• ETRI Journal
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• v.27 no.5
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• pp.497-503
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• 2005

In this paper, we present a performance analysis for an MPEG-4 video codec based on the on-chip network communication architecture. The existing on-chip buses of system-on-a-chip (SoC) have some limitation on data traffic bandwidth since a large number of silicon IPs share the bus. An on-chip network is introduced to solve the problem of on-chip buses, in which the concept of a computer network is applied to the communication architecture of SoC. We compared the performance of the MPEG-4 video codec based on the on-chip network and Advanced Micro-controller Bus Architecture (AMBA) on-chip bus. Experimental results show that the performance of the MPEG-4 video codec based on the on-chip network is improved over 50% compared to the design based on a multi-layer AMBA bus.

• Journal of KIISE:Computer Systems and Theory
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• v.32 no.9
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• pp.465-474
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• 2005

For high density SoC design, on-chip communication based on bus interconnection encounters bandwidth limitation while an NoC(Network-on-Chip) approach suffers from unacceptable complexity in its Implementation. This paper introduces a new on-chip communication protocol, SNP (SoC Network Protocol) to overcome these problems. In SNP, conventional on-chip bus signals are categorized into three groups, control, address, and data and only one set of wires is used to transmit all three groups of signals, resulting in the dramatic decrease of the number of wires. SNP efficiently supports master-master communication as well as master-slave communication with symmetric channels. A sequencing rule of signal groups is defined as a part of SNP specification and a phase-restoration feature is proposed to avoid redundant signals transmitted repeatedly over back-to-back transactions. Simulation results show that SNP provides about the same bandwidth with only $54\%$ of wires when compared with AMBA AHB.

• Smart Media Journal
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• v.1 no.1
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• pp.27-35
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• 2012

In this paper, the performance analysis for multimedia video codec(MPEG-4, H.264) on on-chip network communication architecture is presented. The On-Chip Network (OCN) is the new communication architecture of multimedia SoC design that overcomes the limits of On-Chip Bus architecture by providing higher data traffic bandwidth, reusability and higher scalability. We compared the performance of MPEG-4, H.264 decoder based on-chip network and AMBA on-chip bus. Experimental results show that the performance of MPEG-4, H.264 based on on-chip network is improved over 33~56% compared to the design based on AMBA on-chip bus.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.7
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• pp.641-648
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• 2002

The study on the chip waveform design to minimize multiple-access interference (MAI) and its performance evaluation are very important since chip waveform decides the signal quality and system capacity of the direct-sequence CDMA wireless communication system. This paper suggests the analytical chip waveform to minimize the MAI. The BER and throughput performances achieved by the proposed analytical optimum chip waveform are compared with those of the conventional chip waveforms in the Nakagami-m distribution frequency selective channel when the differential phase shift keying (DPSK) is employed in DS-CDMA system. From the numerical results, capacity and throughput are improved about 2 times and 1.4 times respectively when it is compared with the Kaiser chip waveform that is considered as one of the best in the conventional ones.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.4
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• pp.696-706
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• 2007

Multiprocessor system on chip (MPSoC) platform has set a new innovative trend for the System on Chip (SoC) design. With the rapidly approaching billion transistors era, some of the main problem in deep sub-micron technologies characterized by gate lengths in the range of 60-90 nm will arise from non scalable wire delays, errors in signal integrity and un-synchronized communication. These problems may be addressed by the use of Network on Chip (NOC) architecture for future SoC. Most future SoCs will use network architecture and a packet based communication protocol for on chip communication. This paper presents an adaptive wormhole routing with proactive turn prohibition to guarantee deadlock free on chip communication for NOC architecture. It shows a simple muting architecture with five full-duplex, flit-wide communication channels. We provide simulation results for message latency and compare results with those of dimension ordered techniques operating at the same link rates.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.8
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• pp.80-88
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• 2007

