• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.1-5
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• 2023

In the past, display devices have undergone many changes, such as plasma TVs and LCDs, and have continued to develop. Recently, new display technologies, such as Organic Light Emitting Diode displays and Inorganic Light Emitting Diode displays, have been developed. Among them, Micro LED displays have the potential to improve performance more than LCDs and OLEDs, but a lot of effort and time are needed until the mass production technology (transfer and bonding) of Micro LED displays is developed. We have developed a new Micro LED display light source that can be produced using existing transfer and bonding process technologies to enable faster commercialization of Micro LED in the industry. This light source is TFT deposition on LED. TFT deposition on LED has the advantage of being able to produce displays using existing process technology, making early commercialization of display application products possible. In this study, we applied the Active Driving method to verify the performance of TFT deposition on LED as a display to determine its commercialization potential. Additionally, to facilitate faster application of Micro LED in the industry, we applied TFT deposition on LED to Optical Wireless Communication systems, which are widely used in application service areas such as safety/security and sensors, to verify its communication performance. The experimental results confirmed that TFT deposition on LED is not only capable of AM driving but can also be applied to OWC systems.

• Proceedings of the KACD Conference
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• 2001.11a
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• pp.560.1-560
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• 2001

To evaluate the micro-shear bond strength of current adhesive systems to cervical and mid-coronal enamel. Materials and Two commercially available resin adhesives were investigated; a self-etching primer system(Clearfil SE Bond, Kyraray) and a one-bottle adhesive system(Single Bond, 3M) intended for use with the total-etch wet-bonding technique were employed. Two regions of enamel, cervical and mid-coronal regions, were chosen from the buccal surface of extracted molars and were then bonded with each adhesive system and submitted to the micro-shear bond test.(중략)

• Journal of Welding and Joining
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• v.29 no.1
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• pp.52-58
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• 2011

In this paper, the direct bonding process between FPCB and HPCB was studied. By using an ultrasonic horn which is mounted on the ultrasonic bonding machine, it is alternatively possible to bond the gold pads attached on the FPCB and HPCB at room temperature without an adhesive like ACA or NCA. The process condition for obtaining more bonding strength than 0.6 Kgf, which is commercially required, was carried out as 40 kHz of frequency, 0.6 MPa of bonding pressure and 2 second of bonding time. The peel off test was performed for evaluating bonding strength which results in more than 0.8 Kgf.

• Journal of Welding and Joining
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• v.29 no.6
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• pp.49-55
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• 2011

With the development of pre-painted steel sheets for automotive body application, a new joining method is required such as hybrid joining with combination of adhesive bonding and mechanical joining. The objective of this study is to investigate the effect of pre- and post-baking of adhesive bonding on failure mode and strength of hybrid joining of automotive steel sheets. Experiments show that the hybrid joining exhibits better bonding strength and displacement than conventional adhesive joining and mechanical fastening each. Comparison of pre- and post-baked hybrid joining results suggested that baking at $160^{\circ}C$ after mechanical joining was found to have higher joining properties than pre-baking condition. The prebaking condition changed its fracture mode from interfacial to button fracture. The changes in fracture mode with post-baking of hybrid joining was attributed to variation in neck thickness and undercut of joint.

• Journal of the Korean Society of Industry Convergence
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• v.25 no.2_2
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• pp.309-314
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• 2022

The bonding strength [ISO22674] test was conducted by firing a dedicated ceramic powder on the surface of the dental titanium material treated with micro-arc oxidation. In the test group, an average result value of 34.34 MPa was obtained, and in the control group, a result value of 21.53 MPa was obtained. The bonding strength of the test group was higher than that of the control group by 12.81 MPa, resulting in a 37% improvement in durability of the dental artificial tooth ceramic restoration.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1480-1481
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• 2008

In this paper, we present surface treatments for achieving bonds between PMMA and PDMS substrates. Silane primer is used for the formation of hydroxyl group on PMMA surfaces. The formed hydroxyl groups enhance the bonding strength of PDMS-PMMA substrates without channel clogging and structure deformation. The bonding strength on the different surface treatments (include oxygen plasma, 3-APTES, and corona discharge) is evaluated to find optimal bonding condition. The maximum bonding strength at the optimal surface treatment is over 300 kPa. The surface treatment using silane primer can be used to the bonding process of Micro-TAS and Lab-on-a-Chip.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.365-371
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• 2003

We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• Journal of the Korean Society for Precision Engineering
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• v.26 no.12
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• pp.18-22
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.501-502
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• 2006

In-plane type micro piezoelectric micro grippers with pneumatic lines for manipulation biological cells and micro parts were designed, fabricated, and characterized. Micro grippers were fabricated through the final micro-sanding process after wafer level bonding between the etched 4' Si wafer with pneumatic channels and 4' glass wafer. Displacements between two jaws of fabricated micro grippers were linearly increased with applying voltages to piezoelectric actuator. In the case of applying 80 V, the displacement between two jaws was $160{\mu}m$. Using fabricated micro grippers, manipulation tests for biological cell and micro parts with the sizes less than $100{\mu}m$ are in process.