• Title/Summary/Keyword: Latch-up current

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Optimal P-Well Design for ESD Protection Performance Improvement of NESCR (N-type Embedded SCR) device (NESCR 소자에서 정전기 보호 성능 향상을 위한 최적의 P-Well 구조 설계)

  • Yang, Jun-Won;Seo, Yong-Jin
    • Journal of Satellite, Information and Communications
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    • v.9 no.3
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    • pp.15-21
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    • 2014
  • An electrostatic discharge (ESD) protection device, so called, N-type embedded silicon controlled rectifier (NESCR), was analyzed for high voltage operating I/O applications. A conventional NESCR standard device shows typical SCR-like characteristics with extremely low snapback holding voltage, which may cause latch-up problem during normal operation. However, our modified NESCR_CPS_PPW device with proper junction/channel engineering such as counter pocket source (CPS) and partial P-well structure demonstrates highly latch-up immune current-voltage characteristics with high snapback holding voltage and on-resistance.

New Approach for Transient Radiation SPICE Model of CMOS Circuit

  • Jeong, Sang-Hun;Lee, Nam-Ho;Lee, Jong-Yeol;Cho, Seong-Ik
    • Journal of Electrical Engineering and Technology
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    • v.8 no.5
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    • pp.1182-1187
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    • 2013
  • Transient radiation is emitted during a nuclear explosion and causes fatal errors as upset and latch-up in CMOS circuits. This paper proposes the transient radiation SPICE models of NMOS, PMOS, and INVERTER based on the transient radiation analysis using TCAD (Technology Computer Aided Design). To make the SPICE model of a CMOS circuit, the photocurrent in the PN junction of NMOS and PMOS was replaced as current source, and a latch-up phenomenon in the inverter was applied using a parasitic thyristor. As an example, the proposed transient radiation SPICE model was applied to a CMOS NAND circuit. The CMOS NAND circuit was simulated by SPICE and TCAD using the 0.18um CMOS process model parameter. The simulated results show that the SPICE results were similar to the TCAD simulation and the test results of commercial CMOS NAND IC. The simulation time was reduced by 120 times compared to the TCAD simulation.

Switching Characteristics due to the Impurity Concentration and the Channel Length in Lateral MOS-controlled Thyristor (수평 구조의 MOS-controlled Thyristor에서 채널에서의 길이 및 불순물 농도에 의한 스위칭 특성)

  • Kim, Nam-Soo;Cui, Zhi-Yuan;Lee, Kie-Yong;Ju, Byeong-Kwon;Jeong, Tae-Woong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.1
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    • pp.17-23
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    • 2005
  • The switching characteristics of MOS-Controlled Thyristor(MCT) is studied with variation of the channel length and impurity concentration in ON and OFF FET channel. The proposed MCT power device has the lateral structure and P-epitaxial layer in substrate. Two dimensional MEDICI simulator and PSPICE simulator are used to study the latch-up current and forward voltage-drop from the characteristics of I-V and the switching characteristics with variation of channel length and impurity concentration in P and N channel. The channel length and N impurity concentration of the proposed MCT power device show the strong affect on the transient characteristics of current and power. The N channel length affects only on the OFF characteristics of power and anode current, while the N doping concentration in P channel affects on the ON and OFF characteristics.

A Study on the Reduction of Current Kink Effect in NMOSFET SOI Device (NMOSFET SOI 소자의 Current Kink Effect 감소에 관한 연구)

  • Han, Myoung-Seok;Lee, Chung-Keun;Hong, Shin-Nam
    • Journal of the Korean Institute of Telematics and Electronics T
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    • v.35T no.2
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    • pp.6-12
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    • 1998
  • Thin film SOI(Silicon-on-insulator) device offer unique advantages such as reduction in short channel effects, improvement of subthreshold slope, higher mobility, latch-up free nature, and so on. But these devices exhibit floating-body effet such as current kink which inhibits the proper device operation. In this paper, the SOI NMOSFET with a T-type gate structure is proposed to solve the above problem. To simulate the proposed device with TSUPREM-4, the part of gate oxide was considered to be 30nm thicker than the normal gate oxide. The I-V characteristics were simulated with 2D MEDICI. Since part of gate oxide has different oxide thickness, the gate electric field strength is not same throughout the gate and hence the impact ionization current is reduced. The current kink effect will be reduced as the impact ionization current drop. The reduction of current kink effect for the proposed device structure were shown using MEDICI by the simulation of impact ionization current, I-V characteristics, and hole current distribution.

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Design of ESD Protection Circuit with improved Snapback characteristics Using Stack Structure (스텍 구조를 이용한 향상된 스냅백 특성을 갖는 ESD 보호회로 설계)

  • Song, Bo-Bae;Lee, Jea-Hack;Kim, Byung-Soo;Kim, Dong-Sun;Hwang, Tae-Ho
    • Journal of IKEEE
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    • v.25 no.2
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    • pp.280-284
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    • 2021
  • In this paper, a new ESD protection circuit is proposed to improve the snapback characteristics. The proposed a new structure ESD protection circuit applying the conventional SCR structural change and stack structure. The electrical characteristics of the structure using penta-well and double trigger were analyzed, and the trigger voltage and holding voltage were improved by applying the stack structure. The electron current and total current flow were analyzed through the TCAD simulation. The characteristics of the latch-up immunity and excellent snapback characteristics were confirmed. The electrical characteristics of the proposed ESD protection circuit were analyzed through HBM modeling after forming a structure through TCAD simulator.

