• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.577-580
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• 1998

This paper presents the characteristics of each MOS device and Bipolar device, then investigates about how these devices take effect on BiCMOS inverter from 300K to 470K. The turn-off and Logic swing characteristics of BiCMOS inverter are degraded by the electrical characteristics of the MOS to around 400K, but over that temperature enhanced by the characteristics of the Bipolar transistor.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 1996년도 말뚝기초 국제 학술발표회 논문집
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• pp.109-152
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• 1996

The design of a deep foundation by means of whatever a scientific method has to take into account the influence of the installation of the piles on the soil parameters to be implemented in the shaft and base capacity. Especially when discussing screw piles, the details of the pile installation technique are of outmost importance. New developments in screw pile techniques, over the last decade, show this type of deep foundations to be probably one of the most promissing for the future.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1991년도 한국자동제어학술회의논문집(국내학술편); KOEX, Seoul; 22-24 Oct. 1991
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• pp.156-161
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• 1991

It is difficult to realize precise control by a fuzzy control scheme alone because control signals are derived from fuzzy inferences. On the other hand, pole-placement control can offer a precise control to a known system. In this paper, a VSC(variable structure control)scheme is proposed, which is an attempt to take merits of pole-placement control and fuzzy control. On the vicinity of the reference point the pole-placement control scheme takes over the role of the fuzzy controller to improve the set point response.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.155-162
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• 1999

A bare chip packaging technology by an encapsulated flip chip bonding on a build-up printed circuit board has emerged in 1991. Since then, it enabled a high density and low cost semiconductor packaging such as a direct chip bonding on mother board and high density surface mount components, such as BGA and CSP. This technology can respond to various requirements from applications and is considered to take over a main role of semiconductor packaging in the next decade.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.245-247
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• 2003

Elements of Pure Weld Metal(PWM) is important factor that understand to analyze Flux's conduct in SAW welding. For elements of PWM were got, Pile-up welding over 10 floor have used in the past. But, it take a long time to analyze elements of PWM in this method. Elements of Pure Weld Metal is needed to seize more easily. In this research, Bead welding is used to graps an element of Pure Weld Metal using mathematical formula which get to be derivation.

• 대한치과기공학회지
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• 제14권1호
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• pp.81-90
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• 1992

1. The dental technicians are worn to a frazzle by a hard work. Therfore, the term of manufacturing denture should be prolonged as 4$\sim$5 days. 2. The dental technicians work under the harmful environments. It should be improved the working conditions for the dental technicians. 3. In case of the women dental technicians, they feel like being treated discriminality. It should be take over a portion of the work in dental laboratory as the accountant' section and the technical section. 4. It should be abolished a pressent instruction dentist system.

• 한국안전학회지
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• 제7권3호
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• pp.89-98
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• 1992

In this study, the methods to identify the causes of electrical fires are suggested. Among several causes of electrocal fires, it is focused upon a short-circuit and an over-current accidents, which take the highest ratio compare with any other causes. To propose the exact method of identification, electric wires(HIV, IV), fuses and plug-receptacls are tested under the conditions of electrical accidents and external fires, respectively. By analyzing the microphotographs, the differences between the results from electrical fires and the others are found out.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1-1
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• 2009

Recently, the FPD industry has faced the limit in market growth due to lack of new growth engine as a replacement of television. With sluggish market demand deepened by global economic crisis and persistent concern over panel oversupply, growth of the panel market has sharply slowed down, and profitability has been eroded. This also has tremendous effect on related industries including component, material and machine industries, spreading a sense of crisis across the whole FPD industry. Under this circumstance, for the FPD industry to take off once again, all involved in the FPD industry must cooperate and come up with innovative ideas, and identify the driving force to realize turbo-charged growth.

• E2M - 전기 전자와 첨단 소재
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• 제8권6호
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• pp.795-805
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• 1995

A novel thin film processing technique has been developed for the fabrication of ultrathin films of conducting polymers with molecular-level control over thickness and multilayer architecture. This new self-assembly process opens up vast possibilities in applications which require large area, ultrathin films of conducting polymers and more importantly in applications that can take advantage of the unique interactions achievable in the complex, supermolecular architectures of multilayer films.

• 대한약학회:학술대회논문집
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• 대한약학회 2003년도 Proceedings of the Convention of the Pharmaceutical Society of Korea Vol.2-1
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• pp.29-31
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• 2003

People usually try to take in nutrition component which is necessary for physical growth, developing and maintaining the health through usually balanced dietary life. However in looking over the results of recent national nutrition survey, even if the nation’s average taking in nutrition condition is fairly good, considering the individual cases there has happened a problem about the balance of taking in nutrition due to the wrong dietary life. (omitted)