• 제목/요약/키워드: gate bias voltage

검색결과 254건 처리시간 0.022초

A substrate bias effect on the stability of a-Si:H TFT fabricated on a flexible metal substrate

  • Han, Chang-Wook;Nam, Woo-Jin;Kim, Chang-Dong;Kim, Ki-Yong;Kang, In-Byeong;Chung, In-Jae;Han, Min-Koo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.257-260
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    • 2007
  • Hydrogenated amorphous silicon thin film transistors were fabricated on a flexible metal substrate. A negative voltage at a floated gate can be induced by a negative substrate bias through a capacitor between the substrate and gate electrode. This can recover the shifted-threshold voltage to an original value.

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The gate delay time and the design of VCO using variable MOS capacitance

  • Ryeo, Ji-Hwan
    • 한국정보기술응용학회:학술대회논문집
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    • 한국정보기술응용학회 2005년도 6th 2005 International Conference on Computers, Communications and System
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    • pp.99-102
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    • 2005
  • In the paper, a proposed VCO based on bondwire inductances and nMOS varactors was implemented in a standard $0.25\;{\mu}m$ CMOS process. Using the new drain current model and a propagation delay time model equations, the operation speed of CMOS gate will predict the dependence on the load capacitance and the depth of oxide, threshold voltage, the supply voltage, the channel length. This paper describes the result of simulation which calculated a gate propagation delay time by using new drain current model and a propagation delay time model. At the result, When the reverse bias voltage on the substrate changes from 0 voltage to 3 voltage, the propagation delay time is appeared the delay from 0.8 nsec to 1 nsec. When the reverse voltage is biased on the substrate, for reducing the speed delay time, a supply voltage has to reduce. The $g_m$ value of MOSFET is calculated by using new drain current model.

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CCD Image Sensor with Variable Reset Operation

  • Park, Sang-Sik;Uh, Hyung-Soo
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제3권2호
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    • pp.83-88
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    • 2003
  • The reset operation of a CCD image sensor was improved using charge trapping of a MOS structure to realize a loe voltage driving. A DC bias generating circuit was added to the reset structure which sets reference voltage and holds the signal charge to be detected. The generated DC bias is added to the reset pulse to give an optimized voltage margin to the reset operation, and is controlled by adjustment of the threshold voltage of a MOS transistor in the circuit. By the pulse-type stress voltage applied to the gate, the electrons and holes were injected to the gate dielectrics, and the threshold voltage could be adjusted ranging from 0.2V to 5.5V, which is suitable for controlling the incomplete reset operation due to the process variation. The charges trapped in the silicon nitride lead to the positive and negative shift of the threshold voltage, and this phenomenon is explained by Poole-Frenkel conduction and Fowler-Nordheim conduction. A CCD image sensor with $492(H){\;}{\times}{\;}510(V)$ pixels adopting this structure showed complete reset operation with the driving voltage of 3.0V. The resolution chart taken with the image sensor shows no image flow to the illumination of 30 lux, even in the driving voltage of 3.0V.

도식방법에 의한 MOSFET 단안정 멀티바이브레이터의 설계 (Design of a MOSFET Monostable Multivibrator by Graphical Method)

  • 심수보
    • 대한전자공학회논문지
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    • 제13권1호
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    • pp.11-15
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    • 1976
  • 게이트 전류가 흐르지 않는 MOSFET를 사용한 단안정 멀티바치브레이터는 도전시에도 게이트 전압이 일정하게 유지되지 않기 때문에 이 전압을 기준으로 한 회로해석이나 설계는 매우 어려워서, 비교적 간단히 해결할 수있는 도식방법을 소개하였다. 즉 각FET의 전압이득곡선을 구하고 이 유선의 기본적인 성질과 국로 설계에 이용하는 방법들에 대해서 논하였다. In a MOSFET multivibrator, the gate do not hold into a constant clamp voltage during a conduction period. The analysis of the operation and the 43sign of a MOSFET multivibrator circuit are much more discult than that using a bipolar transistor and a electron tube because of above reason. And therefore, in the designing procedures of the MOSFET monostable multivibrator of this paper, a graphical method is adopted in order to analyze and design easily. The voltage gain curves of the both FETs are drawn using a parameter the voltage Vc across the coupling condenser, and the curves are utilized to investigate the voltages of the drains and the gates and determine the gate bias voltage. The diagram gives also important informations for the design of the multivibrator.

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Electrical stabilities of half-Corbino thin-film transistors with different gate geometries

  • Jung, Hyun-Seung;Choi, Keun-Yeong;Lee, Ho-Jin
    • Journal of Information Display
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    • 제13권1호
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    • pp.51-54
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    • 2012
  • In this study, the bias-temperature stress and current-temperature stress induced by the electrical stabilities of half-Corbino hydrogenated-amorphous-silicon (a-Si:H) thin-film transistors (TFTs) with different gate electrode geometries fabricated on the same substrate were examined. The influence of the gate pattern on the threshold voltage shift of the half-Corbino a-Si:H TFTs is discussed in this paper. The results indicate that the half-Corbino a-Si:H TFT with a patterned gate electrode has enhanced power efficiency and improved aperture ratio when compared with the half-Corbino a-Si:H TFT with an unpatterned gate electrode and the same source/drain electrode geometry.

