Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Characteristics of SAC305 and Nano-Particle Dispersed Solders

SAC305 및 나노 입자 분산 솔더의 특성

  • Kim, Jang Baeg (Department of Materials Science and Engineering, University of Seoul) ;
  • Seo, Seong Min (Department of Materials Science and Engineering, University of Seoul) ;
  • Kang, Hye Jun (Department of Materials Science and Engineering, University of Seoul) ;
  • Cho, Do Hoon (Department of Materials Science and Engineering, University of Seoul) ;
  • Rajendran, Sri Harini (Department of Materials Science and Engineering, University of Seoul) ;
  • Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul)
  • Received : 2021.03.08
  • Accepted : 2021.03.30
  • Published : 2021.03.30
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Abstract

Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanically and electrically. Thus, improvement of SAC305 solders have been investigated continuously by addition of alloying elements, nano-particles and etc. In this paper, recent improvements of SAC solders including nano-composite alloys and related solderabilty and metallurgical and mechanical properties are investigated.

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References

  1. M. Abtew, G. Selvaduray, "Lead-free Solders in Microelectronics", Material Science and Engineering: R: Reports, 27(5), 95-141 (2000). https://doi.org/10.1016/S0927-796X(00)00010-3
  2. T. J. Swanson, "Properties of Mixing SAC Solder Alloys with Bismuth-containing Solder Pastes for a Low Reflow Temperature Process", Master Thesis, pp.22-25, Rochester Institute of Technology, New York, US (2018).
  3. H. Nishikawa, N. Iwata, "Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process", Mater. Trans., 56, 1025-1029 (2015). https://doi.org/10.2320/matertrans.MI201421
  4. L. A. Wentlent, M. Genanu and T. Alghoul, "Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability," 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 425-433 (2018). doi: 10.1109/ECTC.2018.00070.
  5. H. Nishikawa, N. Iwata, "Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad", Journal of Materials Processing Technology, 215, 6-11 (2015). https://doi.org/10.1016/j.jmatprotec.2014.08.007
  6. H. Nishikawa, N. Iwata, H. Kubota, "Microstructure of lead-free solder bumps using laser reflow soldering", IOP Conf. Ser.: Mater. Sci. Eng., 61, 012038 (2014). doi: 10.1088/1757-899X/61/1/012038.
  7. J. O. Kim, J. P. Jung, J. H. Lee, J. Suh and H. S. Kang, "Effects of Laser Parameters on the Characteristics of a Sn3.5 wt.%Ag Solder Joint", Met. Mater. Int., 15(1), 119-123 (2009). https://doi.org/10.1007/s12540-009-0119-3
  8. A. K. Gain, Y. C. Chan, W. K. C. Yung, "Effect of additions of ZrO2nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads", Microelectronics Reliability, 51, 2306-2313 (2011). https://doi.org/10.1016/j.microrel.2011.03.042
  9. Y. Tang, C. Pan, and G. Li., "Influence of TiO2 Nanoparticles on Thermal Property, Wettability and Interfacial Reaction in Sn-3.0Ag-0.5Cu-xTiO2 Composite Solder", Journal of Materials Science: Materials in Electronics, 24(5), 1587-1597 (2016). https://doi.org/10.1007/s10854-012-0980-6
  10. C. Srivalli and M. Z. Abdullah., "Microstructure and Mechanical Properties of Pb-free Sn-3.0Ag-0.5Cu Solder Pastes Added with NiO Nanoparticles after Reflow Soldering Process", Materials & Design, 90, 499-507 (2016). https://doi.org/10.1016/j.matdes.2015.10.142
  11. Y. Shen, S. Zhou, J. Li, C. Yang, S. Huang, S. Lin, H. Nishikawa, "Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology", Materials and Design, 183(108144), 1-9 (2019).
  12. J. Chen, S. Lo, S. Hsu and C. Hsu, "Fabrication and Characteristics of SnAgCu Alloy Nanowires for Electrical Connection Application", Micromachines, 9(664), 1-8 (2018).
  13. D. H. Jung, D. U. Lim, B. G. Baek, S. H. Yim, J. H. Yonn, J. P. Jung, "Wettability Analysis of Solders using Wetting Balance Test (in Kor.)", J. Microelectron. Packag. Soc., 24(2), 1-9 (2017). https://doi.org/10.6117/kmeps.2017.24.2.001
