• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2000.11a
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• pp.46-46
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• 2000

• Journal of the Microelectronics and Packaging Society
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• v.30 no.2
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• pp.60-64
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• 2023

In this study, the electrical contact resistance characteristics between graphene and metals, which is one of important factors for the performance of graphene-based devices, were compared. High-quality graphene was synthesized by chemical vapor deposition (CVD) method, and Al, Cu, Ni, and Ti as electrode materials were deposited on the graphene surface with equal thickness of 50 nm. The contact resistances of graphene transferred to SiO₂/Si substrates and metals were measured by the transfer length method (TLM), and the average contact resistances of Al, Cu, Ni, and Ti were found to be 345 Ω, 553 Ω, 110 Ω, and 174 Ω, respectively. It was found that Ni and Ti, which form chemical bonds with graphene, have relatively lower contact resistances compared to Al and Cu, which have physical adsorption properties. The results of this study on the electrical properties between graphene and metals are expected to contribute to the realization of high-performance graphene-based devices including electronics, optoelectronic devices, and sensors by forming low contact resistance with electrodes.

• Journal of Korea Foundry Society
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• v.28 no.1
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• pp.31-36
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• 2008

Ti-Ni-Cu alloys are very attractive shape memory alloys for applications as actuators because of a large transformation elongation and a small transformation hysteresis. Rapidly solidified Ti-Ni alloy ribbons have been known to have the shape memory effect and superelasticity superior to the alloy ingots fabricated by conventional casting. In this study, solidification structures and shape memory characteristics of $Ti-Ni_{30}-Cu_{20}$ alloy ribbons prepared by melt spinning were investigated by means of DSC and XRD. Operating parameters to fabricate the amorphous ribbons were the wheel velocity of 55 m/s and the melt spinning temperature of $1500^{\circ}C$. The crystallization temperature was measured to be $440^{\circ}C$. The crystallized ribbons exhibited very fine microstructure after annealing at $440^{\circ}C$ for 10 minutes and $460^{\circ}C$ for 5 minutes and was deformed up to about 6.8% and 6.23% in ductile manner, respectively. Stress-strain curve of the ribbon exhibited a flat stress-plateau at 64 MPa and this is associated with the stress-induced a B2-B19 martensitic transformation. During cycle deformation with the applied stress of 220 MPa, transformation hysteresis and elongation associated with the B2-B19 transformation were observed to be $4.3^{\circ}C$ and 3.6%.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.99-102
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• 2003

Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.9-11
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• 2001

차세대 고속 DRAM기술에 사용될 금속인 Cu의 확산 방지막(diffusion harrier) 물질로는 Ta 또는 W 같은 Refractory metal 이 융점(melting point)이 높고 저항값이 낮아 많이 연구 보고되고 있으나, 본 논문에서는 초고주파 소자에서 Au의 확산 방지 막으로 많이 사용되고 있으며. 선택적 증착이 용이한 Pt과 Ni를 MOS 소자의 Cu 확산 방지 막으로 적용하며 어닐링한 후 소자의 게이트 산화막 누설전류($I_{leak}$), 그리고. Si/$SiO_2$ 계면의 trap density 등의 변이를 측정하여 Cu가 소자의 특성 열화에 미치는 영향을 연구하였다. 실험 결과 Pt/Ti($200{\AA}/100{\AA}$)를 적용한 경우 소자 측성 열화가 가장 적었으며. 이는 Copper의 확산 방지막으로 Pt/Ti를 사용하여 전기적 특성 및 계면 특성을 개선시킬 수 있음을 보여 주었다. 이는 SIMS Profile을 통해서도 확인하였다.

• Journal of the Korean Ceramic Society
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• v.36 no.8
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• pp.835-842
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• 1999

Si3N4 -Si3N4 joints were made using Ag-Cu-Ti and Ag-Cu-In-Ti via brazing method and the change in joint strength was investigated after heat treatment at $400^{\circ}C$ or $650^{\circ}C$ for up to 2000h. The initial strength of as-brazed joints with Ag-Cu-In-Ti was lower but the reduction of the strength was less dramatic than that with Ag-Cu-Ti. The joints made of a new brazing alloy Au-Ni-Cr-Mo-Fe which is developed for high temperature applications were heat-treated at $650^{\circ}C$ for 1000h. As the heat treatment time increased the bond strength increased. The results of the joining system with Mo or Cu interlayer showed that the strength of the joint with Mo interlayer was higher but the system incurred problems in joint production Also it was found from oxidation experiment that Ti and In affected the oxidation resistance of brazing alloy.

