Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
권호 표지

A study on PDMS-PMMA Bonding using Silane Primer

실란 프라이머를 이용한 PDMS-PMMA 접착

  • Kim, Kang-Il (Division of electrical & Computer Engineering, College of Information Technology, Ajou University) ;
  • Park, Sin-Wook (Division of electrical & Computer Engineering, College of Information Technology, Ajou University) ;
  • Yang, Sang-Sik (Division of electrical & Computer Engineering, College of Information Technology, Ajou University)
  • 김강일 (아주대학교 정보통신대학 전자공학부) ;
  • 박신욱 (아주대학교 정보통신대학 전자공학부) ;
  • 양상식 (아주대학교 정보통신대학 전자공학부)
  • Published : 2008.07.16
Download PDF
⟨ Previous Next ⟩

Abstract

In this paper, we present surface treatments for achieving bonds between PMMA and PDMS substrates. Silane primer is used for the formation of hydroxyl group on PMMA surfaces. The formed hydroxyl groups enhance the bonding strength of PDMS-PMMA substrates without channel clogging and structure deformation. The bonding strength on the different surface treatments (include oxygen plasma, 3-APTES, and corona discharge) is evaluated to find optimal bonding condition. The maximum bonding strength at the optimal surface treatment is over 300 kPa. The surface treatment using silane primer can be used to the bonding process of Micro-TAS and Lab-on-a-Chip.

Keywords