• Title/Summary/Keyword: porous silicon

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Optical Characterization of DBR Porous Silicon by Changing of Applied Current Density (전류세기의 변화에 따른 DBR 다공성 실리콘의 광학적 특성)

  • Choi, Tae-Eun;Park, Jaehyun
    • Journal of Integrative Natural Science
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    • v.2 no.2
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    • pp.82-85
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    • 2009
  • Distributed Bragg reflector (DBR) porous silicon (PSi) was generated by an electrochemical etching a bragg structure into a silicon wafer through electrode current in aqueous ethanolic HF solution. DBR PSi exhibiting unique reflectivity was successfully obtained by an electrochemical etching of silicon wafer using square current waveform. The multilayered photonic crystals of DBR PSi exhibited the reflection of a specific wavelength with high reflectivity in the optical reflectivity spectrum. In this work, we have developed a method to create refractive index in Si substrate through intensity of an electric current. The electrochemical process allows for precise control of the structural properties of DBR PSi such as thickness of the porous layer, porosity, and average pore diameter. The number of reflection peak of DBR PSi and its pore size increased as the intensity of electric current increased. This might be a demonstration for the fabrication of specific reflectors or filters.

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C-V Characteristics of Oxidized Porous Silicon (다공성 실리콘 산화막의 C-V 특성)

  • Kim, Seok;Choi, Doo-Jin
    • Journal of the Korean Ceramic Society
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    • v.33 no.5
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    • pp.572-582
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    • 1996
  • The porous silicon was prepared in the condition of 70mA/cm2 and 5.10 sec and then oxidized at 800~110$0^{\circ}C$ MOS(Metal Oxide Semiconductor) structure was prepared by Al electrode deposition and analyzed by C-V (Capacitance-Voltage) characteristics. Dielectric constant of oxidized porous silicon was large in the case of low temperature (800, 90$0^{\circ}C$) and short time(20-30min) oxidation and was nearly the same as thermal SiO2 3.9 in the case of high temperature (110$0^{\circ}C$) and long time (above 60 min) It is though to be caused byunoxidized silicon in oxidized porous silicon film and capacitance increase due to surface area increment effect.

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Porous silicon : a new material for microsensors and microactuators (다공질 실리콘: 새로운 마이크로센서 및 마이크로액추에이터 재료)

  • Min Nam Ki;Chi Woo Lee;Jeong Woo Sik;Kim Dong Il
    • Journal of the Korean Electrochemical Society
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    • v.2 no.1
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    • pp.17-22
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    • 1999
  • Since the use of porous silicon for microsensors and microactuators is in the euly stage of study, only several application devices, such as light-emitting diodes and chemical sensors have so far been demonstrated. In this paper we present an overview of the present status of porous silicon sensors and actuators research with special emphasis on the applications of chemical sensors and optical devices. The capacitive type porous silicon humidity sensors had a nonlinear capacitance-humidity characteristic and a good sensitivity at higher humidity above $40\%RH$. The porous silicon $n^+-p-n^+$ device showed a sharp increase in current when exposed to an ethanol vapor. The $p^+-PSi-n^+$ diode fabricated on porous silicon diaphragm exhibited an optical switching characteristic, opening up its utility as an optical sensor or switch. The photoluminescence (PL) spectrum, taken from porous silicon under 365 nm excitation, had a broad emission, peaked at -610 nm. The electroluminescence(EL) from ITO/PSi/In LED had a broader spectrum with a blue shifted peak at around 535nm than that of the PL.

Thermal Oxidation of Porous Silicon (다공질 실리콘 (Porous Silicon) 의 열산화)

  • Yang, Cheon-Soon;Park, Jeong-Yong;Lee, Jong-Hyun
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.27 no.10
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    • pp.106-112
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    • 1990
  • The progress of oxidation of a porous silicon layer(PSL) was studied by examining the temperature dependence of the oxidation and the infrared absorption spectra. Thick OPSL(oxidized porous silicon layer). which has the same properties as thermal $SiO_{2}$ of bulk silicon, is formed in a short time by two steps wet oxidation of PSL at $700^{\circ}C$, 1 hr and $1100^{\circ}C$, 1 hr. Etching rate, breakdown strength of the OPSL are strongly dependent on the oxidation temperature, oxidation atmosphere. And its breakdown field was ${1\MV/cm^-2}$ MV/cm The oxide film stress was determined through curvature measurement using a dial gauge. During oxidation at temperature above $1000^{\circ}C$ in dry $O_{2}$, stress on the order of ${10^9}\dyne/{cm^2}{-10^10}\dyne/{cm^2}$ are generated in the OPSL.

