The cementless fixation of bone ingrowth by porous coatings on artificial hip joint prostheses are replacing polymethylmethacrylate(PMMA) bone cement fixations. However, the major interests in the field of porous metal coating are environmental corrosivity accelerated by metal ion release, deterioration in the mechanical property of the coating, and the mechanical failure of the coatings as well as the substrate. Therefore, the selection of right materials for coatings and the development of porous coating techniques must be accomplished. Because of the existing problems in Ti and Ti alloys which are used extensively, this study is focused on the plasma spraying technique for coating on super stainless steel substrate. In order to determine the optimum conditions which satisfy the requirement for the porous coatings, under the plasma spraying, we selected the experimental parameters which extensively influenced on the characteristics of the coating through the pre-examination. Spray distance has been selected among 120, 160, and 200mm and primary gas flow rate among 70, 100, and 130 SCFH. Current and secondary gas($H_2$) flow rate was fixed at 400A, and 15 SCFH respectively. To understand the characteristics of the coatings, surface morphology, cross-sectional micro-structure, surface roughness, residual stress, and corrosion resistance were elucidated and the best conditions for the bone ingrowth improvement on artificial hip joint prostheses were found.

In this work BN thin films were deposited on Si substrate by R. F. sputtering method at $200^{\circ}C$ and in Ar + $N_2$ mixed gas atmosphere. In order to investigate the effect of ion bombardment on substrate for c-BN bonding, substrate bias voltage was applied. The optimum substrate bias voltage for c-BN bonding was determined by FTIR analysis on specimens which were deposited with various bias voltages. Then BN thin film was deposited with this optimum condition and its phase, morphology, chemical composition, and refractive index were compared with those of BN film which was deposited without bias voltage. FTIR results showed that BN films deposited with substrate bias voltage were composed of mixed phases of c-BN and h-BN, while those deposited without bias voltage were h-BN only. When pure Ar gas was used for sputtering gas, BN films were delaminated easily from substrate in air, while when 10% $N_2$ gas was added to the sputtering gas, although c-BN specific infrared peak was reduced, delamination did not occur. GXRD and TEM results showed that BN films were amorphous phases regardless of substrate bias voltage, and AES results showed that the chemical compositions of B/N were about 1.7~1.8. The refractive index of BN film deposited with bias voltage was higher than that without bias voltage. The reason is believed to be the existence of c-BN bonding in BN film and the higher density of film that deposited with the substrate bias voltage.

The internal stress of acidic electroless nickel deposits on zincated aluminum was determined by spiral contractometer. Several plating conditions such as inhibitor and complexing agent concentrations and pH affecting the internal stress were studied. The resulting intrinsic stress contribution to the total stress was discussed in terms of phosphorous content of the deposit, solution pH, and surface morphology. However, the most important was found to be thermal stress for the total stress of Al substrate, because of high thermal expansion coefficient of the aluminum substrate.

In order to improve adhesion of electroless copper deposits on alumina substrates, some stabilizers such as 2-Mercapto Benzothiazole, thiourea and NaCN were added over a wide range of concentrations. The adhesion tests of the deposits were performed by using the cellophane tape and the push-pull scale. With the minor addition of the stabilizers, 2-MBT having a large molecular size gives poor adhesion, together with a finer grain structure, whereas Thiourea and NaCN show a high mechanical strength of the deposits. The high mechanical strength is supposed to be due to the easy desorption of hydrogen gas generated from the electroless reactions. A large amount of the three stabilizers decreases the adhesion for all the cases, resulting from strong adsorption of the stabilizers to the substrates.

In order to improve the mechanical properties and the high temperature oxidation resistance, aluminizing was carried out at a temperature range between $850^{\circ}C$ and $1050^{\circ}C$. The pack cementation process was used to produce uniform layer. After each treatment, the microhardness and the characteristics of high temperature oxidation were tested to evaluate the properties of the aluminide layer. The aluminide layer consisted of FeAl above $1000^{\circ}C$, and $Fe_2Al_5$ below $900^{\circ}C$, and the mixed phase of FeAl and $Fe_2Al_5$ between 90$0^{\circ}C$ and $1000^{\circ}C$ in case of the mixture powder consisted of 5%Al+5%$NH_4Cl+90%AL_2O_3$. The microhardness of $Fe_2Al_5$ was obtained much as the twice as that of FeAl. As the aluminizing temperature and time increased, the thickness of aluminide increased. After aluminizing, the high temperature oxidation resistance was remarkably improved. The high temperature oxidation resistance of FeAl was superior to the resistance of high temperature oxidation of $Fe_2Al_5$.

Experiments on the automatic control of NaOH concentration and on the spraying condition of NaOH solution in the alkaline degreasing process of a continuous hot-dip galvanizing line have been carried out in order to improve degreasing performance of a galvanizing sheet steel using laboratory degreasing and galvanizing simulators. The concentration of NaOH for the good degreasing has been determined to be 6.0% and more and this concentration has been able to be automatically well controlled within $\pm$0.1% by employing a solution electrical conductivity meter under a flow injection analysis condition rather than by employing a sodium ion selective electrode in the degreasing simulator. Frequent blocking of the spraying nozzles of the solution has been reduced considerably by the set-up and periodical operation of an automatic valve system in the nozzle system. By applying this automatic valve system and by automatic controlling the NaOH concentration and other ordinary variables in the degreasing process, the degreasing performance has been increased from the conventional 76% to the new 85%.

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.