Dual Gate-Controlled SOI Single Electron Transistor: Fabrication and Coulomb-Blockade

  • Lee, Byung T.;Park, Jung B.
    • Journal of Electrical Engineering and information Science
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    • 제2권6호
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    • pp.208-211
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    • 1997
  • We have fabricated a single-electron-tunneling(SET) transistor with a dual gate geometry based on the SOI structure prepared by SIMOX wafers. The split-gate is the lower-gate is the lower-level gate and located ∼ 100${\AA}$ right above the inversion layer 2DEG active channel, which yields strong carrier confinement with fully controllable tunneling potential barrier. The transistor is operating at low temperatures and exhibits the single electron tunneling behavior through nano-size quantum dot. The Coulomb-Blockade oscillation is demonstrated at 15mK and its periodicity of 16.4mV in the upper-gate voltage corresponds to the formation of quantum dots with a capacity of 9.7aF. For non-linear transport regime, Coulomb-staircases are clearly observed up to four current steps in the range of 100mV drain-source bias. The I-V characteristics near the zero-bias displays typical Coulomb-gap due to one-electron charging effect.

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Anomalous Phenomena on Subthreshold Characteristics of SOI MOSFET Back Gate Voltage

  • Lee, Seung-Min;Lee, Mike-Myung-Ok
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 1998년도 추계종합학술대회 논문집
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    • pp.553-556
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    • 1998
  • The 1-D numerical model and its extraction methodology are suggested and these simulation results for the S-swing as a function of back-gate voltage are well matched with the measured. S-swing characteristics are analyzed using PD-SOI devices with enough deeper regions up to substrates. The PD-SOI device doesn't have to be short channel to see the anomalous subthreshold phenomena based on the back gate bias. This results recommend to operate better SOI device performances by controlling the back gate voltages. So SOI performances will be much optimistic with proper control of the back-gate voltage for the already- proven- high- performance (APHP) SOI VLSIs.

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Electrical Characteristics of Triple-Gate RSO Power MOSFET (TGRMOS) with Various Gate Configurations and Bias Conditions

  • Na, Kyoung Il;Won, Jongil;Koo, Jin-Gun;Kim, Sang Gi;Kim, Jongdae;Yang, Yil Suk;Lee, Jin Ho
    • ETRI Journal
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    • 제35권3호
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    • pp.425-430
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    • 2013
  • In this paper, we propose a triple-gate trench power MOSFET (TGRMOS) that is made through a modified RESURF stepped oxide (RSO) process, that is, the nitride_RSO process. The electrical characteristics of TGRMOSs, such as the blocking voltage ($BV_{DS}$) and on-state current ($I_{D,MAX}$), are strongly dependent on the gate configuration and its bias condition. In the nitride_RSO process, the thick single insulation layer ($SiO_2$) of a conventional RSO power MOSFET is changed to a multilayered insulator ($SiO_2/SiN_x/TEOS$). The inserted $SiN_x$ layer can create the selective etching of the TEOS layer between the gate oxide and poly-Si layers. After additional oxidation and the poly-Si filling processes, the gates are automatically separated into three parts. Moreover, to confirm the variation in the electrical properties of TGRMOSs, such as $BV_{DS}$ and $I_{D,MAX}$, simulation studies are performed on the function of the gate configurations and their bias conditions. $BV_{DS}$ and $I_{D,MAX}$ are controlled from 87 V to 152 V and from 0.14 mA to 0.24 mA at a 15-V gate voltage. This $I_{D,MAX}$ variation indicates the specific on-resistance modulation.

비대칭 이중게이트 MOSFET의 채널도핑에 따른 문턱전압이하 스윙 분석 (Analysis of Subthreshold Swing for Channel Doping of Asymmetric Double Gate MOSFET)

  • 정학기
    • 한국정보통신학회논문지
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    • 제18권3호
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    • pp.651-656
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    • 2014
  • 본 연구에서는 비대칭 이중게이트 MOSFET의 채널도핑 변화에 따른 문턱전압이하 스윙의 변화를 분석하였다. 문턱전압이하 스윙은 문턱전압이하 영역에서 발생하는 차단전류의 감소정도를 나타내는 요소로서 디지털회로 적용에 매우 중요한 역할을 한다. 비대칭 이중게이트 MOSFET의 문턱전압이하 스윙을 분석하기 위하여 포아송방정식을 이용하였다. 비대칭 이중게이트 MOSFET는 대칭 이중게이트 MOSFET와 달리 상하단 게이트의 산화막 두께 및 인가전압을 다르게 제작할 수 있다. 본 연구에서는 비대칭 이중게이트 MOSFET의 채널 내 농도변화 및 게이트 산화막 두께 그리고 인가전압 등이 문턱전압이하 스윙에 미치는 영향을 관찰하였다. 특히 포아송방정식을 풀 때 도핑분포함수로 가우스분포함수를 이용하였으며 가우스분포함수의 파라미터인 이온주입범위 및 분포편차에 대한 문턱전압이하 스윙의 변화를 관찰하였다. 분석결과, 문턱전압이하 스윙은 도핑농도 및 분포함수에 따라 크게 변화하였으며 게이트 산화막 두께 및 인가전압에 크게 영향을 받는 것을 관찰할 수 있었다.

Macro Modeling and Parameter Extraction of Lateral Double Diffused Metal Oxide Semiconductor Transistor

  • Kim, Sang-Yong;Kim, Il-Soo
    • Transactions on Electrical and Electronic Materials
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    • 제12권1호
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    • pp.7-10
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    • 2011
  • High voltage (HV) integrated circuits are viable alternatives to discrete circuits in a wide variety of applications. A HV device generally used in these circuits is a lateral double diffused metal oxide semiconductor (LDMOS) transistor. Attempts to model LDMOS devices are complicated by the existence of the lightly doped drain and by the extension of the poly-silicon and the gate oxide. Several physically based investigations of the bias-dependent drift resistance of HV devices have been conducted, but a complete physical model has not been reported. We propose a new technique to model HV devices using both the BSIM3 SPICE model and a bias dependent resistor model (sub-circuit macro model).