Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Intermetallic Compound Formation Behavior and Bump Shear strength at Sn-In Eutectic Solder/UBM Interface

  • Choi Jae-Hoon (Department of Materials Science and Engineering, Hongik University) ;
  • Jun Sung-Woo (Department of Materials Science and Engineering, Hongik University) ;
  • Jung Boo-Yang (Department of Materials Science and Engineering, Hongik University) ;
  • Oh Tae-Sun (Department of Materials Science and Engineering, Hongik University) ;
  • Kim Young-Ho (Division of Materials Science and Engineering, Hanyang University)
  • Published : 2003.11.01
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Abstract

Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm $Ti/8{\mu}m$ Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.

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