• Title/Summary/Keyword: seed Layer

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Control of Grain Size of PZT Thin Film through Seed Layers (Seed Layer를 통한 PZT 박막의 결정립 크기 조절)

  • Kim, Tae-Ho;Kim, Ji-Young;Lee, In-Sup
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.05b
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    • pp.273-278
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    • 2000
  • In order to study effects of interface layers between PZT films and electrodes for MFM(Metal-Ferroelectric-Metal) structure capacitors, we have fabricated the capacitors with the Pt/PZT/interface-layer/Pt/$TiO_2/SiO_2/Si$ structure. $PT(PbTiO_3)$ interface layers were formed by sol-gel deposition and PbO, $ZrO_2$ and $TiO_2$ thin layers were deposited by reactive sputtering. $TiO_2$ interface layers result in the finest grains of PZT films compared to $PbO_2$ and $ZrO_2$ layers. On the other hand, PT interface layers result in improved morphology of PZT films and do not significantly change ferroelectric properties. It is also observed that seed layers at the middle and top of PZT films do not give significant effects on grain size but the PT seed layer at the interface between the bottom electrode and the PZT films results in the small grain size.

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Novel Environmentally Benign and Low-Cost Pd-free Electroless Plating Method Using Ag Nanosol as an Activator

  • Kim, Jun Hong;Oh, Joo Young;Song, Shin Ae;Kim, Kiyoung;Lim, Sung Nam
    • Journal of Electrochemical Science and Technology
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    • v.8 no.3
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    • pp.215-221
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    • 2017
  • The electroless plating process largely consists of substrate cleaning, seed formation (activator formation), and electroless plating. The most widely used activator in the seed formation step is Pd, and Sn ions are used to facilitate the formation of this Pd seed layer. This is problematic because the Sn ions interfere with the reduction of Cu ions during electroless plating; thus, the Sn ions must be removed by a hydrochloric acid cleaning process. This method is also expensive due to the use of Pd. In this study, Cu electroless plating was performed by forming a seed layer using a silver nanosol instead of Pd and Sn. The effects of the Ag nanosol concentration in the pretreatment solution and the pretreatment time on the thickness and surface morphology of the Cu layer were investigated. The degrees of adhesion to the substrate were similar for the electroless-plated Cu layers formed by conventional Pd activation and those formed by the Ag nanosol.

Development of Real-time Screening System for Superior Melon Seeds Using Optical Coherence Tomography (광간섭 단층촬영법을 이용한 우량 참외 종자 실시간 감별 시스템 개발)

  • Han, Seunghoon;Lee, Changho;Lee, Seung-Yeol;Jung, Hee-Young;Kim, Jeehyun
    • Journal of Sensor Science and Technology
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    • v.22 no.4
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    • pp.262-267
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    • 2013
  • We developed a real-time screening system using optical coherence tomography (OCT) to distinguish the fruitful melon seeds efficiently. Cross-section images of melon seeds infected with Cucumber green mottle mosaic virus (CGMMV) showed an additional layer that did not appear in normal seeds. Additional layer appeared under $100{\sim}300{\mu}m$ from the surface of the seed. OCT can visualize the micro-structural and morphological changes of the internal seed structure. Real-time OCT seed screening system provided the real-time, non-destructive, cross-section image and quantitative information such as A-scan analysis of selected region in the cross-section image. We can distinguish the viral infection seeds while monitoring the averaged A-scan analysis graph in real-time by considering the second peak value of the graph which refers to the layer that occurred owing to the virus. Real-time OCT seed screening system could assist to distinguish the disease caused by CGMMV.

Effect of the pH Value of Seed Coating Solution on Microstructure of Silicalite-1 Zeolite Separation Layer Grown on α-Alumina Support (종결정 코팅용액 pH 값이 α-알루미나 지지체 표면에 성장하는 Silicalite-1 제올라이트 분리층의 미세구조에 미치는 영향)