A Study on SCR-based Dual Directional ESD Protection Device with High Holding Voltage by Self-Biasing Effect (Self-Biasing 효과로 높은 홀딩 전압을 갖는 SCR 기반 양방향 ESD 보호 소자에 관한 연구)

  • Jung, Jang-Han;Jeong, Seung-Koo;Koo, Yong-Seo
    • Journal of IKEEE
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    • v.26 no.1
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    • pp.119-123
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    • 2022
  • This paper propose a new ESD protection device suitable for 12V class applications by adding a self-biasing structure to an ESD protection device with high holding voltage due to additional parasitic bipolar BJT. To verify the operating principle and electrical characteristics of the proposed device, current density simulation and HBM simulation were performed using Synopsys' TCAD Simulation, and the operation of the additional self-biasing structure was confirmed. As a result of the simulation, it was confirmed that the proposed ESD protection device has a higher level of holding voltage compared to the existing ESD protection device. It is expected to have high area efficiency due to the dual structure and sufficient latch-up immunity in 12V-class applications.

Analysis of Problems when Generating Negative Power for IT devices (IT 기기의 마이너스 전원 생성 시 문제점에 관한 분석)

  • Jun, Ho-Ik;Lee, Hyun-Chang
    • Journal of Software Assessment and Valuation
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    • v.16 no.2
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    • pp.109-115
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    • 2020
  • In this paper, the problem that occurs when negative voltage is generated using an inexpensive buck device in an IT device that is supplied with a single power by an adapter or battery is analyzed. For the cause analysis, the principle of operation of the buck device and the principle of the inverter circuit were examined, and the circuit characteristics of the inverter circuit were analyzed using the buck device. As a result of the analysis, it was confirmed that the inverter circuit using the buck device initially needs a large starting current, and in particular, in the case of a current capacity that is less than the starting current in the circuit that supplies power, it was confirmed that it could fall into a state similar to the latch-up phenomenon. In order to confirm the analysis result, an experimental circuit was constructed and the input current was checked. If the supply current is sufficient, it is confirmed that over-current flows and starts. If the supply current is insufficient, the circuit cannot start and a latch-up phenomenon occurs.

Fabrication, Mesurement and Evaluation of Silicon-Gate n-well CMOS Devices (실리콘 게이트 n-well CMOS 소자의 제작, 측정 및 평가)

  • Ryu, Jong-Seon;Kim, Gwang-Su;Kim, Bo-U
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.21 no.5
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    • pp.46-54
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    • 1984
  • A silicon-gate n-well CMOS process with 3 $\mu$m gate length was developed and its possibility for the applications was discussed,. Threshold voltage was easily controlled by ion implantation and 3-$\mu$m gate length with 650 $\AA$ oxide shows ignorable short channel effect. Large value of Al-n+ contact resistance is one of the problems in fabrications of VLSI circuits. Transfer characteristics of CMOS inverter is fairly good and the propagation delay time per stage in ring oscillator with layout of (W/L) PMOS /(W/L) NMOS =(10/5)/(5/5) is about 3.4 nsec. catch-up occurs on substrate current of 3-5 mA in this process and critically dependent on the well doping density and nt-source to n-well space. Therefore, research, more on latch-up characteristics as a function of n-well profile and design rule, especially n+-source to n-well space, is required.

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A Novel Inserted Trench Cathode IGBT Device with High Latching Current (높은 latch-up 전류특성을 갖는 트랜치 캐소드 삽입형 IGBT)

  • 조병섭;곽계달
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.30A no.7
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    • pp.32-37
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    • 1993
  • A novel insulated gate bipolar transister (IGBT), called insulated trench cathode IGBT (ISTC-IGBT), is proposed. ISTC-IGBT has a trenched well with the shallow P$^{+}$ juction in the conventional IGBT structure. The proposed structure has the capability of effectively suppressing the parasitic thyristor latchup. The holding current of ISTC-IGBT is about 2.2 times greater than that of the conventional IGBT. Detailed analysis of the latchup characteristics of ISTC-IGBT is performed by using the two-dimensional device simulator, PISCES-II B.

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Study of Characteristics of Dual Channel Trench IGBT (Dual Channel을 가진 Trench Insulated Gate Biploar Transistor(IGBT)특성 연구)

  • Moon, Jin-Woo;Chung, Sang-Koo
    • Proceedings of the KIEE Conference
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    • 2001.07c
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    • pp.1469-1471
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    • 2001
  • A Dual Channel Trench IGBT (Insulated Gate Bipolar Transistor) is proposed to improve the latch-up characteristics. Simulation results by MEDICI have shown that the latching current density of proposed device was found to be 2850 A/$cm^2$ while that of conventional device was 1610 A/$cm^2$. The latching current desity of the proposed strucutre was 77.02% higher than that of conventional structre.

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