• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.180-181
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• 2006

As a rule, high temperature superconducting coated conductors have multi-layered buffers consisting of seed, diffusion barrier and cap layers. Multi-buffer layer deposition requires longer fabrication time. This is one of main reasons which increases fabrication cost Thus, single buffer layer deposition seems to be important for practical coated conductor process. In this study, a single layered buffer deposition of $CeO_2$ for low cost coated conductors has been tried using thermal evaporation technique 100nm-thick $CeO_2$ layers deposited by thermal evaporation were found to act as a diffusion layer. $0.4{\mu}m$-thick SmBCO superconducting layers were deposited by thermal co-evaporation on the $CeO_2$ buffered Ni-W substrate. Critical current of 118A/$cm^2$ was obtained for the SmBCO coated conductors.

• Korean Journal of Materials Research
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• v.29 no.12
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• pp.804-811
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• 2019

As the importance of three-dimensiona (3D) nano patterns and structures has recently emerged, interest in the study of 3D structures of block copolymers has increased. However, most existing studies on block copolymer 3D patterns on substrates are limited to simple 3D structures such as a multi-layered forms. In this study, we propose an experimental method for realizing free-standing 3D block copolymer patterns on substrates using an e-beam lithographic template and film transfer method. The block copolymer 3D structure formed in wide hole templates are similar to simple multi-layered structures; however, as the width of the hole template become narrower, more complex block copolymer 3D structures are formed in which the upper and lower layer structures are interconnected. Furthermore, we introduce a method to fabricate novel block copolymer structures in which the 2D planar structures are connected to 3D complex structures. Proposed 3D block copolymer fabrication method provides a framework for generation of unconventional 3D structures of block copolymer, which can be useful for next generation 3D devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.6
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• pp.546-549
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• 2007

As a rule, high temperature superconducting coated conductors have multi-layered buffers consisting of seed, diffusion barrier and cap layers. Multi-buffer layer deposition requires longer fabrication time. This is one of main reasons which increases fabrication cost. Thus, single buffer layer deposition seems to be important for practical coated conductor process. In this study, a single layered buffer deposition of $CeO_2$ for low cost coated conductors has been tried using thermal evaporation technique. 100 nm-thick $CeO_2$ layers deposited by thermal evaporation were found to act as a diffusion layer. $1\;{\mu}m-thick$ SmBCO superconducting layers were deposited by thermal co-evaporation on the $CeO_2$ buffered Ni-5%W substrate. Critical current of 90 A/cm was obtained for the SmBCO coated conductors.

• Journal of Mechanical Science and Technology
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• v.20 no.7
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• pp.1002-1011
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• 2006

In this study, we describe the conventional hot pressing (CHP) of layered $Al-B_4C$ composites and their characterization. The matrix alloy Al-5 wt.%Cu was prepared from elemental powder mixtures. The metal and B4C powders were mixed to produce either $Al-Cu-10vol.%B_4C$ or $Al-Cu-30vol.%B_4C$ combinations. Then, these powder mixtures were stacked as layers in the hot pressing die to form a two-layered composite. Hot pressing was carried out under nitrogen atmosphere to produce $30\times40\times5mm$ specimens. Microstructural features and age hardening characteristics of composites were determined by specimens cut longitudinally. The flexural strength of both layered composites and their monolithic counterparts were investigated via three point bending tests. In the case of layered specimens of both $10vol.%B_4C$ and $30vol.%B_4C$ containing layers were loaded for three-point test. The results show that a homogeneous distribution of $B_4C$ particles in the matrix alloy which is free of pores, can be obtained by CHP method. The ageing behavior of the composites was found to be influenced by the reinforced materials, i.e. higher hardness values were reached in 8 hrs for the composites than that for the matrix alloy. Flexural strength test showed that two-layered composites exhibited improved damage tolerance depending on layer arrangement. Microstructural investigation of the fracture surfaces of the bending specimens was performed by means of scanning electron microscope (SEM). While layer with lower reinforcement content exhibited large plastic deformation under loading, the other with higher reinforcement content exhibited less plastic deformation.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.73-82
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• 2003

Recently, PWB(Printed Wiring Board) has been recognized in the field of microelectronic package as core technology for designing or manufacturing. PWB is the structure stacked by several materials with different thermophysical properties, which shows the different CTEs(Coefficient or Thermal Expansions) during the fabrication process and causes a lot of defects such as warpage, shrinkage, dimension, etc. Thermal deformation of PWB is affected mainly by the volume change of solder-resist among fabrication parameters. Therefore, thermal deformation of PBGA and CSP consisting of 2 layers and 4 layers was studied with solder-resist process. When over 30% in volume fraction of solder-resist, thermal deformation of 2-layered PWB was min. 40% higher than that of 4-layered PWB because 4-layered PWB contained the layer with high toughness such as prepreg, which counterbalanced the thermal deformation of solder-resist. Otherwise, when below 30%, PWB showed similar thermal deformation without regard to layers and design.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.10
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• pp.601-607
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• 2016