• Economic and Environmental Geology
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• v.34 no.3
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• pp.283-299
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• 2001

The middle cover soils and clay liners collected from the Kumheung landfill in Gongiu City were analysed for As, Ba, Cd, Co, Cr, Cu, Fe, Mn, Ni, Pb, Sr, Ti and Zn concentrations using 0.] N HCl digestion and total/sequential extraction experiments followed by ICP-AES determination. The uncontaminated soil and sediment samples were also analyzed for the comparison. The results of sequential extraction showed that Cu was dominant in the oxidizable fraction, and As, Ni, Sr, Ba, and Mn were in the exchangeable fraction. Zinc and Mn occurred mostly in association with reducible, residual and carbonate fractions. Most of Cd and Pb were bound to the reducible and oxidizable fractions. The main carrier of Co, Cr, Fe and 11 was the residual fraction and another important carrier was the reducible fraction. The percentage of the metals of organically-bound form in the middle cover soils and clay liner was in the order of Cu(48%) > Ti(42%) > Pb(27%) > As(25%) > Cd(20%). As deduced from sequential extraction analysis, potential order of metal mobility in the middle cover soils and clay liner from the landfill was proposed: Cd > Sr > As > Ni > Mn > Ba > Cu > Pb > Zn » Co > 11 > Fe > Cr. Based on the 'geoaccumulation index' and the 'enrichment factor' normalized to A], the level of contamination of Cu, Ni and C1' was significant in the samples from Kumheung landfill and surrounding farmland. Their enrichments were attributed partly to anthropogenic pollutions.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.663-663
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• 2013

We prepared Cu oxides, and Ni and Pd-TiO2@SiO2 core-shellnanostructures, and tested their CO oxidation performances by temperature-programmed mass spectrometry. We found the starting temperatures of CO oxidation are around $200^{\circ}C$ and $300^{\circ}C$ for Ni and Pd-TiO2@SiO2 nanostructures, respectively. Cu oxides are cubes with 50~200 nm with, prepared with different concentrations of NaOH and ascorbic acid. For the core-shell structures, we prepared 100 nm SiO2 spheres, first coated the surface with TiO2 precursor, and then coated with Ni and Pd. Their characteristics are further examined by scanning electron microscopy, optical microscope, FT-IR, and UV-Vis absorption spectroscopy.

• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.24-27
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• 2011

Effect of substitution of Mn for Ni on transformation behavior, shape memory characteristics and superelasticity of Ti45Ni-5Cu alloy has been investigated by means of electrical resistivity measurements, X-ray diffraction, thermal cycling tests under constant load and tensile tests. The one-stage B2-B19' transformation occurred when Mn content was 0.5 at%, above which the two-stage B2-B19-B19' transformation occurred. A temperature range where the B19 martensite exists was expanded with increasing Mn content because decreasing rate of Ms (60 K / % Mn) was larger than that of Ms' (40 K / % Mn). Ti-(45-x)Ni-5Cu-xMn alloys were deformed in plastic manner with a fracture strain of 60 % ~ 32 % depending on Mn content. Clear superelasticity was found in fully annealed Ti-(45-x)Ni-5Cu-xMn alloys with Mn content more than 1.0 at%, which was ascribe to a solid solution hardening by substitution of Mn for Ni.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1057-1058
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• 2006

The preparation of $Ti_{50}Cu_{28}Ni_{15}Sn_7$ metallic glass composite powders was accomplished by the mechanical alloying of a pure Ti, Cu, Ni, Sn and carbon nanotube (CNT) powder mixture after 8 h milling. In the ball-milled composites, the initial CNT particles were dissolved in the Ti-based alloy glassy matrix. The bulk metallic glass composite was successfully prepared by vacuum hot pressing the as-milled CNT/$Ti_{50}Cu_{28}Ni_{15}Sn_7$ metallic glass composite powders. A significant hardness increase with the CNT additions was observed for the consolidated composite compacts.