  • Hu, Sigui;Kim, Min-Zy;Lee, Du-Hyoung;Sharma, Pankaj;Han, Moon-Hee;Cho, Churl-Hee
    • Membrane Journal
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    • v.25 no.5
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    • pp.422-430
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    • 2015
  • The present study announces that the pH value of seed coating solution makes a significant effect on the microstructure of silicalite-1 zeolite layer formed on ${\alpha}$-alumina support. Seed with an average diameter of 75 nm was dispersed in ethanol to prepare three kinds of seed coating solutions with different pH values, and dip-coated on the support. The pH value was controlled to be 2.2, 7.0, and 9.3, respectively. In the secondary growth process, pH 7 seed solution resulted an uniform, 3 to $4{\mu}m$ thick, completely covered, and 100 nm grained silicalite-1 zeolite separation layer. The uniformity and completeness were explained by a uniform, closely packed, multi-layered, and completely covered seed coating in the pH 7 condition. In the condition, ${\alpha}$-alumina support and seed are oppositely charged: support is positively charged (8.4 mV) and seed, negatively (-1.7 mV). The opposite charging induced a strong electrostatic attraction between seed and support, which made the good seed coating state. On the other hand, pH 2.2 and pH 9.3 seed solutions resulted non-uniform, partially covered, and around $1{\mu}m$ grained zeolite separation layer, since seed and support are the same sign charged in the conditions. The same sign charging induced a strong electrostatic repulsion between seed and support which caused a low coverage of seed. It could be concluded that the pH value of seed coating solution is a key parameter to determine the microstructure of silicalite-1 zeolite separation layer.

Adhesion reliability of flexible copper clad laminate under constant temperature and humidity condition by thickness of Ni/Cr seed layer (항온항습 조건하에서 Ni/Cr 층의 두께에 따른 FCCL의 접합 신뢰성 평가)

  • Choi, Jung-Hyun;Noh, Bo-In;Yoon, Jeong-Won;Yoon, Jae-Hyun;Choi, Don-Hyun;Kim, Yong-Il;Jung, Seong-Boo
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.75-75
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    • 2009
  • 연성회로기판은 일반적으로 절연체를 이루는 폴리이미드와 전도체를 이루는 구리로 구성되어 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 기계적 특성, 공정성 등의 장점으로 인해 연성회로기판의 절연체로서 제안되었지만 전도체를 이루는 구리와의 접합 특성이 우수하지 않기 때문에 많은 연구가 현재까지 진행되고 있고, 그 결과 연성회로기판의 접합 특성에 많은 개선이 이루어짐과 동시에 다양한 공정 방법이 제안되고 있다. 하지만 고온다습한 환경에서 사용될 경우 폴리이미드의 높은 흡습성과, 구리와 seed layer의 산화 문제로 인해 접합 특성이 저하된다는 단점 또한 가지고 있다. 따라서 본 연구를 통해 고온다습한 조건하에서 seed layer가 80Ni/20Cr 합금으로 구성된 연성회로기판의 seed layer의 두께와 시효시간으로 인해 발생하는 접합 신뢰성의 차이를 관찰하였다. 본 연구에서는 두께 $25{\mu}m$의 폴리이미드 위에 각각 100, 200, $300{\AA}$ 두께의 80Ni/20Cr의 합금 조성을 가지는 seed layer를 스퍼터링 공정을 통해 형성한 후 전해도금법을 이용하여 $8{\mu}m$ 두께의 구리 전도층을 형성하였다. 접합 특성 평가를 위해 ICP 규격에 따라 전도층 패턴을 폭 3.2mm, 길이 230mm로 시편을 제작하여 50.8mm/min의 이송 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 또한 $85^{\circ}C$/85% 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효 처리 후 같은 방법으로 연성회로기판의 접합 특성을 평가하였다. 파면의 형상과 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 파면의 잔여물 분석을 위해 EPMA (Energy probe microanalysis)를 사용하였고 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 분석하였다.

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Electron Microscopic Study for the Influence of Soaking in Hot Water and Prochloraz Solution on Spore and Mycelium of Fusarium fujikuroi Infected in Rice Seed (온탕소독과 prochloraz 침지소독이 벼 종자에 감염된 Fusarium fujikuroi의 포자와 균사의 형태에 미치는 영향에 대한 전자현미경적 연구)

  • Park, Woo-Sik;Yeh, Wan-Hae;Lee, Se-Weon;Han, Seong-Suk;Lee, Jun-Seong;Lim, Chun-Keun;Lee, Yong-Hwan
    • Research in Plant Disease
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    • v.14 no.3
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    • pp.176-181
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    • 2008
  • This experiment was conducted to find the causes of ineffective seed disinfection methods such as rice seeds soaking in hot water and prochloraz EC solution when the rice seeds were severely infected by Bakanae disease. In case of rice seeds collected from severely diseased field by Bakanae disease, the pathogen as the forms of spores and mycelium were infected in plumule and inner and outer integument of embryo, aleurone layer, and pericarp layer. When the rice seeds were soaked in hot water, the appearances of spores and hypha on the outer pericarp layer were severely disordered, however those of inner region of outer integument and aleurone layer were shown normal. The membrane of hypha on the outer pericarp layer was destroyed within 24 hours, while some spores were healthy and germinated 7 days after soaking, when the rice seeds soaked 24 hours in 125 ppm prochloraz solution at $30^{\circ}C$. These results indicated that the seed disinfection methods were ineffective on the Bakanae disease severely infected rice seed because the hot water did not transmit the pericarp layer of rice seed and also prochloraz solution did not effectively destroy the spore of pathogen.

