• Title/Summary/Keyword: Differential Circuit

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Method for High-Frequency Modeling of Common-Mode Choke (공통모드 초크의 간단한 고주파 모델링 기법)

  • Jung, Hyeonjong;Yoon, Seok;Kim, Yuseon;Bae, Seok;Lim, Yeongseog
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.28 no.12
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    • pp.964-973
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    • 2017
  • In this paper, we analyze the effects of parasitic components of common-mode choke on the common mode and differential mode in a wide band, and we propose a simple method for high-frequency modeling. Common mode and differential mode 2-port networks were configured and the S-parameters in each mode were measured using a network analyzer. Equivalent circuit elements were extracted from the measured results to model a high-frequency equivalent circuit, and the validity was verified by comparing the measured S-parameters with the simulation results.

The Design of 128 Channels Cardiac-Activation Pre-Amplifier (128 채널 심장전기도 전치 증폭기의 설계)

  • Yoo, Sun-Kook;Chang, Byung-Chul;Jung, Dong-Il;Han, Young-Oh
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.50 no.11
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    • pp.550-556
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    • 2001
  • The computerized cardiac analysis system, which acquires and analyzes the electrical activation signal propagating along the surface of the heart, is indispensible equipment for the open heart surgery and electrical cardiac study. In this paper, the design requirement and the electrical circuit analysis are performed to construct the multi-channel cardiac activation pre-amplifier necessary for a signal conditioning circuit. The general 64 channel configuration is expanded into 128 channels to enhance the spatial resolution on the mapped surface of the heart. The 128 channels pre-amplifier consists of input circuit, differential amplifier, right leg driven circuit and isolation part. It has distinct features; high voltage protection, leakage current limitation, isolation and the maximization of common mode rejection ratio with respect to the half-cell potential difference due to different electrode materials. The final pre-amplifier circuit is assembled with 8 boards, each of which composing of 16 channels.

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Design Optimization of Hybrid-Integrated 20-Gb/s Optical Receivers

  • Jung, Hyun-Yong;Youn, Jin-Sung;Choi, Woo-Young
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.4
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    • pp.443-450
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    • 2014
  • This paper presents a 20-Gb/s optical receiver circuit fabricated with standard 65-nm CMOS technology. Our receiver circuits are designed with consideration for parasitic inductance and capacitance due to bonding wires connecting the photodetector and the circuit realized separately. Such parasitic inductance and capacitance usually disturb the high-speed performance but, with careful circuit design, we achieve optimized wide and flat response. The receiver circuit is composed of a transimpedance amplifier (TIA) with a DC-balancing buffer, a post amplifier (PA), and an output buffer. The TIA is designed in the shunt-feedback configuration with inductive peaking. The PA is composed of a 6-stage differential amplifier having interleaved active feedback. The receiver circuit is mounted on a FR4 PCB and wire-bonded to an equivalent circuit that emulates a photodetector. The measured transimpedance gain and 3-dB bandwidth of our optical receiver circuit is 84 $dB{\Omega}$ and 12 GHz, respectively. 20-Gb/s $2^{31}-1$ electrical pseudo-random bit sequence data are successfully received with the bit-error rate less than $10^{-12}$. The receiver circuit has chip area of $0.5mm{\times}0.44mm$ and it consumes excluding the output buffer 84 mW with 1.2-V supply voltage.

ASIC Implementation of Synchronization Circuit with Lossless Data Compensation (무손실 데이터 보상을 갖는 동기회로의 ASIC 구현)

  • 최진호;강호용;전문석
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.27 no.10C
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    • pp.980-986
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    • 2002
  • In the fast data communication system, synchronized by a clock source, the loss of data will often occur due to several reasons as a differential routing path between data and clock, a differential propagation delay of components or an unstable phase of clock and data by external noise. In this paper, we describe the ASIC implementation of the data compensation circuit which can detect the data loss from above problems and recovery to original data with stable synchronization. Especially it supports a strong stability and a good BER in the communication system for fast data transfer as optic area. This circuit is implemented by Verilog HDL and available to the digital ASIC implementations related to fast data transfer.

A CMOS LC VCO with Differential Second Harmonic Output (차동 이차 고조파 출력을 갖는 CMOS LC 전압조정발진기)

  • Kim, Hyun;Shin, Hyun-Chol
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.6 s.360
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    • pp.60-68
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    • 2007
  • A technique is presented to extract differential second harmonic output from common source nodes of a cross-coupled P-& N-FET oscillator. Provided the impedances at the common source nodes are optimized and the fundamental swing at the VCO core stays in a proper mode, it is found that the amplitude and phase errors can be kept within $0{\sim}1.6dB$ and $+2.2^{\circ}{\sim}-5.6^{\circ}$, respectively, over all process/temperature/voltage corners. Moreover, an impedance-tuning circuit is proposed to compensate any unexpectedly high errors on the differential signal output. A Prototype 5-GHz VCO with a 2.5-Hz LC resonator is implemented in $0.18-{\mu}m$ CMOS. The error signal between the differential outputs has been measured to be as low as -70 dBm with the aid of the tuning circuit. It implies the push-push outputs are satisfactorily differential with the amplitude and phase errors well less than 0.34 dB and $1^{\circ}$, respectively.

