• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.381-384
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• 2001

This paper describes the features and development of a RAM compiler that can generate low power, high speed, synchronous CMOS SRAM. The compiled SRAM can be configurable from 64bytes to 16Kbytes in one bank and has 2ns access time typically. Basic cells are developed using 2-poly, 4-metal 0.35um CMOS technology. This SRAM compiler is developed using SKIL $L^{TM}$ language and generates layout and schematic in Cadence environment.

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.11a
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• pp.58-58
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• 2002

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.1
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• pp.37-50
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• 2009

Evaluation results about area scaling capabilities of various SRAM margin-assist techniques for random $V_T$ variability issues are described. Various efforts to address these issues by not only the cell topology changes from 6T to 8T and 10T but also incorporating multiple voltage-supply for the cell terminal biasing and timing sequence controls of read and write are comprehensively compared in light of an impact on the required area overhead for each design solution given by ever increasing $V_T$ variation (${\sigma}_{VT}$). Two different scenarios which hinge upon the EOT (Effective Oxide Thickness) scaling trend of being pessimistic and optimistic, are assumed to compare the area scaling trends among various SRAM solutions for 32 nm process node and beyond. As a result, it has been shown that 6T SRAM will be allowed long reign even in 15 nm node if ${\sigma}_{VT}$ can be suppressed to < 70 mV thanks to EOT scaling for LSTP (Low Standby Power) process.

• Proceedings of the Korea Information Processing Society Conference
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• 2013.05a
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• pp.21-23
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• 2013

Static Random Access Memory (SRAM) using CMOS technology has many advantages. It does not need to refresh every certain time, as a result, the speed of SRAM is faster than Dynamic Random Access Memory (DRAM). This is the reason why SRAM is widely used in almost processors and system on chips (SoC) which require high processing speed. Two basic operations of SRAM are read and write. We consider two basic factors, including the accuracy of read and write operations and the speed of these operations. In our paper, we propose the read and write assist circuits for SRAM. By adding a power control circuit in SRAM, the write operation performed successfully with low error ratio. Moreover, the value in memory cells can be read correctly using the proposed pre-charge method.

• Journal of IKEEE
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• v.23 no.3
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• pp.954-961
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• 2019

This paper suggests an advanced 8T SRAM which can operate properly in subthreshold voltage regime. The memory cell consists of symmetric 8 transistors, in which the latch storing data is controlled by a column-wise assistline. During the read, the data storage nodes are temporarily decoupled from the read path, thus eliminating the read disturbance. Additionally, the cell keeps the noise-vulnerable 'low' node close to the ground, thereby improving the dummy-read stability. In the write, the boosted wordline facilitates to change the contents of the memory bit. At 0.4 V supply, the advanced 8T cell achieves 65% higher dummy-read stability and 3.7 times better write-ability compared to the commercialized 8T cell. The proposed cell and circuit techniques have been verified in a 16-kbit SRAM array designed with an industrial 180-nm low-power CMOS process.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.39 no.2
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• pp.132-139
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• 2002

This paper describes a supply voltage detector and SRAM write driver circuit which dissipates small power. The supply voltage detector generates high signal when supply voltage is higher than reference voltage, but low signal when supply voltage is lower than reference voltage. The write driver utilizes two same-sized drivers to reduce operating current in the write cycle. In the case of lower supply voltage comparing to Vcc, both drivers are active the same as conventional write driver, while in the case of high Vcc only one of two drivers are active so as to deliver the half of the current. As a result of simulation using 0.6${\mu}{\textrm}{m}$ 3.3v/5v, CMOS model parameter, the proposed SRAM scheme shows a 22.6% power reduction and 12.7% PDP reduction at Vcc=3.3V, compared to the conventional one.

