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Electrical Characteristics of Triple-Gate RSO Power MOSFET (TGRMOS) with Various Gate Configurations and Bias Conditions

  • Na, Kyoung Il (Components & Materials Research Laboratory, ETRI) ;
  • Won, Jongil (Components & Materials Research Laboratory, ETRI) ;
  • Koo, Jin-Gun (Components & Materials Research Laboratory, ETRI) ;
  • Kim, Sang Gi (Components & Materials Research Laboratory, ETRI) ;
  • Kim, Jongdae (Strategy & Planning Division, ETRI) ;
  • Yang, Yil Suk (Components & Materials Research Laboratory, ETRI) ;
  • Lee, Jin Ho (Components & Materials Research Laboratory, ETRI)
  • Received : 2012.04.20
  • Accepted : 2012.11.26
  • Published : 2013.06.01

Abstract

In this paper, we propose a triple-gate trench power MOSFET (TGRMOS) that is made through a modified RESURF stepped oxide (RSO) process, that is, the nitride_RSO process. The electrical characteristics of TGRMOSs, such as the blocking voltage ($BV_{DS}$) and on-state current ($I_{D,MAX}$), are strongly dependent on the gate configuration and its bias condition. In the nitride_RSO process, the thick single insulation layer ($SiO_2$) of a conventional RSO power MOSFET is changed to a multilayered insulator ($SiO_2/SiN_x/TEOS$). The inserted $SiN_x$ layer can create the selective etching of the TEOS layer between the gate oxide and poly-Si layers. After additional oxidation and the poly-Si filling processes, the gates are automatically separated into three parts. Moreover, to confirm the variation in the electrical properties of TGRMOSs, such as $BV_{DS}$ and $I_{D,MAX}$, simulation studies are performed on the function of the gate configurations and their bias conditions. $BV_{DS}$ and $I_{D,MAX}$ are controlled from 87 V to 152 V and from 0.14 mA to 0.24 mA at a 15-V gate voltage. This $I_{D,MAX}$ variation indicates the specific on-resistance modulation.

Keywords

References

  1. W. Saito et al., "High Breakdown Voltage (>1000 V) Semi- Superjunction MOSFETs Using 600-V Class Superjunction MOSFET Process," IEEE Trans. Electron Devices, vol. 52, no. 10, Oct. 2005, pp. 2317-2322. https://doi.org/10.1109/TED.2005.856804
  2. Y. Miura, H. Ninomiya, and K. Kobayashi, "High Performance Superjunction UMOSFETs with Split P-Columns Fabricated by Multi-Ion-Implantations," Proc. ISPSD, May 2005, pp. 1-4.
  3. Y.H. Lho and Y.S. Yang, "Design of 100-V Super-Junction Trench Power MOSFET with Low On-Resistance," ETRI J., vol. 34, no. 1, Feb. 2012, pp. 134-137. https://doi.org/10.4218/etrij.12.0211.0251
  4. S. Yamauchi et al., "Fabrication of High Aspect Ratio Doping Region by Using Trench Filling of Epitaxial Si Growth," Proc. ISPSD, June 2001, pp. 363-366.
  5. T. Minato et al., "Which is Cooler, Trench or Muiti-Epitaxy? Cutting Edge Approach for the Silicon Limit by the Super Trench Power MOS-FET (STM)," Proc. ISPSD, May 2000, pp. 73-76.
  6. G.E.J. Koops et al., "Resurf Stepped Oxide (RSO) MOSFET for 85V Having a Record Low Specific On-Resistance," Proc. ISPSD, May 2004, pp. 185-188.
  7. W.S. Son et al., "A New Structure SOI LDMOSFET Structure with a Trench in the Drift Region for a PDP Scan Driver IC," ETRI J., vol. 26, no. 1, Feb. 2004, pp. 7-12. https://doi.org/10.4218/etrij.04.0103.0104
  8. P. Moens et al., "XtreMOS: The First Integrated Power Transistor Breaking the Silicon Limit," Proc. IEDM, Dec. 2006, pp. 1-4.
  9. Q. Jiang, M. Wang, and X. Chen, "A High-Speed Deep-Trench MOSFET with a Self-Biased Split Gate," IEEE Trans. Electron Devices, vol. 57, no. 8, Aug. 2010, pp. 1972-1977. https://doi.org/10.1109/TED.2010.2051247
  10. K. Vershinin et al., "A New Method to Improve Tradeoff Performance for Advanced Power MOSFETs," IEEE Electron Device Lett., vol. 30, no. 4, Apr. 2009, pp. 416-418. https://doi.org/10.1109/LED.2009.2014473
  11. K.I. Na et al., "Simulation and Fabrication Studies of Semisuperjunction Trench Power MOSFETs by RSO Process with Silicon Nitride Layer," ETRI J., vol. 34, no. 6, Dec. 2012, pp. 962-965. https://doi.org/10.4218/etrij.12.0212.0127

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