Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Technologies of TSV Filling and Solder Bumping for 3D Packaging

TSV 충진 및 3D 패키징 솔더 범핑 기술

  • 유세훈 (한국생산기술연구원 마이크로조이닝센터) ;
  • 고영기 (한국생산기술연구원 마이크로조이닝센터) ;
  • 신의선 (한국생산기술연구원 마이크로조이닝센터) ;
  • 이창우 (한국생산기술연구원 마이크로조이닝센터)
  • Published : 2009.12.01
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References

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