High adaptability and scalability are two critical issues in implementing a very complex system in a single chip. To obtain high adaptability and scalability, novel system design methodology known as communication-based system design has gained large attention from SoC designers. NoC (Network-on-Chip) is such an on-chip communication-based design approach for the next generation SoC design. To provide high adaptability and scalability, NoCs employ network interfaces and routers as their main communication structures and transmit and receive packetized data over such structures. However, data packetization, and routing overhead in terms of run time and area may cost too much compared with conventional SoC communication structure. Therefore, in this research, we propose a novel methodology which automatically generates a hybrid communication structure. In this work, we map traditional pin-to-pin wiring structure for frequent and timing critical communication, and map flexible and scalable structure for infrequent, or highly variable communication patterns. Even though, we simplify the communication structure significantly through our algorithm the connectivity or the scalability of the communication modules are almost maintained as the original NoC design. Using this method, we could improve the timing performance by 49.19%, and the area taken by the communication structure has been reduced by 24.03%.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.832-841
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• 2016

The voltage-frequency island (VFI) design paradigm has strong potential for achieving high energy efficiency in communication centric manycore system-on-chip (SoC) design called network-on-chip (NoC). However, because of the diminished scaling of wire-dimension and supply voltage as well as threshold voltage in modern CMOS technology, the vulnerability to link failure in VFI NoC is becoming a crucial challenge. In this paper, we propose an energy-optimized topology generation technique for VFI NoC to cope with permanent link failures. Based on the energy consumption model, we exploit the on-chip communication traffic patterns and characteristics of link failures in the early design stage to accommodate diverse applications and architectures. Experimental results using a number of multimedia application benchmarks show the effectiveness of the proposed three-step custom topology generation method in terms of energy consumption and latency without any degradation in the fault coverage metric.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.2
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• pp.168-174
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• 2012

This paper describes a novel global on-chip interconnect scheme, in which a one UI-delayed symbol as well as the current symbol is sent for easing the sensing operation at receiver end. With this approach, the voltage swing on the channel for reliable sensing can be reduced, resulting in performance improvement in terms of power consumption, peak current, and delay spread due to PVT variations, as compared to the conventional repeater insertion schemes. Evaluation for on-chip interconnects having various lengths in a 130 nm CMOS process indicated that the proposed on-chip interconnect scheme achieved a power reduction of up to 71.3%. The peak current during data transmission and the delay spread due to PVT variations were also reduced by as much as 52.1% and 65.3%, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.2 s.332
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• pp.65-72
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• 2005

We can integrate more IP blocks on a silicon die as the development of fabrication technologies and EDA tools. Consequently, we can design complicated SoC architecture including multi-processors. However, most of existing SoC buses have bottleneck in on-chip communication because of shared bus architectures, which result in the performance degradation of systems. In most cases, the performance of a multi-processor system is determined by efficient on-chip communication and the well-balanced distribution of computation rather than the performance of the processors. We propose an efficient SoC Network Architecture(SNA) using crossbar routers which provide a solution to ensure enough communication bandwidth. The SNA can significantly reduce the bottleneck of on-chip communication by providing multi-channels for multi-masters. According to the proposed architecture, we design a model system for the SNA. The proposed architecture has a better efficiency by $40\%$ than the AMBA AHB according to a simulation result.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.9
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• pp.259-269
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• 2012

With the lower supply voltage and the higher operating frequency in integrated circuits, the analysis of the power distribution network (PDN) including on-chip inductances becomes more important. In this paper, an effective inductance extraction method for a regular on-chip power grid structure is proposed. The loop inductance model applicable to chip layout is proposed and the inductance extraction tool using the proposed inductance model based on post layout RC circuits is developed. The accuracy of the proposed loop model and the developed tool is verified by comparing the test circuit simulation results with those from the partial element equivalent circuit (PEEC) model. The voltage fluctuation from the RLC circuits extracted by the developed tool was examined for the analysis of on-chip inductance effects. The significance of on-chip power grid inductance was investigated by the co-simulation of chip-package-PCB.