• 마이크로전자및패키징학회지
• /
• 제19권1호
• /
• pp.17-24
• /
• 2012

Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of $150^{\circ}C$ or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.1-26
• /
• 2004

The implementation of Pb-free solder technology is making good progress in electronic industry. Further understanding on fundamental issues on Pb-free solders/processes is required to reduce reliability risk factors of Pb-free solder joints. Several reliability issues including thermal fatigue, impact reliability, IMC growth, spalling, void formation are reviewed for Pb-free solder joints. Several applications of Pb-free technology are discussed, such as Pb-free, CBGA, CuCGA, flip chips, and wafer bumping by IMS.

• 마이크로전자및패키징학회지
• /
• 제7권2호
• /
• pp.13-19
• /
• 2000

금속간 화합물의 두께와 솔더와 금속간 화합물의 계면 거칠기가 Cu pad위의 BGA솔더 조인트의 전단강도에 미치는 영향을 Sn (0. 1.5, 2.5wt.% Cu)와 Sn-40Pb (0, 0.5wt.% Cu) 솔더를 사용하여 알아보았다. 각각의 조성의 솔더를 사용하여 솔더링 반응을 1, 2 ,4분 동안 한 후 전단강도를 측정하였다. Sn솔더에 Cu 첨가는 초기 금속간 화합물의 두께를 증가시키는 결과를 가져오는 반면 Sn-40Pb 솔더의 경우에는 주로 금속간 화합물/솔더의 계면거칠기의 감소를 가져오게 된다. 최대 전단 강도값을 나타내는 금속간 화합물의 임계두께는 솔더의 물질에 따라 변하게 되는데, 본 실험에서는 Sn-Cu솔더의 경우에는 ~2.3 $\mu\textrm{m}$, Sn-Pb-Cu에서는 ~ 1.2 $\mu\textrm{m}$ 정도로 측정되었다. 금속간 화합물의 임계두께는 금속간 화합물/솔더의 계면이 더욱 거칠어질수록 증가하는 것으로 나타났다. 이는 파단면 관찰에서 나타난 초기의 솔더내에서의 파괴가 금속간 화합물이 임계두께 이상으로 성장함에 금속간 화합물/솔더의 계면으로 이동하는 결과와 일치한다.

• 마이크로전자및패키징학회지
• /
• 제25권2호
• /
• pp.1-8
• /
• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.

• Electronic Materials Letters
• /
• 제14권6호
• /
• pp.678-688
• /
• 2018

The repeated-bending properties of Sn-0.7Cu, Sn-0.3Ag-0.7Cu (SAC0307), and Sn-3.0Ag-0.5Cu (SAC305) solders mounted on flexible substrates were studied using highly accelerated stress testing (HAST), followed by repeated-bending testing. In the Sn-0.7Cu joints, the $Cu_6Sn_5$ intermetallic compound (IMC) coarsened as the HAST time increased. For the SAC0307 and SAC305 joints, the $Ag_3Sn$ and $Cu_6Sn_5$ IMCs coarsened mainly along the grain boundary as the HAST time increased. The Sn-0.7Cu solder had a high contact angle, compared to the SAC0307 and SAC305 solders; consequently, the SAC0307 and SAC305 solder joints displayed smoother fillet shapes than the Sn-0.7Cu solder joint. The repeated-bending for the Sn-0.7Cu solder produced the crack initiated from the interface between the Cu lead wire and the solder, and that for the SAC solders indicated the cracks initiated at the surface, but away from the interface between the Cu lead wire and the solder. Furthermore, the oxide layer was thickest for Sn-0.7Cu and thinnest for SAC305, regardless of the HAST time. For the SAC solders, the crack initiation rate increased as the oxide layer thickened and roughened. $Cu_6Sn_5$ precipitated and grew along the grain and subgrain boundaries as the HAST time increased, embrittling the grain boundary at the crack propagation site.

