• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.172-175
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• 2003

새로운 전력 반도체 소자로 주목받고 있는 MOS 구동 사이리스터 중 대 전력용으로 사용되는 EST는 높은 전류 밀도에서 게이트에 의한 전류 조절이 가능할 뿐만 아니라 다른 MOS 구동 사이리스터 소자와는 달리 전류 포화 특성을 지녀 차세대 전력 반도체로 각광 받고 있는 소자이다. 하지만 소자의 동작 시에 스냅-백 특성을 지녀 전력의 손실을 유발할 뿐만 아니라 오동작을 일으킬 가능성이 있다. 따라서 본 논문에서는 기존의 EST에서 스냅-백 특성의 제거와 저지 전압의 향상을 위해 트랜치 전극을 가지는 새로운 구조를 제안하고 게이트 전극과 캐소드 전극의 트랜치 화에 따른 특성 변화 양상을 살펴보기 위해 게이트 전극만 트랜치로 구성한 경우와 캐소드 전극만 트랜치로 구성한 경우를 시뮬레이션을 통해 해석하였다. 그 결과 기존의 EST에서 게이트 전극만을 트랜치 형태로 바꾼 경우에는 스냅-백 특성이 1.1 V의 애노드 전압과 91 A/cm2의 전류 밀도에서 발생하고 순방향 저지 모드 시의 저지 전압은 800 V로 기존의 257에 비해 월등한 전기적 특성 향상을 가져왔다. 그러나 기존의 EST에서 캐소드 전극만을 트랜치 형태로 바꾼 경우에는 스냅-백 특성이 1.72 V의 애노드 전압과 25 A/cm2의 전류 밀도에서 발생하고 순방향 저지 모드 시의 저지 전압은 613 V로 스냅-백 특성은 향상되었으나 저지 전압은 기존의 EST 보다 감소하였다. 결국 기존의 EST에서 게이트 전극만을 트랜치 전극 형태로 구성한 경우에 가장 탁월한 전기적 특성을 갖는 것으로 나타났다.

• Journal of IKEEE
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• v.26 no.3
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• pp.333-340
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• 2022

Process and device simulations were performed to determine the optimal ion implantation conditions to prevent double snapback of high voltage operating DDDNMOS (double diffused drain N-type MOSFET) device for ESD protection. By examining the effects of HP-Well, N^- drift and N⁺ drain ion implantation on the double snapback and avalanche breakdown voltages, it was possible to prevent double snapback and improve the electrostatic protection performance. If the ion implantation concentration of the N^- drift region rather than the HP-Well region is optimally designed, it prevents the transition from the primary on-state to the secondary on-state, so that relatively good ESD protection performance can be obtained. Since the concentration of the N^- drift region affects the leakage current and the avalanche breakdown voltage, in the case of a process technology with an operating voltage greater than 30V, a new structure such as DPS or colligation of optimal process conditions can be applied. In this case, improved ESD protection performance can be realized.

• Journal of Satellite, Information and Communications
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• v.7 no.2
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• pp.18-24
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• 2012

High current behaviors of the extended drain n-type metal-oxide-semiconductor field effects transistor (EDNMOSFET) for electrostatic discharge (ESD) protection of high voltage operating LDI (LCD Driver IC) chip are analyzed. Both the transmission line pulse (TLP) data and the thermal incorporated 2-dimensional simulation analysis demonstrate a characteristic double snapback phenomenon after triggering of biploar junction transistor (BJT) operation. Also, background doping concentration (BDC) is proven to be a critical factor to affect the high current behavior of the EDNMOS devices. The EDNMOS device with low BDC suffers from strong snapback in the high current region, which results in poor ESD protection performance and high latchup risk. However, the strong snapback can be avoided in the EDNMOS device with high BDC. This implies that both the good ESD protection performance and the latchup immunity can be realized in terms of the EDNMOS by properly controlling its BDC.

• Journal of Satellite, Information and Communications
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• v.8 no.2
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• pp.36-43
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• 2013

In this study, the high current behaviors and double snapback mechanism of gate grounded_extended drain n-type MOSFET(GG_EDNMOS) device were analyzed in order to realize the robust electrostatic discharge(ESD) protection performances of high voltage operating display driver IC(DDIC) chips. Both the transmission line pulse(TLP) data and the thermal incorporated 2-dimensional simulation analysis as a function of ion implant conditions demonstrate a characteristic double snapback phenomenon after triggering of bipolar junction transistor(BJT) operation. Also, the background carrier density is proven to be a critical factor to affect the high current behavior of the GG_EDNMOS devices.