Piezoelectric thick films of soft $Pb(Zr,Ti)O_3$ (PZT) based commercial material (S55) were fabricated using a conventional tape casting method. Ag-Pd electrodes were printed on the piezoelectric film at room temperature and all 5 layered films with a dimension of $12mm{\times}16mm$ were successfully laminated for a multi-layered piezoelectric ceramic actuator. The laminated specimens were co-fired at $1,100^{\circ}C$ for 1 h. A flat layered and dense microstructure was obtained for the $112{\mu}m$ thick piezoelectric actuator after sintering process. Thereafter, a prototype piezoelectric speaker was fabricated using the multi-layered piezoelectric ceramic actuator which can operate as a bimorph. Its SPL (sound pressure level) characteristic was also evaluated for speaker application. Frequency response revealed that the output SPL with a root mean square voltage of 10 V increased gradually to the highest peak of 87.5 dB for 1.5 kHz and exhibited a relatively stable behavior over the measured frequency range (${\leq}20kHz$) at a distance of 10 cm, implying that the fabricated piezoelectric speaker is potential for speaker applications.

• Journal of Welding and Joining
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• v.32 no.5
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• pp.80-86
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• 2014

We have successfully fabricated high strengthening Cu/STS/Cu 3 layered clad metal of $70kgf/mm^2$ grade for electric device lead frame, and investigated thermal effect of the mechanical and physical properties on the Cu/STS/Cu 3 layered clad metal lead frame material at different temperatures ranging from RT to $200^{\circ}C$. The fabricated clad metal shows a good thermal stability under 6% degrading of mechanical tensile strength and hardness change at $200^{\circ}C$ and also physical properties show stable thermal and electrical conductance of over $220W/m{\cdot}K$ and 58.44% IACS upto the $200^{\circ}$. The results confirm that fabricated high strengthening Cu/STS/Cu 3 layered clad metal can be applied for the high performed electrical lead frame devices.

• Journal of Powder Materials
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• v.25 no.6
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• pp.514-522
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• 2018

Layered-double hydroxide (LDH)-based nanostructures offer the two-fold advantage of being active catalysts with incredibly large specific surface areas. As such, they have been studied extensively over the last decade and applied in roles as diverse as light source, catalyst, energy storage mechanism, absorber, and anion exchanger. They exhibit a unique lamellar structure consisting of a wide variety of combinations of metal cations and various anions, which determine their physical and chemical performances, and make them a popular research topic. Many reviewed papers deal with these unique properties, synthetic methods, and applications. Most of them, however, are focused on the form-factor of nanopowder, as well as on the control of morphologies via one-step synthetic methods. LDH nanostructures need to be easy to control and fabricate on rigid substrates such as metals, semiconductors, oxides, and insulators, to facilitate more viable applications of these nanostructures to various solid-state devices. In this review, we explore ways to grow and control the various LDH nanostructures on rigid substrates.

• Polymer(Korea)
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• v.29 no.6
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• pp.543-548
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• 2005

Double-layered spheres play an important role in controlling drug delivery for pharmaceutical application, because of the low initial burst compared with single-layered spheres and targetable delivery to specific organ. But it has drawback in loading drug and controlling size. In this study, we developed double-layered spheres using relatively simple oil-in-water (O/W) solvent evaporation method witw/without ultrasonication and investigated the size variation of the double-layered microspheres on the contents of poly(lactide- co-glycolide) (PLGA). Double - layered spheres were char-acterized by scanning elecron microscope (SEM), camscope, and confocal fluorescence laser microscope (CFLM). Double-layered spheres showed smooth surfaces and obvious difference between core and corona by SEM observation and camscope. We observed the fluorescent core in the double-walled spheres composed of FlTC-dextran and PLGA using CFLM. It was found that the core of the microsphere was dextran and the corona of the fabricate microsphere was PLGA. Also, the more PLGA concentration, the more the size of the fabricating double-layered sphere observed.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.1
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• pp.33-40
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• 2012

The scaffold serves as 3D substrate for the cells adhesion and mechanical support for the newly grown tissue by maintaining the 3D structure for the regeneration of tissue and organ. In this paper, we proposed integrated scaffold fabrication system using multi-axis rapid prototyping (RP) technology. It can fabricate various types of scaffolds: arbitrary sculptured shape, primitive shape, and tube shape scaffolds by layered dispensing biocompatible/ biodegradable polymer strands in designated patterns. In order to fabricate the 3D scaffold, we need to generate the plotting path way for the scaffold fabrication system. We design a data processing program - scaffold plotting software, which can convert the 3D STL file, primitive and tube model images into the NC code for the system. Finally, we fabricated the customized 3D scaffolds with high accuracy using the plotting software and the fabrication system.