• 한국전기전자재료학회논문지
• /
• 제36권2호
• /
• pp.186-190
• /
• 2023

We studied the various characteristics of Sn-In (wt%) Pb-free solders for photovoltaic ribbon application. The solders near the eutectic composition of Sn₄₈In₅₂ (wt%) existed in InSn₄ and In₃Sn alloy phases, and in In crystal phase, but not in Sn crystal phase. In addition, the InSn₄ phase (γ-alloy) existed separately from the In₃Sn (β-alloy) and the In phase confirmed by an SEM-EDS-mapping. The melting temperature of the eutectic solder of Sn₄₈In₅₂ (wt%) was 119.2℃, and when the Sn content decreased in reference to the eutectic composition, it slightly increased to 121.4℃, but when the Sn content increased, it remained almost constant at 119.1℃. The peel strength of the ribbon plated with the Sn₄₂In₅₈ (wt%) solder was 38.7 N/mm², and it tended to increase when the Sn content increased. The peel strength of the eutectic Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₅₁In₄₉ (wt%) solder was 61.6 N/mm² that was the highest.

• 한국전기전자재료학회논문지
• /
• 제37권1호
• /
• pp.74-78
• /
• 2024

We have studied the effects of Ag on the characteristics of Sn₄₈In₅₂Ag_x (wt%) low-melting solders for photovoltaic ribbons. The Sn₄₈In₅₂ (wt%) solder coexisted in the InSn₄ and In₃Sn alloys. Ag atoms added in the solder formed an AgIn₂ alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn₄₈In₅₂Ag_x (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn₄₈In₅₂ (wt%) solder was 53.6 N/mm², and that of the Sn₄₈In₅₂Ag₁ (wt%) solder largely increased to 125.1 N/mm². In the meanwhile, the melting temperature of the Sn₄₈In₅₂ (wt%) solder was 119.2℃, and that of the Sn₄₈In₅₂Ag₁ (wt%) solder decreased to 114.0℃.

• 마이크로전자및패키징학회지
• /
• 제7권2호
• /
• pp.47-53
• /
• 2000

TSM(Top Surface Metallurgy)이 증착된 유리기판의 Pb-free 솔더에 대한 젖음성을 무플럭스하에서 wetting balance법으로 평가하였다. TSM 층의 젖음성을 단면 증착시편의 wetting balance법으로부터 도출된 새로운 젖음성 지수들로 평가할 수 있었다. 유리기판의 TSM층으로는, Cu를 젖음층으로 하고 Au를 Cu의 산화 방지 층으로 사용하는 경우가 Au 자체를 젖음층으로 사용하는 경우보다 우수하였다. SnSb 솔더는 SnAg, SnBi, SnIn 솔더보다 TSM층에 대한 젖음특성이 우수하였다. 유리기판에 단면 증착된 TSM과 Pb-free솔더의 접촉각을 $F_{s}$와 기울어짐각을 측정하고, 메니스커스의 정적 상태에서 힘의 평형으로부터 유도된 식을 이용하여 계산할 수 있었다.

• 한국자동차공학회논문집
• /
• 제22권3호
• /
• pp.90-96
• /
• 2014

The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wettavility and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders. In this research, the shear punch(SP) test of Sn-4Ag-(Cu)/Ni pad was performed. Pb-free solder alloys which are the environmentally friendly of the electronic components were performed at $150^{\circ}C$ for 100hr~1000hr to artificial aging processing. In order to evaluate the mechanical properties of solder joints, the SP test was conducted at $30^{\circ}C$ and $50^{\circ}C$. As a result, the maximum shear strength of almost the whole specimens was decreased with the increase in aging time and temperature of SP test. The mechanical properties of Sn-4Ag-0.5Cu solder were most excellent in all Pb-free solder which were produced by the SP test at $30^{\circ}C$.

• 마이크로전자및패키징학회지
• /
• 제28권1호
• /
• pp.31-37
• /
• 2021

Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanically and electrically. Thus, improvement of SAC305 solders have been investigated continuously by addition of alloying elements, nano-particles and etc. In this paper, recent improvements of SAC solders including nano-composite alloys and related solderabilty and metallurgical and mechanical properties are investigated.