Characteristics variation of CoCrTa/Si double layer thin film on variation of underlayer substrate temperature (하지층기판온도에 따른 CoCrTa/Si 이층박막의 특성변화)

  • 박원효;김용진;금민종;가출현;손인환;최형욱;김경환
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.77-80
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    • 2001
  • Crystallographic and magnetic characteristics of CoCr-based magnetic thin film for perpendicular magnetic recording media were influenced on preparing conditions. In these, there is that substrate temperature was parameter that increases perpendicular coercivity of CoCrTa magnetic layer using recording layer. While preparation of CoCr-based doublelayer, by optimizing substrate temperature, we expect to increase perpendicular anisotropy of CoCr magnetic layer and prepare ferromagnetic recording layer with a good quality by epitaxial growth. CoCrTa/Si doublelayer showed a good dispersion angle of c-axis orientation $\Delta$$\theta$$_{50}$ caused by inserting amorphous Si underlayer which prepared at underlayer substrate temperature 250C. Perpendicular coercivity was constant, in-plane coercivity was controlled a low value about 2000e. This result implied that Si underlayer could restrain growth of initial layer of CoCrTa thin film, which showed bad magnetic properties effectively without participating magnetization patterns of magnetic layer. In case of CoCrTa/Si that prepared with ultra thin underlayer, crystalline orientation of CoCrTa was improved rather underlayer thickness 1nm, it was expected that amorphous Si layer played a important role in not only underlayer but also seed layer.t also seed layer.r.

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Morphology Control of ZnO Nanostructures by Surfactants During Hydrothermal Growth (수열합성중 계면활성제를 이용한 ZnO 나노구조 형상 제어)

  • Park, Il-Kyu
    • Journal of Powder Materials
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    • v.23 no.4
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    • pp.270-275
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    • 2016
  • We report on an all-solution-processed hydrothermal method to control the morphology of ZnO nanostructures on Si substrates from three-dimensional hemispherical structures to two-dimensional thin film layers, by controlling the seed layer and the molar contents of surfactants during their primary growth. The size and the density of the seed layer, which is composed of ZnO nanodots, change with variation in the solute concentration. The ZnO nanodots act as heterogeneous nucleation sites for the main ZnO nanostructures. When the seed layer concentration is increased, the ZnO nanostructures change from a hemispherical shape to a thin film structure, formed by densely packed ZnO hemispheres. In addition, the morphology of the ZnO layer is systematically controlled by using trisodium citrate, which acts as a surfactant to enhance the lateral growth of ZnO crystals rather than a preferential one-dimensional growth along the c-direction. X-ray diffraction and energy dispersive X-ray spectroscopy results reveal that the ZnO structure is wurtzite and did not incorporate any impurities from the surfactants used in this study.

A Study on the Fabrication of Ni Stamper for 50nm Class of Patterns (50nm급 패턴 니켈 스탬퍼 제작에 관한 연구)

  • Yoo, Yeong-Eun;Oh, Seung-Hun;Lee, Kwan-Hee;Kim, Seon-Gyeong;Youn, Jae-Sung;Choi, Doo-Sun
    • 한국금형공학회:학술대회논문집
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    • 2008.06a
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    • pp.35-38
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    • 2008
  • A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.

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Growth of Non-Polar a-plane ZnO Layer On R-plane (1-102) Sapphire Substrate by Hydrothermal Synthesis (저온 수열 합성법에 의해 (1-102) 사파이어 기판상에 성장된 무분극 ZnO Layer 에 관한 연구)

  • Jang, Jooil;Oh, Tae-Seong;Ha, Jun-Seok
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.45-49
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    • 2014
  • In this study, we grew non-polar ZnO nanostructure on (1-102) R-plane sapphire substrates. As for growth method of ZnO, we used hydrothermal synthesis which is known to have the advantages of low cost and easy process. For growth of non-polar, the deposited AZO seed buffer layer with of 80 nm on R-plane sapphire by radio frequency magnetron sputter was annealed by RTA(rapid thermal annealing) in the argon atmosphere. After that, we grew ZnO nanostructure on AZO seed layer by the added hexamethylenetramine (HMT) solution and sodium citrate at $90^{\circ}C$. With two types of additives into solution, we investigated the structures and shapes of ZnO nanorods. Also, we investigate the possibility of formation of 2D non-polar ZnO layer by changing the ratio of two additives. As a result, we could get the non-polar A-plane ZnO layer with well optimized additives' concentrations.