Sodalime-sodalime Electrostatic Bonding using Amorphous Silicon Interlayer and Its Application to FEA Packging (비정질 실리콘 박막을 이용한 Sodalime-Sodalime 정전 열 접합 및 FEA Packaging 응용)
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- The Transactions of the Korean Institute of Electrical Engineers C
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- v.48 no.9
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- pp.656-661
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- 1999