• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2410-2413
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAB, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. In the pre-processor of 3D FEM package, a new 3D mesh generating algorithm can make information on 3D Delaunay tetrahedral mesh elements for analyses of 3D FEM problems. The solver of the 3D FEM package offers three methods for solving the linear algebraic matrix equation, i.e., Gauss-Jordan elimination solver, Band solver, and Skyline solver. The post-processor visualizes the results for 3D FEM problems such as the deformed position and the stress. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Proceedings of the KIEE Conference
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• 2005.07d
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• pp.2897-2899
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAR, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering Problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.98.3-98
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• 1998

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.2
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• pp.139-149
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• 2012

A 3D stacked IC is made by multiple dies (possibly) with heterogeneous process technologies. Therefore, die-to-die variation in 2D chips renders on-package variation (OPV) in a 3D chip. In spite of the different variation effect in 3D chips, generally, 3D die stacking can produce high yield due to the smaller individual die area and the averaging effect of variation on data path. However, 3D clock network can experience unintended huge clock skew due to the different clock propagation routes on multiple stacked dies. In this paper, we analyze the on-package variation effect on 3D clock networks and show the necessity of a post silicon management method such as body biasing technique for the OPV induced 3D clock skew control in 3D stacked IC designs. Then, we present a parametric yield improvement method to mitigate the OPV induced 3D clock skew.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.25-32
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• 2012

Package for artificial satellite is to produce mass production for high package with reliability certification as well as develop SDRAM (synchronous dynamic RAM) module which has such as miniaturization, mass storage, and high reliability in space environment. It requires sophisticated technology with chip stacking or package stacking in order to increase up to 4Gbits or more for mass storage with space technology. To make it better, we should secure suitable processes by doing design, manufacture, and debugging. Pin type PCB substrate was then applied to QFP-Pin type 3D memory package fabrication. These results show that the 3D memory package for artificial satellite scheme is a promising candidate for the realization of our own domestic technologies.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.43-51
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• 2014

In 3-dimensional (3D) integrated package, thermal management is one of the critical issues due to the high heat flux generated by stacked multi-functional chips in miniature packages. In this study, we used numerical simulation method to analyze the thermal behaviors, and investigated the thermal issues of 3D package using TSV (through-silicon-via) technology for mobile application. The 3D integrated package consists of up to 8 TSV memory chips and one logic chip with a interposer which has regularly embedded TSVs. Thermal performances and characteristics of glass and silicon interposers were compared. Thermal characteristics of logic and memory chips are also investigated. The effects of numbers of the stacked chip, size of the interposer and TSV via on the thermal behavior of 3D package were investigated. Numerical analysis of the junction temperature, thermal resistance, and heat flux for 3D TSV package was performed under normal operating and high performance operation conditions, respectively. Based on the simulation results, we proposed an effective integration scheme of the memory and logic chips to minimize the temperature rise of the package. The results will be useful of design optimization and provide a thermal design guideline for reliable and high performance 3D TSV package.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.1A
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• pp.107-112
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• 2004

We propose the optimum TO-can package design in SFF/SFP optical transceiver modules to improve 3dB-bandwidth. The frequency response of TO-38 package is measured and compared to simulation where the 3dB-bandwidth was 3.5GHz. For a higher operating bandwidth (>15GHz), the new optimized physical geometries of TO-can package such as bonding-wire, lead and material was suggested. The optimal result of simulation shows that TO-can package can be used at a higher bit rate optical module of 10Gbps.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.3
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• pp.157-165
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• 2014

To develop a compact vehicle for women, the most important areas are 'behavioral characteristics, life style and driving posture'. Static AM95%ile manikin is used for package guideline. Since women's characteristics and sitting position are different from men, however, the guideline cannot satisfy women drivers. Therefore, the goal of this study is to make the database with dynamic women's driving posture and behavioral characteristics at compact vehicle. Research process will be made as follows. Firstly, through the online/offline survey and statistic analysis, lifestyle and behavioral characteristics (discomfort elements) of women are extracted. Secondly, the author performs scenario test to acquire the discomfort value of driving situation and life style. 3D models of women's manikin and driving posture were created by CATIA HUMAN. The 3D models are used for the purpose of analyzing women's driving posture. Finally, with the ANOVA result and comparison between real driving posture and package guidelines, the author is able to suggest the main issue for women drivers.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.661-662
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• 2010

• Journal of Korea Technology Innovation Society
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• v.3 no.3
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• pp.1-17
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• 2000

This paper shows the institutional limits of technological innovation at the railway package service, that is the limits of introducing the package express system. The railway package service, owned by government and operated by D company, has been suffered severe operating loss since early 1990's. The package express system supported by information network and co-working with inner city quick service might be an solution for the railway package service. But there are several obstacles such as labor union and the rigidities of the Korean National Railroad of government agency.