• Journal of Satellite, Information and Communications
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• v.9 no.3
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• pp.15-21
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• 2014

An electrostatic discharge (ESD) protection device, so called, N-type embedded silicon controlled rectifier (NESCR), was analyzed for high voltage operating I/O applications. A conventional NESCR standard device shows typical SCR-like characteristics with extremely low snapback holding voltage, which may cause latch-up problem during normal operation. However, our modified NESCR_CPS_PPW device with proper junction/channel engineering such as counter pocket source (CPS) and partial P-well structure demonstrates highly latch-up immune current-voltage characteristics with high snapback holding voltage and on-resistance.

• Journal of Satellite, Information and Communications
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• v.10 no.4
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• pp.1-5
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• 2015

The ESD(electrostatic discharge) protection performance of PPS(PMOS pass structure) embedded N-type silicon controlled rectifier(NSCR_PPS) device with different partial p-well(PPW) structure was discussed for high voltage I/O applications. A conventional NSCR_PPS standard device shows typical SCR-like characteristics with low on-resistance, low snapback holding voltage and low thermal breakdown voltage, which may cause latch-up problem during normal operation. However, our proposed NSCR_PPS devices with modified PPW_PGM(primary gate middle) and optimal CPS(counter pocket source) implant demonstrate the stable ESD protection performance with high latch-up immunity.

• Journal of Satellite, Information and Communications
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• v.11 no.4
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• pp.27-32
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• 2016

A conventional double diffused drain n-type MOSFET (DDD_NMOS) device shows SCR behaviors with very low snapback holding voltage and latch-up problem during normal operation. However, a modified DDD_NMOS-based silicon controlled rectifier (DDD_NSCR_CPS) device with a counter pocket source (CPS) structure is proven to increase the snapback holding voltage and on-resistance compare to standard DDD_NSCR device, realizing an excellent electrostatic discharge protection performance and the stable latch-up immunity.

• Journal of Satellite, Information and Communications
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• v.8 no.1
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• pp.45-53
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• 2013

An electrostatic discharge (ESD) protection device, so called, N-type extended drain silicon controlled rectifier (NEDSCR) device, was analyzed for high voltage I/O applications. A conventional NEDSCR device shows typical SCR-like characteristics with extremely low snapback holding voltage. This may cause latch-up problem during normal operation. However, a modified NEDSCR device with proper junction/channel engineering using counter pocket source (CPS) ion implantation demonstrates itself with both the excellent ESD protection performance and the high latch-up immunity. Since the CPS implant technique does not change avalanche breakdown voltage, this methodology does not reduce available operation voltage and is applicable regardless of the operation voltage.

• Journal of IKEEE
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• v.25 no.2
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• pp.280-284
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• 2021

In this paper, a new ESD protection circuit is proposed to improve the snapback characteristics. The proposed a new structure ESD protection circuit applying the conventional SCR structural change and stack structure. The electrical characteristics of the structure using penta-well and double trigger were analyzed, and the trigger voltage and holding voltage were improved by applying the stack structure. The electron current and total current flow were analyzed through the TCAD simulation. The characteristics of the latch-up immunity and excellent snapback characteristics were confirmed. The electrical characteristics of the proposed ESD protection circuit were analyzed through HBM modeling after forming a structure through TCAD simulator.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1343-1345
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• 2001

본 논문은 스냅백을 효과적으로 제거하고 순방향 전압 강하를 줄이는 새로운 구조의 분리된 이중 게이트 SOI SA-LIGBT를 제안하였다. 제안된 소자는 분리된 단락 애노드와 플로팅 오믹 접합의 적용을 통해 스냅백이 성공적으로 제거되었고, 순방향전압강하는 전류밀도가 100A/$cm^2$일 때 기존의 SA-LIGBT에 비교해서 2V 감소된다. 또한 턴-오프 특성도 분리된 단락 애노드를 적용하였기 때문에 SA-LIGBT보다 개선되었다.