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Chemical Sensors Based on Distributed Bragg Reflector Porous Silicon Smart Particles

  • Sohn, Honglae
    • Journal of Integrative Natural Science
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    • v.8 no.1
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    • pp.67-74
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    • 2015
  • Sensing characteristics for porous smart particle based on DBR smart particles were reported. Optically encoded porous silicon smart particles were successfully fabricated from the free-standing porous silicon thin films using ultrasono-method. DBR PSi was prepared by an electrochemical etch of heavily doped $p^{++}$-type silicon wafer. DBR PSi was prepared by using a periodic pseudo-square wave current. The surface-modified DBR PSi was prepared by either thermal oxidation or thermal hydrosilylation. Free-standing DBR PSi films were generated by lift-off from the silicon wafer substrate using an electropolishing current. Free-standing DBR PSi films were ultrasonicated to create DBR-structured porous smart particles. Three different surface-modified DBR smart particles have been prepared and used for sensing volatile organic vapors. For different types of surface-modified DBR smart particles, the shift of reflectivity mainly depends on the vapor pressure of analyte even though the surfaces of DBR smart particles are different. However huge difference in the shift of reflectivity depending on the different types of surface-modified DBR smart particles was obtained when the vapor pressures are quite similar which demonstrate a possible sensing application to specify the volatile organic vapors.

Electron Emission Characteristic of Porous Poly-Silicon Emitter as a Oxidation process (산화공정에 따른 Porous Poly-Silicon Emitter의 방출특성 조사)

  • 제병길;배성찬;최시영
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.722-726
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    • 2003
  • 본 논문에서는 Porous poly-silicon cold cathode에 의해 전자를 방출하는 Ballistic electron surface-emitting display(BSD)의 전계방출 특성을 실험했다. BSD는 nanocrystalline을 둘러싼 산화막을 multi-tunneling한 전자에 의해 발광이 되는 mechanism이기 때문에 산화막의 두께를 변수로 두어 특성을 실험했다. 900℃에서 1시간에서 3시간까지 30분 간격으로산화 반응을 진행하였으며, leakage current와 emission current의 비로 효율을 나타내었을 때 1시간 30분 동안 산화 반응을 한 시료가 가장 좋은 특성을 나타내었다.

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Study on Thickness of Porous Silicon Layer According to the Various Anodization Times

  • Jang, Seunghyun
    • Journal of Integrative Natural Science
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    • v.3 no.4
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    • pp.206-209
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    • 2010
  • As the etching time is varied, the change of thickness of the porous silicon layers was successfully investigated. The thickness of the PSi layer as a function of anodization time for a p-type substrate that is etched at a constant current density of 50 $mA/cm^2$ in a 35% hydrofluoric acid solution shows a linear relationship between the etching time and the thickness of the PSi layer.

Preparation and Characterization of Flexible Optical Composite Films Based on Bragg-Structured Interferometer

  • Um, Sungyong;Sohn, Honglae
    • Journal of Integrative Natural Science
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    • v.6 no.4
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    • pp.244-250
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    • 2013
  • Three types of functionalized flexible optical composite films based on Bragg structure porous silicon interferometer have been successfully fabricated by casting a toluene solution of polystyrene onto the free-standing porous silicon. The optical properties of composite films are measured. Surface functionalization of porous silicon is determined by FT-IR measurement. Reflectance and transparence properties of composite films are measured for the possible application of tunable optical filter and indicate that the transmission peak occurred at the identical location where the reflection peak appeared.

Silicon Micro-probe Card Using Porous Silicon Micromachining Technology

  • Kim, Young-Min;Yoon, Ho-Cheol;Lee, Jong-Hyun
    • ETRI Journal
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    • v.27 no.4
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    • pp.433-438
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    • 2005
  • We present a new type of silicon micro-probe card using a three-dimensional probe beam of the cantilever type. It was fabricated using KOH and dry etching, a porous silicon micromachining technique, and an Au electroplating process. The cantilever-type probe beam had a thickness of $5 {\mu}m$, and a width of $50{\mu}$ and a length of $800 {\mu}m$. The probe beam for pad contact was formed by the thermal expansion coefficient difference between the films. The maximum height of the curled probe beam was $170 {\mu}m$, and an annealing process was performed for 20 min at $500^{\circ}C$. The contact resistance of the newly fabricated probe card was less than $2{\Omega}$, and its lifetime was more than 20,000 turns.

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Electrochemical Characteristics on the Preparation of Porous Silicon (다공성 실리콘의 제조서 전기화학적 특성)

  • Kim, D.I.;Lee, C.H.;Jung, D.H.;Kim, C.S.;Shin, D.R.;Lee, C.W.
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1768-1770
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    • 1999
  • Porous silicon were prepared under various anodization condition on n-Si substrates. Chronoamperometric curves of porous silicon depended on potentials, composition and temperature of electrolytes. and intensity of UV irradiation. Anodic current density decreased continuously at low potential $(\leq0.5V)$ but increased at high potentials (>2V vs. Ag QRE). the difference in chronoamperometric curve is due to different activation energy in the processes involved in porous silicon formation.

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