• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.137-140
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• 2001

This paper shows an asynchronous comparator circuit for 1.2Gbps signal receiver that converts 1.2Gbps data rate input signals with less than 100㎷ swing to on-chip CMOS compatible voltage levels in a 0.35${\mu}{\textrm}{m}$ CMOS process. Folded-cascode nMOS input stage with source-coupled pMOS input stage cover rail-to-rail input common-mode range. Drastic gain-bandwidth increment due to gain-boosting stage with positive-feedback latch as well as wide input common-mode range make designed circuit be suitable for a fully differential signal receiver. HSPICE simulation results show that worst-case sensitivity is less than 20㎷ and maximum propagation delay is 640-psec. And also we verified 3.97㎽ power consumption with 150㎷ differential swing amplitude at 1.2Gbps.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.602-607
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• 2004

This paper describes the characteristics of Ru-Zr alloy gate electrodes deposited by co-sputtering. The various atomic composition was made possible by controlling sputtering power of Ru and Zr. Thermal stability was examined through 600 and 700 $^{\circ}C$ RTA annealing. Variation of oxide thickness and X-ray diffraction(XRD) pattern after annealing were employed to determine the reaction at interface. Low and relatively stable sheet resistances were observed for Ru-Zr alloy after annealing. Electrical properties of alloy film were measured from MOS capacitor and specific atomic composition of Zr and Ru was found to yield compatible work function for nMOS. Ru-Zr alloy was stable up to $700^{\circ}C$ while maintaining appropriate work function and oxide thickness.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.10
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• pp.794-798
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• 2011

This paper was carried out design of 1,700 V Base Resistance Thyristor for fabrication. We decided conventional BRT (base resistance thyristor) device and Trench Gate type one for design. we carried out device and process simulation with T-CAD tools. and then, we have extracted optimal device and process parameters for fabrication. we have analysis electrical characteristics after simulations. As results, we obtained 2,000 V breakdown voltage and 3.0 V Vce,sat. At the same time, we carried out field ring simulation for obtaining high voltage.

• Proceedings of the KIEE Conference
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• 2009.04b
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• pp.125-130
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• 2009

This paper reviews the characteristics technical trends in Power MOSFET technology that are leading to improvements in power loss for power electronic system. The power electronic technology requires the marriage of power device technology with MOS-gated device and bipolar analog circuits. The technology challenges involved in combining power handling capability with finger gate, trench array, super junction structure, and SiC transistor are described, together with examples of solutions for telecommunications, motor control, and switch mode power supplies.

• Journal of IKEEE
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• v.23 no.2
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• pp.454-460
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• 2019

In this paper, a watt-level 2.4-GHz RFCMOS linear power amplifier (PA) with pre-distortion method using variable capacitance with respect to input power is demonstrated. The proposed structure is composed of a power detector and a MOS capacitor to improve the linearity of the PA. The pre-distortion based linearizer is embedded in the two-stage PA to compensate for the gain compression in the amplifier stages, it also improves the output P1dB by approximately 1 dB. The simulation results demonstrate a 1-dB gain compression power of 30.81 dBm at 2.4-GHz, and PAE is 29.24 % at the output P1dB point.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.10
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• pp.917-925
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• 2016

Schmitt Trigger logic is a gate level design method to have hysteresis characteristics to improve noise immunity in digital circuits. Dynamic Threshold voltage MOS(DTMOS) Schmitt trigger circuits can improve noise immunity without adding additional transistors but by controlling substrate bias. The performance of DTMOS Schmitt trigger logic has not been verified yet in standard CMOS process through measurement. In this paper, DTMOS Schmitt trigger logic was implemented and verified using Magna $0.18{\mu}m$ MPW process. DTMOS Schmitt trigger buffer, inverter, NAND, NOR and simple digital logic circuits were made for our verification. Hysteresis characteristics, power consumption, and delay were measured and compared with common CMOS logic gates. EM Immunity enhancement was verified through Direct Power Injection(DPI) noise immunity test method. DTMOS Schmitt trigger logics fabricated using CMOS process showed a significantly improved EM Immunity in 10 M~1 GHz frequency range.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.10a
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• pp.527-530
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• 2016

This paper presents curvature-compensated reference circuits operating under low-voltage condition and achieving low-power consumption with $0.35-{\mu}m$ standard CMOS process. The proposed circuit can operate under less than 1-V supply voltage by using MOS transistors operating in weak-inversion region. The simulation results shows a low temperature coefficient by using the proposed curvature compensation technique. It generates a graph-shape temperature characteristic that looks like a sine curve, not a bell-shape characteristic presented in other published BGRs without curvature compensation. The proposed circuits operate with 0.9-V supply voltage. First, the voltage reference circuit consumes 176nW power and the temperature coefficient is $26.4ppm/^{\circ}C$. The current reference circuit is designed to operate with 194.3nW power consumption and $13.3ppm/^{\circ}C$ temperature coefficient.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.382-383
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• 2011

전력거래소는 본사이전 및 신규 급전소신설과 기존 시스템의 한계수명 도달에 대비하여 현재 운용중인 전력IT 시스템을 새롭게 구축할 예정이다. 전력거래소 차기 전력IT 시스템은 안정하고 공정한 전력계통 및 전력시장 운영을 지원하기 위해 계통운영시스템(EMS), 시장운영시스템(MOS) 그리고 전력IT 기반설비로 구성된다. 본 논문에서는 전력계통의 감시 및 제어를 위한 계통운영시스템 그중에서도 전력계통의 안전도 감시 기능과 안전도 개선 기능에 대해 소개하고자 한다.

• ETRI Journal
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• v.33 no.6
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• pp.880-886
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• 2011

With the introduction of high-current 8-inch solar cells, conventional Schottky bypass diodes, usually adopted in photovoltaic (PV) panels to prevent the hot spot phenomenon, are becoming ineffective as they cause relatively high voltage drops with associated undue power consumption. In this paper, we present the architecture of an active circuit that reduces the aforementioned power dissipation by profitably replacing the bypass diode through a power MOS switch with its embedded driving circuitry. Experimental prototypes were fabricated and tested, showing that the proposed solution allows a reduction of the power dissipation by more than 70% compared to conventional Schottky diodes. The whole circuit does not require a dedicated DC power and is fully compatible with standard CMOS technologies. This enables its integration, even directly on the panel, thereby opening new scenarios for next generation PV systems.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.6
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• pp.742-750
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• 2018

In this paper, in order to enable zero-layer FTP cell using only 5V MOS devices on the basis of $0.13{\mu}m$ BCD process, the tunnel oxide thickness is used as the gate oxide thickness of $125{\AA}$ of the 5V MOS device at 82A. The HDNW layer, which is the default in the BCD process, is used. Thus, the proposed zero layer FTP cell does not require the addition of tunnel oxide and DNW mask. Also, from the viewpoint of memory IP design, a single memory structure which is used only for trimming analog circuit of PMIC chip is used instead of the dual memory structure dividing into designer memory area and user memory area. The start-up circuit of the BGR (Bandgap Reference Voltage) generator circuit is designed to operate in the voltage range of 1.8V to 5.5V. On the other hand, when the 64-bit FTP memory IP is powered on, the internal read signal is designed to maintain the initial read data at 00H. The layout size of the 64-bit FTP IP designed using the $0.13-{\mu}m$ Magnachip process .is $485.21{\mu}m{\times}440.665{\mu}m$($=0.214mm^2$).