Deign of Small-Area Differential Paired eFuse OTP Memory for Power ICs (Power IC용 저면적 Differential Paired eFuse OTP 메모리 설계)

  • Park, Heon;Lee, Seung-Hoon;Jin, Kyo-Hong;Ha, Pan-Bong;Kim, Young-Hee
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.8 no.2
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    • pp.107-115
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    • 2015
  • In this paper, a small-area 32-bit differential paired eFuse OTP memory for power ICs is designed. In case of smaller number of rows than that of columns for the OTP memory cell array, a scheme for the cell array reducing the number of SL driver circuits requiring their larger layout areas by routing the SL (source line) lines supplying programming currents for eFuse links in the row direction instead of the column direction as well as a core circuit is proposed. In addition, to solve a failure of being blown for non-blown eFuse links by the electro-migration phenomenon, a regulated voltage of V2V ($=2V{\pm}0.2V$) is used to a RWL (read word line) driver circuit and a BL (bit line) pull-up driver circuit. The layout size of the designed 32-bit eFuse OTP memory is $228.525{\mu}m{\times}105.435{\mu}m$, which is confirmed to be 20.7% smaller than that of the counterpart using the conventional cell array routing, namely $197.485{\mu}m{\times}153.715{\mu}m$.

Design of eFuse OTP Memory Programmable in the Post-Package State for PMICs (Post-Package 프로그램이 가능한 eFuse OTP 메모리 설계)

  • Jin, Liyan;Jang, Ji-Hye;Kim, Jae-Chul;Ha, Pan-Bong;Kim, Young-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.16 no.8
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    • pp.1734-1740
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    • 2012
  • In this paper, we propose a FSOURCE circuit which requires such a small switching current that an eFuse OTP memory can be programmed in the post-package state of the PMIC chips using a single power supply. The proposed FSOURCE circuit removes its short-circuit current by using a non-overlapped clock and reduces its maximum current by reducing the turned-on slope of its driving transistor. Also, we propose a DOUT buffer circuit initializing the output data of the eFuse OTP memory with arbitrary data during the power-on reset mode. We design a 24-bit differential paired eFuse OTP memory which uses Magnachip's $0.35{\mu}m$ BCD process, and the layout size is $381.575{\mu}m{\times}354.375{\mu}m$($=0.135mm^2$).

Practical Design and Implementation of a Power Factor Correction Valley-Fill Flyback Converter with Reduced DC Link Capacitor Volume (저감된 DC Link Capacitor 부피를 가지는 역률 개선 Valley-Fill Flyback 컨버터의 설계 및 구현)

  • Kim, Se-Min;Kang, Kyung-Soo;Kong, Sung-Jae;Yoo, Hye-Mi;Roh, Chung-Wook
    • The Transactions of the Korean Institute of Power Electronics
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    • v.22 no.4
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    • pp.277-284
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    • 2017
  • For passive power factor correction, the valley fill circuit approach is attractive for low power applications because of low cost, high efficiency, and simple circuit design. However, to vouch for the product quality, two dc-link capacitors in the valley fill circuit should be selected to withstand the peak rectified ac input voltage. The common mode (CM) and differential mode (DM) choke should be used to suppress the electromagnetic interference (EMI) noise, thereby resulting in large size volume product. This paper presents the practical design and implementation of a valley fill flyback converter with reduced dc link capacitors and EMI magnetic volumes. By using the proposed over voltage protection circuit, dc-link capacitors in the valley fill circuit can be selected to withstand half the peak rectified ac input voltage, and the proposed CM/DM choke can be successfully adopted. The proposed circuit effectiveness is shown by simulation and experimentally verified by a 78W prototype.

A Design of Full-wave Rectifier for Measurement Instrument (계측기용 새로운 전파정류 회로 설계)

  • Bae Sung-Hoon;Lim Shin-Il
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.43 no.4 s.310
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    • pp.53-59
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    • 2006
  • This paper describes the new design technique of full wave rectifier (FWR) for precise measurement instrument and the chip implementation of this FWR circuit with measurement results. Conventional circuits have some problems of complex design and limited output range( $VDD/2{\sim}VLIIV1IT+$). Proposed FWR circuit was simply designed with two 2x1 MUXs, one high speed comparator, and one differential difference amplifier(DDA). One rail-to-rail differential difference amplifier(DDA) performs the DC level shifting to VSS and 2X amplification simultaneously, and enables the full range ($Vss{\sim}VDD$) operation. The proposed FWR circuits shows more than 50% reduction of chip area and power consumption compared to conventional one. Proposed circuit was implemented with 0.35um 1-poly 2-metal CMOS process. Core size is $150um{\times}450um$ and power dissipation is 840uW with 3.3V single supply.