• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.537-539
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• 2009

We report the improvement in adhesion of IZO thin films through oxygen ($O_2$) plasma treatment of organic polymer film. In conclusion, the $O_2$ plasma treatment of an organic polymer film was accomplished with improving ca. 1.8 times in adhesion than that of the only general etch treatment on the same organic polymer film.

• Bulletin of the Korean Chemical Society
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• v.28 no.2
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• pp.188-192
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• 2007

In this work, the effects of chemical treatment of polyimide films were studied by FT-IR, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and contact angles. The adhesion characteristics of the films were also investigated in the peel strengths of polyimide/aluminum films. The increases of surface functional groups of KOH-treated polyimide films were greatly correlated with the polar component of surface free energy. The peel strength of polyimides to metal substrate was also greatly enhanced by increasing the KOH treatment time, which can be attributed to the formation of polar functional groups on the polyimide surfaces, resulting in enhancement of the work of adhesion between polymer film and metal plate.

• Korean Journal of Pharmacognosy
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• v.31 no.4
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• pp.394-400
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• 2000

Tumor cell interaction with the extracellular matrix (ECM) is defined as the critical event of tumor invasion that signals the initiation of a metastatic cascade. To search for anti-metastatic agent from plants, several plant extracts were screened by cell- ECM anti-adhesion test. As result, Boehmeria pannosa, Dryopteris crassirhizoma, Scilla scilloides, and Agrimonia pilosa were shown a significant anti-adhesion activity.

• Polymer(Korea)
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• v.38 no.3
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• pp.358-363
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• 2014

Adhesion forces between acrylate imprinting resin and a surface treated atomic force microscope (AFM) tip were investigated. Compared to the untreated silicon tip, 38% of the adhesion force is reduced for the hydrophobic tip treated with $CH_4$ plasma whereas 1.6 time increases is found for the hydrophilic tip with $O_2$ plasma treatment. Such a measurement of the adhesion force using AFM provides very quantitative results on adhesion comparing to the crosscut adhesion test which gives qualitative results. Since the adhesion area becomes larger as the imprinting pattern size gets smaller, the surface treatment issue becomes more important in the nano-imprinting process.

• Elastomers and Composites
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• v.35 no.1
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• pp.63-70
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• 2000

Zinc plated steel tire cords were subjected to RF plasma etching of argon, followed by plasma polymerization coating of acetylene or butadiene in order to enhance adhesion to rubber compounds. Plasma polymerization was carried out under optimized conditions of 10 W, 30 sec, 30 mTorr for acetylene and butadiene gas, while plasma etching was performed at 90W, 10min and 30mTorr. The adhesion of tire cords was evaluated via Tire Cords Adhesion Test (TCAT) and the failure surfaces of the tested samples were analyzed by SEM. Polymer coating by plasma polymerization was also characterized by FT-IR, Alpha-Step and dynamic contact angle analyzer in order to elucidate the adhesion mechanism.

• Korean Journal of Materials Research
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• v.20 no.6
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Textile Coloration and Finishing
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• v.27 no.1
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• pp.18-26
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• 2015

para-aramid fibers were treated by atmosphere air plasma to improve the interfacial adhesion. The wettability of plasma-treated aramid fiber was observed by means of dynamic contact angle surface free energy measurement. Surface roughness were investigated with the help of scanning electron microscopy and atomic force microscopy. The tensile test of aramid fiber roving was carried out to determine the effect of plasma surface treatments on the mechanical properties of the fibers. A pull-out force test was carried out to observe the interfacial adhesion effect with matrix material. It was found that surface modification and a chemical component ratio of the aramid fibers improved wettability and adhesion characterization. After oxygen plasma, it was indicated that modified the surface roughness of aramid fiber increased mechanical interlocking between the fiber surface and vinylester resin. Consequently the oxygen plasma treatment is able to improve fiber-matrix adhesion through excited functional group and etching effect on fiber surface.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.49-56
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• 2007

Effects of post-baking treatment conditions on the interfacial adhesion between electroless plated Ni and polyimide film were evaluated using $180^{\circ}C$ peel test. Measured peel strength values monotonically decrease from $38.6{\pm}1.1g/mm\;to\;26.8{\pm}2.2g/mm$ for the variations of post-baking treatment temperatures from $80^{\circ}C\;to\;180^{\circ}C$, respectively. Wet chemical treatment on the polyimide surface produces carboxyl and amide functional groups on the surface which is closely related to the change in interfacial adhesion between electroless Ni and polyimide films. It is speculated that interfacial adhesion seems to be controlled by carbonyl oxygen bonding near cohesive failure region during post-baking treatment.

• Journal of the Korean Wood Science and Technology
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• v.35 no.4
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• pp.38-44
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• 2007

As environmental issues is important thing, our study aims to develop natural adhesives made by rosin instead of synthesis adhesive with the formaldehyde emission. Natural adhesives were formulated to enhance curing speed and adhesion performances with various drying agent contents. Adhesion performances were evaluated with tack values measured by texture analyzer and shear strengths determined by single lap shear test. The adhesion performances of nature adhesives developed in this study and compared with those of overseas natural adhesives made by AURO, BioFa, Livos. Optimum drying agent formulation was Co 0.7 part, Zr 1.0 part, Ca 0.5 part, and Activ8 0.1 part. Shear strength of the adhesives manufactured by the optimum drying agent formulation was $93.2{\pm}19.1N/cm^2$.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.75-80
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• 2014

Nanocrystalline diamond(NCD) films on steel(SKH51) has been investigated using SiC interlayer film. SiC was deposited on SKH51 or Si wafer by RF magnetron sputter. NCD was deposited on SiC at $600^{\circ}C$ for 0.5~4 h employing microwave plasma CVD. Film morphology was observed by FESEM and FIB. Film adherence was examined by Rockwell C adhesion test. The growth rate of NCD on SiC/Si substrate was much higher than that on SiC/SKH51. During particle coalescence, NCD growth rate was slow since overall rate was determined by the diffusion of carbon on SiC surface. After completion of particle coalescence, NCD growth became faster with the reaction of carbon on NCD film controlling the whole process. In the case of SiC/SKH51 substrate, a complete NCD film was not formed even after 4 h of deposition. The adhesion test of NCD/SiC/SKH51 samples revealed a delamination of film whereas that of SiC/SKH51 showed a good adhesion. Many voids of less than 0.1 ${\mu}m$ were detected on NCD/SiC interface. These voids were believed as the reason for the poor adhesion between NCD and SiC films. The origin of voids was due to the insufficient coalescence of diamond particles on SiC surface in the early stage of deposition.