fabrication of wafer level fine pitch solder bump for flip chip application', J. of KIEEME(in Korean), Vol. 14, No. 11, p. 874, 2001
  3. Y. P. Kathuria, 'L3: Laser, LIGA and lithography in microstructuring', J. Indian Inst. Sci., Vol. 84, p. 77, 2004
  4. Marc J. Madou, 'Fundamentals of microfabrication', CRC press, p. 35, 2002
  5. M. Meozzi, 'Special use of the ball on disc standard test', Tribology International, Vol. 39, p. 496, 2006 https://doi.org/10.1016/j.triboint.2005.03.011
  6. Y. Y. Wu, D.-Y. Chang, D.-S. Kim, and S.-C. Kwon, 'Effects of 2-butyne-1,4-diol on structures and morphologies of electroplating Ni - W alloy', Surface and Coatings Technology, Vol. 162, p. 269, 2003 https://doi.org/10.1016/S0257-8972(02)00699-0
  7. P. Sibley and P. A. Brook, 'The effect of addition agents on the electrical resistivity of electrodeposited nickel', Electrodeposition and Surface Treatment, Vol. 1, p. 439, 1972 https://doi.org/10.1016/0300-9416(73)90027-8
  8. N. Kanani, 'Electroplating Basic principles, processes and practice', Elsevier, p. 63, 2004
  9. C.-M. Cheng and R.-H. Chen, 'Experimental investigation of fabrication properties of electroformed Ni-based micro mould inserts', Microelectronic Engineering, Vol. 75, p. 423, 2004 https://doi.org/10.1016/j.mee.2004.07.066
  10. David B. Williams and C. Barry Carter, 'Transmission electron microscopy : Diffraction', Springer, p. 274, 1996
  11. Frederick A. Lowenheim, 'Modern electroplating', Wiley, p. 26, 1942
  12. K. P. Wong, K. C. Chan, and T. M. Yue, 'Influence of spike current in different shaped waveforms on the hardnesses and grain size of nickel electroforms', Journal of Materials Processing Technology, Vol. 117, p. 97, 2001 https://doi.org/10.1016/S0924-0136(01)01106-2
  13. R. Liu and D. Y. Li, 'Modification of Archard's equation by taking account of elastic/pseudoelastic properties of materials', Wear, Vol. 251, p. 956, 2001 https://doi.org/10.1016/S0043-1648(01)00711-6
  14. K. Holmberg, 'A concept for friction mechanisms of coated surfaces', Surface and Coatings Technology, Vol. 56, p. 1, 1992 https://doi.org/10.1016/0257-8972(92)90189-H