  14. J. W. Kang, J. P. Jung, "Low Temperature Solder of Sn-Bi Series and Its Properties (in Kor.)", Electronics Packaging and Surface Mount Technology, 16, 41-50 (2020).
  15. W. S. Jeon, S. H. Rajendran and J. P. Jung, "Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders (in Kor.)", J. Microelectron. Packag. Soc., 26(3), 1-6 (2019)
  16. J. H. Lee, Y. M. Kim, J. H. Hwang, Y. H. Kim, "Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders", Journal of Alloys and Compounds, 547, 10-13 (2013).
  17. H. Fallahi, M. S. Nurulakmal, A. Fallahi, J. Abdullah, "Modifying the mechanical properties of lead-free solder by adding iron and indium and using a lap joint test", J Mater Sci: Mater Electron., 23, 1739-1749 (2012).
  18. Y. Li, X. Zhao, Y. Liu, Y. Wang and Y. Wang, "Effect of TiO2 Addition Concentration on the Wettability and Intermetallic Compounds Growth of Sn3.0Ag0.5Cu-xTiO 2 Nano-composite Solders", J Mater Sci: Mater in Electron., 25(9), 3816-3827 (2014). https://doi.org/10.1007/s10854-014-2094-9
  19. Y. Wang, X. Zhao, X. Xie, Y. Gu, and Y. Liu, "Effects of Nano-SiO 2 Particles Addition on the Microstructure, Wettability, Joint Shear Force and the Interfacial IMC Growth of Sn3.0Ag0.5Cu Solder", J Mater Sci: Mater in Electron., 26(12), 9387-9395 (2015). https://doi.org/10.1007/s10854-015-3151-8
  20. M. Qu, T. Cao, Y. Cui, F. Liu and Z. Jiao, "Effect of NanoZnO Particles on Wettability, Interfacial Morphology and Growth Kinetics of Sn-3.0Ag-0.5Cu-xZnO Composite Solder", J Mater Sci: Mater in Electron., 30(21), 19214-19226 (2019). https://doi.org/10.1007/s10854-019-02279-9
  21. Z. Yin, M. Lin, Q. Li and Z. Wu, "Effect of Doping Ni Nanoparticles on Microstructure Evolution and Shear Behavior of Sn-3.0Ag-0.5Cu(SAC305)/Cu-2.0Be Solder Joints during Reflowing", J Mater Sci: Mater in Electron., 31(6), 4905-4914 (2020). https://link.springer.com/article/10.1007/s10854-020-03054-x.
  22. A. Sharma, H. R. Sohn and J. P. Jung, "Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy", Metallurgical and Materials Transactions, A 47(1), 494-503 (2016).
  23. S. Lotfian, J. M. Molina-Aldareguia, K. E. Yazzie, J. Llorca, N. Chawla, "Mechanical characterization of lead-free Sn-Ag-Cu solder joints by high-temperature nanoindentation", Journal of Electronic Materials, 42, 1085-1091 (2013). https://doi.org/10.1007/s11664-013-2517-z
  24. T. Fouzder, I. Shafiq, Y. C. Chan, A. Sharif and W. K. C. Yung. "Influence of SrTiO3 Nano-particles on the Microstructure and Shear Strength of Sn-Ag-Cu Solder on Au/Ni Metallized Cu Pads", Journal of Alloys and Compounds, 509(5), 1885-1892 (2011). https://doi.org/10.1016/j.jallcom.2010.10.081
  25. F. Cheng, H. Nichikawa, T. Takemoto, "Microstructural and mechanical properties of Sn-Ag-Cu lead-free solders with minor addition of Ni and/or Co", Journal of Material Science, 23, 3643-3648 (2008).
  26. G. Chen, X. H. Wang, J. Yang, W. L. Xu, Q. Lin, "Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders", Microelectronics Reliability, 108, 113634 (2020). https://doi.org/10.1016/j.microrel.2020.113634
  27. D. H. Jung, A. Sharma, D. U. Lim, J. H. Yun and J. P. Jung, "Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder", Metallurgical and Materials Transactions A, 48(9), 4372-4384 (2017). https://doi.org/10.1007/s11661-017-4178-7
  28. M. Rui, X. Lu, S. Chen, L. Ye, J. Liu, "Ti02 Nanoparticles Functionalized Sn/3.0Ag/O.5Cu Lead-free Solder", IEEE International Conference on Electronic Packaging Technology & High Density Packaging, Guilin, China, 203-207 (2012).
  29. A. A. El-Daly, W. M. Desoky, T. A. Elmosalami, M. G. ElShaarawy, A. M. Abdraboh, "Microstructural modifications and properties of SiC nanoparticles reinforced Sn-3.0Ag-0.5Cu solder alloy", Materials & Design, 65, 1196-1204 (2015). https://doi.org/10.1016/j.matdes.2014.08.058