• Design & Manufacturing
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• v.13 no.1
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• pp.13-18
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• 2019

The size and prospects of the domestic semiconductor equipment market are increasing every year. In the case of various parts used inside semiconductor equipments, high durability such as high strength and abrasion resistance is demanded. Particularly, the gases used in semiconductor production processes are toxic. In order to prevent such toxic gas leakage, a precision processing technique and a surface treatment technique for preventing corrosion are required. Electro-polishing is an electro-chemical method of polishing a metal surface to make it smooth and polished. Electro-polishing is mainly used in the finishing process of metal surface. Unlike mechanical polishing, electro-polishing is used in many fields, such as fine chemical etching equipment, since no damaged layer or burr, fine polishing groove and particles are generated. However, in order to withstand the gas used in the semiconductor equipment, the parts must have high corrosion resistance. However, the surface hardness generally become lowered through electro-polishing. Therefore, in this study, surface hardness were experimentally observed before and after electro-polishing. Then, a method of improving hardness by preparing a nitrided layer by plasma ion nitriding treatment.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.6-13
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• 2021

Cases and studies on the selection method of CTQ are relatively active, but there are few cases or studies on the selection method of CTP which is important in the device industry. In fact, many companies simply select and manage CTP from the point of contact based on their experience and intuition. The purpose of this study is to present an evaluation model and a mathematical decision model for rational and systematic CTP selection to improve the process quality of semiconductor equipment lines. In the evaluation model, AHP (Analytic Hierarchy Process) analysis technique was applied to show objective and quantitative figures, and Fuzzy decision-making model was used to solve the ambiguity and uncertainty in the decision-making process. Decision Value (DV) was presented. The subjects were 22 process factors managed in the Plating Process that the representative equipment line can do. As a result, the evaluation model proposed in this study can support more efficient and effective decision-making for process quality improvement by more objectively measuring the problem of subjective CTP selection in manufacturing sites.

• Journal of Advanced Navigation Technology
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• v.15 no.6
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• pp.1104-1110
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• 2011

The conventional semiconductor equipment has adopted SRAM module as the test pattern memory, which has a simple design and does not require refreshing. However, SRAM has its disadvantages as it takes up more space as its capacity becomes larger, making it difficult to meet the requirements of large memories and compact size. if DRAM is adopted as the semiconductor inspection equipment, it takes up less space and costs less than SRAM. However, DRAM is also disadvantageous because it requires the memory cell refresh, which is not suitable for the semiconductor examination equipments that require correct timing. Therefore, In this paper, we will proposed an algorithm for punctuality guarantee of memory-free inspection equipment using DDR2 SDRAM. And we will Developed memory controller using punctuality guarantee algorithm. As the results, show that when we adopt the DDR2 SDRAM, we can get the benefits of saving 13.5 times and 5.3 times in cost and space, respectively, compared to the SRAM.

• Journal of the Korean Institute of Gas
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• v.22 no.1
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• pp.78-85
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• 2018

In this study, we analyzed risks of the fabrication process equipment and cleanroom for semiconductor/flat panel display (FPD) manufacturing facilities and studied the fundamental safety measures for the risk factors. We examined the explosion proof design models considering the specificity of equipment and environment, and planned to utilize the findings to provide technical standards and grounds for designing and manufacturing related equipment. We believe that this study will contribute to the establishment of technical standards for semiconductor/FPD industry and businesses in many different ways by providing optimized modeling of high-risk explosion site detection, developing safety standards and hazard countermeasures and voluntary activation of safety certification system for operation of fabrication process equipment.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.161-166
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• 2021

Errors in the semiconductor process are generated by a change in the state of the equipment, and errors usually arise when the state of the equipment changes or when parts that make up the equipment have flaws. In this investigation, we anticipated that aging of the mass flow controller in the plasma enhanced chemical vapor deposition SiO2 thin film deposition method caused a minute flow rate shift. In seven cases, fourier transformation infrared film quality analysis of the deposited thin film was used to characterize normal and pathological processes. The plasma condition was monitored using optical emission spectrometry data as the flow rate changed during the procedure. Preprocessing was used to apply the collected OES data to the artificial immune system algorithm, which was then used to process diagnosis. Through comparisons between datasets, the learning algorithm compared classification accuracy and improved the method. It has been confirmed that data characterized as a normal process and abnormal processes with differing flow rates may be discriminated by themselves using the artificial immune system data mining method.

• Journal of KSNVE
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• v.9 no.6
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• pp.1227-1233
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• 1999

Modern technology depends on the reliability of extremely high technology equipments. In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a nanometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. This paper deals with the structural dynamic design in high class semiconductor factory in order to be satisfied more strict vibration criteria for high sensitive equipment.

• Journal of the Semiconductor & Display Technology
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• v.3 no.2
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• pp.11-15
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• 2004

Scales, accumulated on some parts of semiconductor equipments such as sputters and CVD during the device fabrication processes, often lower the lifetime of the equipments and production yields. Thus, many equipment parts have be cleaned regularly. In this study, an attempt to establish an effective process to remove scales on the sidewall of collimators located inside the chamber of the sputter was made. The EDX analysis revealed that the scales were composed of Ti and TiN with the columnar structure. Through the trial-and-error experiments, it was found that the etching in the $HNO_3$:$H_2SO_4$:$H_2O$=4:2:4 solution for 5.5 hrs at $67^{\circ}C$, after the oxide removal in the HF solution, and the heat-treatment at $700^{\circ}C$ for 1 min., was the most effective process for the scale removal.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.168-173
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• 2022

As the function of a product is advanced and the process is refined, the yield in the fine manufacturing process becomes an important variable that determines the cost and quality of the product. Since a fine manufacturing process generally produces a product through many steps, it is difficult to find which process or equipment has a defect, and thus it is practically difficult to ensure a high yield. This paper presents the system architecture of how to build a smart manufacturing system to analyze the big data of the manufacturing plant, and the equipment factor analysis methodology to increase the yield of products in the smart manufacturing system. In order to improve the yield of the product, it is necessary to analyze the defect factor that causes the low yield among the numerous factors of the equipment, and find and manage the equipment factor that affects the defect factor. This study analyzed the key factors of abnormal equipment that affect the yield of products in the manufacturing process using the data mining technique. Eventually, a methodology for finding key factors of abnormal equipment that directly affect the yield of products in smart manufacturing systems is presented. The methodology presented in this study was applied to the actual manufacturing plant to confirm the effect of key factors of important facilities on yield.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.154-159
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• 2003

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.301-305
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• 2007