• The Magazine of the IEIE
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• v.24 no.6
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• pp.38-49
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• 1997

0.4mm Resign Rule의 Super Low Power Dissipation, Low Voltage. Operation-5- Full CMOS SRAM Cell을 개발하였다. Retrograde Well과 PSL(Poly Spacer LOCOS) Isolation 공정을 사용하여 1.76mm의 n+/p+ Isolation을 구현하였으며 Ti/TiN Local Interconnection을 사용하여 Polycide수준의 Rs와 작은 Contact저항을 확보하였다. p-well내의 Boron이 Field oxide에 침적되어 n+/n-well Isolation이 취약해짐을 Simulation을 통해 확인할 수 있었으며, 기생 Lateral NPN Bipolar Transistor의 Latch Up 특성이 취약해 지는 n+/n-wellslze는 0.57mm이고, 기생 Vertical PNP Bipolar Transistor는 p+/p-well size 0.52mm까지 안정적인 Current Gain을 유지함을 알 수 있었다. Ti/TiN Local Interconnection의 Rs를 Polycide 수준으로 낮추는 것은 TiN deco시 Power를 증가시키고 Pressure를 감소시킴으로써 실현할 수 있었다. Static Noise Margin분석을 통해 Vcc 0.6V에서도 Cell의 동작 Margin이 있음을 확인할 수 있었으며, Load Device의 큰 전류로 Soft Error를 개선할수 있었다. 본 공정으로 제조한 1M Full CMOS SRAM에서 Low Vcc margin 1.0V, Stand-by current 1mA이하(Vcc=3.7V, 85℃기준) 를 얻을 수 있었다.

• IEMEK Journal of Embedded Systems and Applications
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• v.11 no.2
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• pp.67-78
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• 2016

The emerging Spin-Transfer Torque RAM (STT-RAM) is a promising component that can be used to improve the efficiency as a result of its high storage density and low leakage power. However, the state-of-the-art STT-RAM is not ready to replace SRAM technology due to the negative effect of its write operations. The write operations require longer latency and more power than the same operations in SRAM. Therefore, a hybrid cache with SRAM and STT-RAM technologies is proposed to obtain the benefits of STT-RAM while minimizing its negative effects by using SRAM. To efficiently use of the hybrid cache, it is important to place write intensive data onto the cache. Such data should be placed on SRAM to minimize the negative effect. Thus, we propose a technique that optimizes placement of data in main memory. It drives the proper combination of advantages and disadvantages for SRAM and STT-RAM in the hybrid cache. As a result of the proposed technique, write intensive data are loaded to SRAM and read intensive data are loaded to STT-RAM. In addition, our technique also optimizes temporal locality to minimize conflict misses. Therefore, it improves performance and energy consumption of the hybrid cache architecture in a certain range.

• Journal of Sensor Science and Technology
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• v.33 no.3
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• pp.152-157
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• 2024

In this study, we propose a novel 8T ternary SRAM that can process three logic values (0, 1, and 2) with only two additional transistors, compared with the conventional 6T binary SRAM. The circuit structure consists of positive and negative ternary inverters (PTI and NTI, respectively) with carbon-nanotube field-effect transistors, replacing conventional cross-coupled inverters. In logic '0' or '2,' the proposed SRAM cell operates the same way as conventional binary SRAM. For logic '1,' it works differently as storage nodes on each side retain voltages of V_DD/2 and V_DD, respectively, using the subthreshold current of two additional transistors. By applying the ternary system, the data capacity increases exponentially as the number of cells increases compared with the 6T binary SRAM, and the proposed design has an 18.87% data density improvement. In addition, the Synopsys HSPICE simulation validates the reduction in static power consumption by 71.4% in the array system. In addition, the static noise margins are above 222 mV, ensuring the stability of the cell operation when V_DD is set to 0.9 V.

• ETRI Journal
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• v.29 no.4
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• pp.457-462
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• 2007

This work presents a low-voltage static random access memory (SRAM) technique based on a dual-boosted cell array. For each read/write cycle, the wordline and cell power node of selected SRAM cells are boosted into two different voltage levels. This technique enhances the read static noise margin to a sufficient level without an increase in cell size. It also improves the SRAM circuit speed due to an increase in the cell read-out current. A 0.18 ${\mu}m$ CMOS 256-kbit SRAM macro is fabricated with the proposed technique, which demonstrates 0.8 V operation with 50 MHz while consuming 65 ${\mu}W$/MHz. It also demonstrates an 87% bit error rate reduction while operating with a 43% higher clock frequency compared with that of conventional SRAM.